ZA913434B - Resins which may be cured to form polymeric resins which are difficultly inflammable and resistant to high temperatures,methods for preparing and use of said polymeric resins - Google Patents

Resins which may be cured to form polymeric resins which are difficultly inflammable and resistant to high temperatures,methods for preparing and use of said polymeric resins

Info

Publication number
ZA913434B
ZA913434B ZA913434A ZA913434A ZA913434B ZA 913434 B ZA913434 B ZA 913434B ZA 913434 A ZA913434 A ZA 913434A ZA 913434 A ZA913434 A ZA 913434A ZA 913434 B ZA913434 B ZA 913434B
Authority
ZA
South Africa
Prior art keywords
resins
polymeric resins
cured
resistant
preparing
Prior art date
Application number
ZA913434A
Other languages
English (en)
Inventor
Herbert Schreiber
Schreiber Herbert
Guenter Burkart
Burkart Guenter
Bruno Knaus
Knaus Bruno
Original Assignee
Gurit Essex Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gurit Essex Ag filed Critical Gurit Essex Ag
Publication of ZA913434B publication Critical patent/ZA913434B/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/357—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
ZA913434A 1990-05-21 1991-05-07 Resins which may be cured to form polymeric resins which are difficultly inflammable and resistant to high temperatures,methods for preparing and use of said polymeric resins ZA913434B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4016296A DE4016296C1 (en) 1990-05-21 1990-05-21 Flame retardant thermosetting adhesive for metals etc. - comprises oxa:aza:tetralin, halogenated epoxy] resins and opt. additives

Publications (1)

Publication Number Publication Date
ZA913434B true ZA913434B (en) 1992-02-26

Family

ID=6406865

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA913434A ZA913434B (en) 1990-05-21 1991-05-07 Resins which may be cured to form polymeric resins which are difficultly inflammable and resistant to high temperatures,methods for preparing and use of said polymeric resins

Country Status (8)

Country Link
EP (1) EP0458739A3 (xx)
JP (1) JP3203385B2 (xx)
KR (1) KR0166377B1 (xx)
AU (1) AU636226B2 (xx)
CA (1) CA2042840C (xx)
CS (1) CS145891A2 (xx)
DE (1) DE4016296C1 (xx)
ZA (1) ZA913434B (xx)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0493310A1 (de) * 1990-12-21 1992-07-01 Gurit-Essex AG Zu schwerentflammbaren Kunststoffen härtbare Harzmischungen und deren Verwendung
CN1058738C (zh) * 1994-07-29 2000-11-22 四川联合大学 开环聚合酚醛树脂与纤维增强复合材料
JP3543866B2 (ja) * 1995-02-28 2004-07-21 日立化成工業株式会社 摩擦材及びその製造方法
JPH09157496A (ja) * 1995-12-06 1997-06-17 Hitachi Chem Co Ltd 熱硬化性樹脂組成物、その硬化物並びにこの樹脂組成物を用いたプリプレグ及び金属箔張積層板
JP3487083B2 (ja) * 1996-02-09 2004-01-13 日立化成工業株式会社 熱硬化性樹脂組成物及びその硬化物
DE10309617A1 (de) * 2003-03-05 2004-09-23 Siemens Ag Werkstückträger zur Aufnahme von Werkstücken
US7157509B2 (en) 2003-06-27 2007-01-02 Henkel Corporation Curable compositions
US20050042961A1 (en) 2003-08-18 2005-02-24 Henkel Loctite Corporation Curable compositions for advanced processes, and products made therefrom
JP2004156045A (ja) * 2003-12-22 2004-06-03 Hitachi Chem Co Ltd 摩擦材
DE102004046744B4 (de) 2004-09-27 2007-05-24 Atotech Deutschland Gmbh Verfahren zur Übertragung von Pulvern und Pulverlacken auf Substrate und Verwendung zur Herstellung von Leiterplatten und Solarzellen
DE102004046745B4 (de) * 2004-09-27 2008-04-24 Atotech Deutschland Gmbh Verfahren zur lösungsmittelfreien Herstellung einer faserverstärkten, mit Harz beschichteten Folie und Verwendung derselben
TWI374137B (en) * 2004-09-28 2012-10-11 Huntsman Adv Mat Switzerland Organic compounds
US7649060B2 (en) 2005-12-02 2010-01-19 Henkel Corporation Curable compositions
DE102006017891A1 (de) 2006-04-13 2007-10-25 Hexion Specialty Chemicals Gmbh Harzdispersion
EP2070984A1 (en) 2007-12-12 2009-06-17 Hexion Specialty Chemicals Research Belgium S.A. Epoxy-phenolic resins co-dispersions
US8975318B2 (en) 2008-02-21 2015-03-10 Huntsman Advanced Materials Americas Llc Halogen-free benzoxazine based curable compositions for high TG applications

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT984956B (it) * 1972-05-09 1974-11-20 Sued West Chemie Gmbh Prodotti polimerizzabili o induribili
CH579113A5 (xx) * 1972-05-09 1976-08-31 Micafil Ag
DE3433851C2 (de) * 1984-09-14 1987-01-08 Gurit-Essex Ag, Freienbach Chemisch härtbare Harze aus 1-Oxa-3-aza-tetralin-Gruppen enthaltenden Verbindungen und cycloaliphatischen Epoxid-harzen, Verfahren zu deren Herstellung sowie Verwendung solcher Harze
DE58909626D1 (de) * 1988-07-18 1996-04-25 Gurit Essex Ag Zu schwerentflammbaren und hochtemperaturbeständigen Kunststoffen härtbare Harze und Verfahren zu deren Herstellung

Also Published As

Publication number Publication date
JP3203385B2 (ja) 2001-08-27
EP0458739A3 (en) 1993-09-01
KR0166377B1 (ko) 1999-03-20
KR910020104A (ko) 1991-12-19
EP0458739A2 (de) 1991-11-27
CS145891A2 (en) 1991-12-17
AU7721391A (en) 1991-11-21
CA2042840C (en) 1996-11-26
CA2042840A1 (en) 1991-11-22
DE4016296C1 (en) 1991-09-05
AU636226B2 (en) 1993-04-22
JPH04227922A (ja) 1992-08-18

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