CA1303436C - Nickel particle plating system - Google Patents
Nickel particle plating systemInfo
- Publication number
- CA1303436C CA1303436C CA000597323A CA597323A CA1303436C CA 1303436 C CA1303436 C CA 1303436C CA 000597323 A CA000597323 A CA 000597323A CA 597323 A CA597323 A CA 597323A CA 1303436 C CA1303436 C CA 1303436C
- Authority
- CA
- Canada
- Prior art keywords
- particle
- copper
- percent
- coating
- nickel particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002245 particle Substances 0.000 title claims abstract description 178
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 126
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 63
- 238000007747 plating Methods 0.000 title claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 101
- 229910052802 copper Inorganic materials 0.000 claims abstract description 101
- 239000010949 copper Substances 0.000 claims abstract description 101
- 238000000576 coating method Methods 0.000 claims abstract description 77
- 239000011248 coating agent Substances 0.000 claims abstract description 73
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 49
- 229910052709 silver Inorganic materials 0.000 claims abstract description 49
- 239000004332 silver Substances 0.000 claims abstract description 49
- 239000011159 matrix material Substances 0.000 claims abstract description 7
- 239000011236 particulate material Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 22
- 238000007772 electroless plating Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 7
- 239000003381 stabilizer Substances 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 6
- 239000008139 complexing agent Substances 0.000 claims description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 3
- 229910001431 copper ion Inorganic materials 0.000 claims description 3
- 229910000510 noble metal Inorganic materials 0.000 claims description 3
- 239000003638 chemical reducing agent Substances 0.000 claims description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims 6
- 230000003213 activating effect Effects 0.000 claims 1
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 15
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 239000008367 deionised water Substances 0.000 description 6
- 229910021641 deionized water Inorganic materials 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 3
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- LFAGQMCIGQNPJG-UHFFFAOYSA-N silver cyanide Chemical compound [Ag+].N#[C-] LFAGQMCIGQNPJG-UHFFFAOYSA-N 0.000 description 3
- 229940098221 silver cyanide Drugs 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000003446 ligand Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002825 nitriles Chemical class 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 208000032365 Electromagnetic interference Diseases 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 238000005844 autocatalytic reaction Methods 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 229960001484 edetic acid Drugs 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005243 fluidization Methods 0.000 description 1
- 239000008098 formaldehyde solution Substances 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12181—Composite powder [e.g., coated, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Powder Metallurgy (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/199,196 US4857233A (en) | 1988-05-26 | 1988-05-26 | Nickel particle plating system |
| US199,196 | 1988-05-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1303436C true CA1303436C (en) | 1992-06-16 |
Family
ID=22736598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000597323A Expired - Lifetime CA1303436C (en) | 1988-05-26 | 1989-04-20 | Nickel particle plating system |
Country Status (5)
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1990009736A1 (en) * | 1989-02-28 | 1990-09-07 | Kanebo Ltd. | Antibacterial or conductive composition and applications thereof |
| DE4017044A1 (de) * | 1990-05-26 | 1991-11-28 | Metallgesellschaft Ag | Elektrisch leitfaehiges bariumsulfat und verfahren zu seiner herstellung |
| US5820721A (en) * | 1991-07-17 | 1998-10-13 | Beane; Alan F. | Manufacturing particles and articles having engineered properties |
| US5453293A (en) * | 1991-07-17 | 1995-09-26 | Beane; Alan F. | Methods of manufacturing coated particles having desired values of intrinsic properties and methods of applying the coated particles to objects |
| DE4124458A1 (de) * | 1991-07-24 | 1993-01-28 | Degussa | Emi-abschirmpigmente, verfahren zu deren herstellung und deren verwendung |
| GB9211500D0 (en) * | 1992-05-30 | 1992-07-15 | First Class Securities | Pastes |
| US5840432A (en) * | 1995-02-13 | 1998-11-24 | Hitachi Chemical Company, Ltd. | Electroconductive paste |
| US7097686B2 (en) * | 1997-02-24 | 2006-08-29 | Cabot Corporation | Nickel powders, methods for producing powders and devices fabricated from same |
| US6165247A (en) * | 1997-02-24 | 2000-12-26 | Superior Micropowders, Llc | Methods for producing platinum powders |
| US6338809B1 (en) | 1997-02-24 | 2002-01-15 | Superior Micropowders Llc | Aerosol method and apparatus, particulate products, and electronic devices made therefrom |
| US6010646A (en) | 1997-04-11 | 2000-01-04 | Potters Industries, Inc. | Electroconductive composition and methods for producing such composition |
| US20050097987A1 (en) * | 1998-02-24 | 2005-05-12 | Cabot Corporation | Coated copper-containing powders, methods and apparatus for producing such powders, and copper-containing devices fabricated from same |
| US6322685B1 (en) * | 1998-05-13 | 2001-11-27 | International Business Machines Corporation | Apparatus and method for plating coatings on to fine powder materials and use of the powder therefrom |
| US6376708B1 (en) | 2000-04-11 | 2002-04-23 | Monsanto Technology Llc | Process and catalyst for dehydrogenating primary alcohols to make carboxylic acid salts |
| US6663799B2 (en) * | 2000-09-28 | 2003-12-16 | Jsr Corporation | Conductive metal particles, conductive composite metal particles and applied products using the same |
| JP5123633B2 (ja) * | 2007-10-10 | 2013-01-23 | ルネサスエレクトロニクス株式会社 | 半導体装置および接続材料 |
| KR20140034542A (ko) * | 2012-09-12 | 2014-03-20 | 삼성전자주식회사 | 도전성 분말, 성형품 및 도전성 페이스트 |
| FR3020509B1 (fr) * | 2014-04-29 | 2016-05-13 | Axon Cable Sa | Contact electrique miniature de haute stabilite thermique |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA710371A (en) * | 1965-05-25 | Chomerics | Plastics made conductive with coarse metal fillers | |
| US2018343A (en) * | 1931-10-27 | 1935-10-22 | Rca Corp | Electrical conductor and method of making the same |
| US2038521A (en) * | 1934-09-26 | 1936-04-28 | James W Bell | Ladder |
| US2470352A (en) * | 1944-03-21 | 1949-05-17 | Hartford Nat Bank & Trust Comp | Electrical resistor |
| US2771380A (en) * | 1954-08-02 | 1956-11-20 | Burgess Battery Co | Method of plating copper particles with silver |
| US3031344A (en) * | 1957-08-08 | 1962-04-24 | Radio Ind Inc | Production of electrical printed circuits |
| US3326700A (en) * | 1963-06-12 | 1967-06-20 | Rudolph J Zeblisky | Electroless copper plating |
| US3194860A (en) * | 1962-10-02 | 1965-07-13 | John E Ehrreich | Manufacture of reinforced conductive plastic gaskets |
| US3140342A (en) * | 1963-07-05 | 1964-07-07 | Chomerics Inc | Electrical shielding and sealing gasket |
| US3361580A (en) * | 1963-06-18 | 1968-01-02 | Day Company | Electroless copper plating |
| US3202488A (en) * | 1964-03-04 | 1965-08-24 | Chomerics Inc | Silver-plated copper powder |
| US3310718A (en) * | 1964-04-07 | 1967-03-21 | Nytronics Inc | Impedance element with alloy connector |
| SU475664A1 (ru) * | 1965-08-20 | 1975-06-30 | Московский технологический институт мясной и молочной промышленности | Способ получени контактного состава |
| US3329512A (en) * | 1966-04-04 | 1967-07-04 | Shipley Co | Chemical deposition of copper and solutions therefor |
| US3476530A (en) * | 1966-06-10 | 1969-11-04 | Chomerics Inc | Iron based conductive filler for plastics |
| US3583930A (en) * | 1968-04-16 | 1971-06-08 | Chomerics Inc | Plastics made conductive with coarse metal fillers |
| US3725308A (en) * | 1968-12-10 | 1973-04-03 | M Ostolski | Electrically conductive mass |
| US3718608A (en) * | 1969-10-06 | 1973-02-27 | Owens Illinois Inc | Resistor compositions for microcircuitry |
| US3718594A (en) * | 1970-11-30 | 1973-02-27 | Eastman Kodak Co | Method of preparing magnetically responsive carrier particles |
| US3957694A (en) * | 1974-09-27 | 1976-05-18 | General Electric Company | Radiation curable inks |
| US3968056A (en) * | 1974-09-27 | 1976-07-06 | General Electric Company | Radiation curable inks |
| US3988651A (en) * | 1975-05-23 | 1976-10-26 | Erie Technological Products, Inc. | Monolithic ceramic capacitor |
| NL164906C (nl) * | 1975-08-19 | 1981-02-16 | Philips Nv | Werkwijze voor de bereiding van een waterig alkalische verkoperbad. |
| JPS5849966B2 (ja) * | 1975-09-22 | 1983-11-08 | シヨウエイカガクコウギヨウ カブシキガイシヤ | デンキヨクヨウトリヨウ |
| US4088801A (en) * | 1976-04-29 | 1978-05-09 | General Electric Company | U.V. Radiation curable electrically conductive ink and circuit boards made therewith |
| JPS5645515A (en) * | 1979-09-20 | 1981-04-25 | Matsushita Electric Ind Co Ltd | Electronic parts |
| US4450188A (en) * | 1980-04-18 | 1984-05-22 | Shinroku Kawasumi | Process for the preparation of precious metal-coated particles |
| JPS5767659A (en) * | 1980-10-13 | 1982-04-24 | Toichiro Izawa | Resin composition containing metallic powder |
| JPS57113505A (en) * | 1981-01-07 | 1982-07-15 | Matsushita Electric Ind Co Ltd | Conductive composition |
| CA1218839A (en) * | 1982-10-28 | 1987-03-10 | Tokuzo Kanbe | Shielding material of electromagnetic waves |
| JPS60258279A (ja) * | 1984-06-05 | 1985-12-20 | Matsushita Electric Ind Co Ltd | 導電性接着剤 |
| JPS61179261A (ja) * | 1985-02-04 | 1986-08-11 | Furukawa Electric Co Ltd:The | 導電性レジンペ−スト |
| US4716081A (en) * | 1985-07-19 | 1987-12-29 | Ercon, Inc. | Conductive compositions and conductive powders for use therein |
| JPS6354472A (ja) * | 1986-05-12 | 1988-03-08 | Brother Ind Ltd | 導電性ペ−スト |
| US4711814A (en) * | 1986-06-19 | 1987-12-08 | Teichmann Robert J | Nickel particle plating system |
| JPS6390565A (ja) * | 1986-10-06 | 1988-04-21 | Mitsui Mining & Smelting Co Ltd | マイクロ波照射により導電性が付与される導電性膜形成組成物及びこの導電性付与方法 |
-
1988
- 1988-05-26 US US07/199,196 patent/US4857233A/en not_active Expired - Lifetime
-
1989
- 1989-03-02 JP JP1048694A patent/JPH01320704A/ja active Granted
- 1989-04-20 CA CA000597323A patent/CA1303436C/en not_active Expired - Lifetime
- 1989-05-02 AU AU33908/89A patent/AU614122B2/en not_active Ceased
- 1989-05-17 EP EP89304959A patent/EP0343836A1/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01320704A (ja) | 1989-12-26 |
| JPH0557681B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-08-24 |
| AU614122B2 (en) | 1991-08-22 |
| EP0343836A1 (en) | 1989-11-29 |
| AU3390889A (en) | 1989-11-30 |
| US4857233A (en) | 1989-08-15 |
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