CA2000338A1 - Lead frame for a multiplicity of terminals - Google Patents

Lead frame for a multiplicity of terminals

Info

Publication number
CA2000338A1
CA2000338A1 CA002000338A CA2000338A CA2000338A1 CA 2000338 A1 CA2000338 A1 CA 2000338A1 CA 002000338 A CA002000338 A CA 002000338A CA 2000338 A CA2000338 A CA 2000338A CA 2000338 A1 CA2000338 A1 CA 2000338A1
Authority
CA
Canada
Prior art keywords
conductors
terminals
spacing
lead
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002000338A
Other languages
English (en)
French (fr)
Inventor
Hugo Westerkamp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LSI Logic Products GmbH
Original Assignee
LSI Logic Products GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LSI Logic Products GmbH filed Critical LSI Logic Products GmbH
Publication of CA2000338A1 publication Critical patent/CA2000338A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H10W70/421—
    • H10W70/04—
    • H10W72/5449—
    • H10W72/932—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)
  • Wire Bonding (AREA)
CA002000338A 1988-10-10 1989-10-10 Lead frame for a multiplicity of terminals Abandoned CA2000338A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP3834361.4 1988-10-10
DE3834361A DE3834361A1 (de) 1988-10-10 1988-10-10 Anschlussrahmen fuer eine vielzahl von anschluessen

Publications (1)

Publication Number Publication Date
CA2000338A1 true CA2000338A1 (en) 1990-04-10

Family

ID=6364724

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002000338A Abandoned CA2000338A1 (en) 1988-10-10 1989-10-10 Lead frame for a multiplicity of terminals

Country Status (4)

Country Link
EP (1) EP0363679A3 (enExample)
JP (1) JPH02247089A (enExample)
CA (1) CA2000338A1 (enExample)
DE (1) DE3834361A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4101790C1 (en) * 1991-01-18 1992-07-09 Technisch-Wissenschaftliche-Gesellschaft Thiede Und Partner Mbh, O-1530 Teltow, De Chip-support arrangement prodn. - in tape form, in dual-in-line format by film-bond technology
JPH05114685A (ja) * 1991-10-23 1993-05-07 Mitsubishi Electric Corp 半導体装置
JP3083321B2 (ja) * 1992-11-24 2000-09-04 日立建機株式会社 リードフレームの加工方法
US5580466A (en) * 1993-04-14 1996-12-03 Hitachi Construction Machinery Co., Ltd. Metal plate processing method, lead frame processing method, lead frame, semiconductor device manufacturing method, and semiconductor device
US5632083A (en) * 1993-08-05 1997-05-27 Hitachi Construction Machinery Co., Ltd. Lead frame fabricating method and lead frame fabricating apparatus
EP0644585A3 (en) * 1993-09-20 1995-10-11 Sumitomo Electric Industries Lead frame and manufacturing process.
DE102023202636A1 (de) 2023-03-23 2024-09-26 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines strukturierten Leistungsmodul-Schaltungsträgers

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3110235A1 (de) * 1981-03-17 1982-10-21 Trumpf GmbH & Co, 7257 Ditzingen "verfahren und vorrichtung zum brennschneiden mittels eines laserstrahls"
JPS58169940A (ja) * 1982-03-30 1983-10-06 Fujitsu Ltd 半導体装置の製造方法
US4529958A (en) * 1983-05-02 1985-07-16 Dale Electronics, Inc. Electrical resistor
JPS6080260A (ja) * 1983-10-07 1985-05-08 Hitachi Micro Comput Eng Ltd 半導体装置用リ−ドフレ−ムとその製造方法
JPS61216354A (ja) * 1985-03-20 1986-09-26 Shinko Electric Ind Co Ltd リ−ドフレ−ムの製造方法
GB2178894B (en) * 1985-08-06 1988-07-27 Gen Electric Co Plc Preparation of fragile devices
DE3608410A1 (de) * 1986-03-13 1987-09-17 Siemens Ag Herstellung von feinstrukturen fuer die halbleiterkontaktierung
US4774635A (en) * 1986-05-27 1988-09-27 American Telephone And Telegraph Company At&T Bell Laboratories Semiconductor package with high density I/O lead connection
FR2624652B1 (fr) * 1987-12-14 1990-08-31 Sgs Thomson Microelectronics Procede de mise en place sur un support, d'un composant electronique, muni de ses contacts
JPH0777249B2 (ja) * 1988-09-21 1995-08-16 日本電気株式会社 リードフレームの製造方法

Also Published As

Publication number Publication date
EP0363679A2 (de) 1990-04-18
DE3834361C2 (enExample) 1990-08-16
EP0363679A3 (de) 1990-07-18
JPH02247089A (ja) 1990-10-02
DE3834361A1 (de) 1990-04-12

Similar Documents

Publication Publication Date Title
US5854741A (en) Unit printed circuit board carrier frame for ball grid array semiconductor packages and method for fabricating ball grid array semiconductor packages using the same
US6677219B2 (en) Method of forming a ball grid array package
US5600178A (en) Semiconductor package having interdigitated leads
US4158745A (en) Lead frame having integral terminal tabs
US5177863A (en) Method of forming integrated leadouts for a chip carrier
US5849608A (en) Semiconductor chip package
US5541447A (en) Lead frame
US7102216B1 (en) Semiconductor package and leadframe with horizontal leads spaced in the vertical direction and method of making
CA2000338A1 (en) Lead frame for a multiplicity of terminals
US5270570A (en) Lead frame for a multiplicity of terminals
US5408127A (en) Method of and arrangement for preventing bonding wire shorts with certain integrated circuit components
US5466967A (en) Lead frame for a multiplicity of terminals
US5220486A (en) Ic packing device
JP2732767B2 (ja) 樹脂封止型半導体装置
JP3292082B2 (ja) ターミナルランドフレームとそれを用いた樹脂封止型半導体装置の製造方法
US4563811A (en) Method of making a dual-in-line package
KR930004256B1 (ko) 필름캐리어 제조용의 필름재 및 필름캐리어의 제조방법
US4826068A (en) Outer lead bonding device utilizing tape carriers
US5347709A (en) Method of making lead frame
US4829405A (en) Tape automated bonding package
US6814274B2 (en) Bonding tool capable of bonding inner leads of tab tapes to electrode pads in high quality and high productivity and bonding method
KR19980063740A (ko) 몰딩된 패키지용 다층 리드프레임
KR100192845B1 (ko) 기판상에 전극 패턴을 형성하는 방법과 그를 이용한 모듈 패키지
JPH04103154A (ja) 半導体装置及びその製造方法及びその実装方法
JP2970101B2 (ja) 半導体素子の支持基板及びそれを使用した回路装置

Legal Events

Date Code Title Description
FZDE Discontinued