ZA913434B - Resins which may be cured to form polymeric resins which are difficultly inflammable and resistant to high temperatures,methods for preparing and use of said polymeric resins - Google Patents

Resins which may be cured to form polymeric resins which are difficultly inflammable and resistant to high temperatures,methods for preparing and use of said polymeric resins

Info

Publication number
ZA913434B
ZA913434B ZA913434A ZA913434A ZA913434B ZA 913434 B ZA913434 B ZA 913434B ZA 913434 A ZA913434 A ZA 913434A ZA 913434 A ZA913434 A ZA 913434A ZA 913434 B ZA913434 B ZA 913434B
Authority
ZA
South Africa
Prior art keywords
resins
polymeric resins
cured
resistant
preparing
Prior art date
Application number
ZA913434A
Inventor
Herbert Schreiber
Schreiber Herbert
Guenter Burkart
Burkart Guenter
Bruno Knaus
Knaus Bruno
Original Assignee
Gurit Essex Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gurit Essex Ag filed Critical Gurit Essex Ag
Publication of ZA913434B publication Critical patent/ZA913434B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/357—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
ZA913434A 1990-05-21 1991-05-07 Resins which may be cured to form polymeric resins which are difficultly inflammable and resistant to high temperatures,methods for preparing and use of said polymeric resins ZA913434B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4016296A DE4016296C1 (en) 1990-05-21 1990-05-21 Flame retardant thermosetting adhesive for metals etc. - comprises oxa:aza:tetralin, halogenated epoxy] resins and opt. additives

Publications (1)

Publication Number Publication Date
ZA913434B true ZA913434B (en) 1992-02-26

Family

ID=6406865

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA913434A ZA913434B (en) 1990-05-21 1991-05-07 Resins which may be cured to form polymeric resins which are difficultly inflammable and resistant to high temperatures,methods for preparing and use of said polymeric resins

Country Status (8)

Country Link
EP (1) EP0458739A3 (en)
JP (1) JP3203385B2 (en)
KR (1) KR0166377B1 (en)
AU (1) AU636226B2 (en)
CA (1) CA2042840C (en)
CS (1) CS145891A2 (en)
DE (1) DE4016296C1 (en)
ZA (1) ZA913434B (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0493310A1 (en) * 1990-12-21 1992-07-01 Gurit-Essex AG Curable resin compositions having flame resistant properties in the cured state and use thereof
CN1058738C (en) * 1994-07-29 2000-11-22 四川联合大学 Open-loop polymerized phenolic resin and relevant composite fibre-reinforced material
JP3543866B2 (en) * 1995-02-28 2004-07-21 日立化成工業株式会社 Friction material and method of manufacturing the same
JPH09157496A (en) * 1995-12-06 1997-06-17 Hitachi Chem Co Ltd Thermosetting resin composition, cured product therefrom, prepreg and metallic foil-laminated plate using the same
JP3487083B2 (en) * 1996-02-09 2004-01-13 日立化成工業株式会社 Thermosetting resin composition and cured product thereof
DE10309617A1 (en) * 2003-03-05 2004-09-23 Siemens Ag Workpiece carrier for holding workpieces
US7157509B2 (en) 2003-06-27 2007-01-02 Henkel Corporation Curable compositions
US20050042961A1 (en) 2003-08-18 2005-02-24 Henkel Loctite Corporation Curable compositions for advanced processes, and products made therefrom
JP2004156045A (en) * 2003-12-22 2004-06-03 Hitachi Chem Co Ltd Friction material
DE102004046745B4 (en) * 2004-09-27 2008-04-24 Atotech Deutschland Gmbh Process for the solvent-free production of a fiber-reinforced, resin-coated film and use thereof
DE102004046744B4 (en) 2004-09-27 2007-05-24 Atotech Deutschland Gmbh Process for transferring powders and powder coatings to substrates and use for the production of printed circuit boards and solar cells
TWI374137B (en) 2004-09-28 2012-10-11 Huntsman Adv Mat Switzerland Organic compounds
US7649060B2 (en) 2005-12-02 2010-01-19 Henkel Corporation Curable compositions
DE102006017891A1 (en) * 2006-04-13 2007-10-25 Hexion Specialty Chemicals Gmbh resin dispersion
EP2070984A1 (en) 2007-12-12 2009-06-17 Hexion Specialty Chemicals Research Belgium S.A. Epoxy-phenolic resins co-dispersions
KR101591537B1 (en) 2008-02-21 2016-02-03 헌츠만 어드밴스드 머티리얼스 아메리카스 엘엘씨 Halogen-free Benzoxazine Based Curable Compositions for High Tg Applications

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES414518A1 (en) * 1972-05-09 1976-02-01 Sued West Chemie Gmbh Procedure for the preparation of synthetic materials. (Machine-translation by Google Translate, not legally binding)
CH579113A5 (en) * 1972-05-09 1976-08-31 Micafil Ag
DE3433851C2 (en) * 1984-09-14 1987-01-08 Gurit-Essex Ag, Freienbach Chemically curable resins from compounds containing 1-oxa-3-aza-tetralin groups and cycloaliphatic epoxy resins, processes for their preparation and use of such resins
EP0356379B1 (en) * 1988-07-18 1996-03-20 Gurit-Essex AG Resins curable into fire-retardant and heat-resistant plastic materials, and method for their preparation

Also Published As

Publication number Publication date
EP0458739A2 (en) 1991-11-27
JP3203385B2 (en) 2001-08-27
AU7721391A (en) 1991-11-21
JPH04227922A (en) 1992-08-18
KR0166377B1 (en) 1999-03-20
DE4016296C1 (en) 1991-09-05
AU636226B2 (en) 1993-04-22
KR910020104A (en) 1991-12-19
CA2042840C (en) 1996-11-26
CS145891A2 (en) 1991-12-17
EP0458739A3 (en) 1993-09-01
CA2042840A1 (en) 1991-11-22

Similar Documents

Publication Publication Date Title
ZA913434B (en) Resins which may be cured to form polymeric resins which are difficultly inflammable and resistant to high temperatures,methods for preparing and use of said polymeric resins
GB2045789B (en) Moulding process using curable silicone release compositions and curable silicone release compositions
DE3174273D1 (en) Curable resin composition and its use for preparing coatings
IL100117A0 (en) Amino-crosslinkable resin compositions,solid crosslinked polymer compositions prepared therefrom and processes for the preparation thereof
DE3061265D1 (en) Fibre-reinforced polyamide moulding compositions
EP0239108A3 (en) Mold release composition
EP0486918A3 (en) Advanced epoxy compositions, curable compositions and cured products
ZA825664B (en) Finishing procedure for armored resin products,such as,helmets and products fabricated in accordance with the procedure
AR243792A1 (en) A compound consisting of elongated granules for injection moulding, the substance that contains it and a procedure for preparing it.
GB2117386B (en) Thermosetting resin composition for injection molding and article formed by using the composition
EP0475023A3 (en) Curable mixtures for the preparation of epoxy-networks, method for their preparation and their application
EP0419977A3 (en) Process for the preparation of pigmented, curable polyester moulding compositions
EP0469928A3 (en) Curable silicone composition and its cured product
DE3067898D1 (en) Heat-resistant thermosetting resin composition
DE3278636D1 (en) Heat-insulating moulding and process for preparing the same
EP0270020A3 (en) Resin cure
EP0285160A3 (en) Fluorine-containing aromatic compound, process for preparing the same and use thereof
DE2965447D1 (en) Polyamide resins and process for preparing the same
EP0477724A3 (en) Epoxy resin, epoxy resin composition and cured product thereof
Johnston PARABOLIC INTERPRETATIONS ATTRIBUTED TO TANNAIM.
EP0239812A3 (en) Method for preparing cured organopolysiloxane compositions
EP0354378A3 (en) Curable resin and process for preparing the same
EP0290131A3 (en) Acrylic rubber, acrylic rubber composition and cured rubber article thereof
GB2212507B (en) Curable resin and resin composition curable at low temperature
ZA895222B (en) Resins which may be cured to form polymeric resins which are difficultly inflammable and resistant to high temperatures,and process for preparing them