CA2016028A1 - Procede de formation de pellicules d'oxyde supraconductrice - Google Patents
Procede de formation de pellicules d'oxyde supraconductriceInfo
- Publication number
- CA2016028A1 CA2016028A1 CA2016028A CA2016028A CA2016028A1 CA 2016028 A1 CA2016028 A1 CA 2016028A1 CA 2016028 A CA2016028 A CA 2016028A CA 2016028 A CA2016028 A CA 2016028A CA 2016028 A1 CA2016028 A1 CA 2016028A1
- Authority
- CA
- Canada
- Prior art keywords
- oxide superconducting
- superconducting film
- target
- substrate
- scattered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 3
- 229910052760 oxygen Inorganic materials 0.000 abstract 3
- 239000001301 oxygen Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 3
- 238000000137 annealing Methods 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5806—Thermal treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/087—Oxides of copper or solid solutions thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5846—Reactive treatment
- C23C14/5853—Oxidation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
- H10N60/0521—Processes for depositing or forming copper oxide superconductor layers by pulsed laser deposition, e.g. laser sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Thermal Sciences (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
- Physical Vapour Deposition (AREA)
- Oxygen, Ozone, And Oxides In General (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1126847A JP2853161B2 (ja) | 1989-05-19 | 1989-05-19 | 酸化物超電導膜の製造方法 |
JP1-126847 | 1989-05-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2016028A1 true CA2016028A1 (fr) | 1990-11-19 |
CA2016028C CA2016028C (fr) | 1999-07-20 |
Family
ID=14945335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002016028A Expired - Fee Related CA2016028C (fr) | 1989-05-19 | 1990-05-03 | Procede de formation de pellicules d'oxyde supraconductrice |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0398164B1 (fr) |
JP (1) | JP2853161B2 (fr) |
CA (1) | CA2016028C (fr) |
DE (1) | DE69004148T2 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2045267C (fr) * | 1990-06-21 | 1998-12-08 | Hideo Itozaki | Processus de fabrication de minces pellicules supraconductrices et appareil connexe |
WO2001055472A2 (fr) * | 2000-01-28 | 2001-08-02 | Oxxel Oxide Electronics Technology, Inc. | Procede et appareil permettant de deposer in situ une couche mince epitaxiale de supraconducteurs a une temperature elevee et d'autres oxydes complexes a une pression elevee |
JP4626134B2 (ja) * | 2003-09-17 | 2011-02-02 | 住友電気工業株式会社 | 超電導体およびその製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4420385A (en) * | 1983-04-15 | 1983-12-13 | Gryphon Products | Apparatus and process for sputter deposition of reacted thin films |
GB8417040D0 (en) * | 1984-07-04 | 1984-08-08 | Salford University Of | Modifying properties of material |
JPS6412427A (en) * | 1987-07-06 | 1989-01-17 | Showa Electric Wire & Cable Co | Manufacture of ceramic-based superconducting wire |
JPS6472418A (en) * | 1987-09-11 | 1989-03-17 | Mitsubishi Electric Corp | Manufacture of oxide superconducting thin film |
JPS6472427A (en) * | 1987-09-14 | 1989-03-17 | Toshiba Corp | Manufacture and device of superconducting thin film |
-
1989
- 1989-05-19 JP JP1126847A patent/JP2853161B2/ja not_active Expired - Fee Related
-
1990
- 1990-05-03 CA CA002016028A patent/CA2016028C/fr not_active Expired - Fee Related
- 1990-05-10 DE DE90108847T patent/DE69004148T2/de not_active Expired - Fee Related
- 1990-05-10 EP EP90108847A patent/EP0398164B1/fr not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH02307807A (ja) | 1990-12-21 |
EP0398164B1 (fr) | 1993-10-27 |
DE69004148D1 (de) | 1993-12-02 |
EP0398164A2 (fr) | 1990-11-22 |
EP0398164A3 (fr) | 1991-03-27 |
DE69004148T2 (de) | 1994-04-28 |
CA2016028C (fr) | 1999-07-20 |
JP2853161B2 (ja) | 1999-02-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |