CA1331420C - Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures - Google Patents

Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures

Info

Publication number
CA1331420C
CA1331420C CA000596926A CA596926A CA1331420C CA 1331420 C CA1331420 C CA 1331420C CA 000596926 A CA000596926 A CA 000596926A CA 596926 A CA596926 A CA 596926A CA 1331420 C CA1331420 C CA 1331420C
Authority
CA
Canada
Prior art keywords
copper
concentration
solution
intrinsic
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA000596926A
Other languages
English (en)
French (fr)
Inventor
Rowan Hughes
Milan Paunovic
Rudolph J. Zeblisky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Application granted granted Critical
Publication of CA1331420C publication Critical patent/CA1331420C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CA000596926A 1988-04-29 1989-04-17 Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures Expired - Fee Related CA1331420C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US18782288A 1988-04-29 1988-04-29
US07/187,822 1988-04-29

Publications (1)

Publication Number Publication Date
CA1331420C true CA1331420C (en) 1994-08-16

Family

ID=22690615

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000596926A Expired - Fee Related CA1331420C (en) 1988-04-29 1989-04-17 Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures

Country Status (8)

Country Link
EP (1) EP0340649B1 (ja)
JP (1) JPH07107193B2 (ja)
KR (1) KR890016207A (ja)
AU (1) AU3304389A (ja)
BR (1) BR8901962A (ja)
CA (1) CA1331420C (ja)
DE (1) DE3914180A1 (ja)
GB (2) GB2218714B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5526458B2 (ja) * 2006-12-06 2014-06-18 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
BR112013003430A2 (pt) 2010-08-17 2016-06-21 Chemetall Gmbh "processo para o cobreamento de substratos metálicos sem corrente elétrica."

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1522048A (fr) * 1966-05-06 1968-04-19 Photocircuits Corp Dépôt non galvanique de métaux
FR1551275A (ja) * 1966-12-19 1968-12-27
ZA775495B (en) * 1976-11-22 1978-07-26 Kollmorgen Tech Corp Method and apparatus for control of electroless plating solutions
US4301196A (en) 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
CA1135903A (en) * 1978-09-13 1982-11-23 John F. Mccormack Electroless copper deposition process having faster plating rates
JPS5627594A (en) * 1979-08-10 1981-03-17 Matsushita Electric Ind Co Ltd Remote controller
JPS6016517B2 (ja) * 1979-12-29 1985-04-25 上村工業株式会社 無電解めつき制御方法
JPS5927379A (ja) * 1982-08-09 1984-02-13 Hitachi Ltd パタ−ン映像信号処理方式
JPH0247550B2 (ja) * 1982-08-23 1990-10-22 Chusho Kigyo Jigyodan Mudenkaidometsukiekinokanrihoho
JPH0239596B2 (ja) * 1983-03-25 1990-09-06 Uemura Kogyo Kk Kagakudometsukinokontorooruhoho
KR920002710B1 (ko) * 1984-06-18 1992-03-31 가부시기가이샤 히다찌세이사꾸쇼 화학동도금방법
US4692346A (en) * 1986-04-21 1987-09-08 International Business Machines Corporation Method and apparatus for controlling the surface chemistry on objects plated in an electroless plating bath
US4814197A (en) * 1986-10-31 1989-03-21 Kollmorgen Corporation Control of electroless plating baths
EP0265895B1 (en) * 1986-10-31 1993-02-10 AMP-AKZO CORPORATION (a Delaware corp.) Method for electrolessly depositing high quality copper

Also Published As

Publication number Publication date
GB2218714B (en) 1992-10-14
GB2218714A (en) 1989-11-22
JPH0270070A (ja) 1990-03-08
DE3914180C2 (ja) 1991-04-18
DE3914180A1 (de) 1989-11-09
BR8901962A (pt) 1989-12-05
JPH07107193B2 (ja) 1995-11-15
EP0340649A1 (en) 1989-11-08
EP0340649B1 (en) 1993-02-03
GB9220923D0 (en) 1992-11-18
KR890016207A (ko) 1989-11-28
GB8909623D0 (en) 1989-06-14
AU3304389A (en) 1989-11-02

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Legal Events

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