CA1165072A - Procede d'encapsulation de composants electroniques a l'aide d'une matiere moulable a base d'un prepolymere thermodurcissable - Google Patents

Procede d'encapsulation de composants electroniques a l'aide d'une matiere moulable a base d'un prepolymere thermodurcissable

Info

Publication number
CA1165072A
CA1165072A CA000364296A CA364296A CA1165072A CA 1165072 A CA1165072 A CA 1165072A CA 000364296 A CA000364296 A CA 000364296A CA 364296 A CA364296 A CA 364296A CA 1165072 A CA1165072 A CA 1165072A
Authority
CA
Canada
Prior art keywords
bis
prepolymer
radical
molding
molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000364296A
Other languages
English (en)
French (fr)
Inventor
Serge Laurent
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rhone Poulenc Industries SA
Original Assignee
Rhone Poulenc Industries SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rhone Poulenc Industries SA filed Critical Rhone Poulenc Industries SA
Application granted granted Critical
Publication of CA1165072A publication Critical patent/CA1165072A/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C08G73/121—Preparatory processes from unsaturated precursors and polyamines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
    • H01C1/034—Housing; Enclosing; Embedding; Filling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CA000364296A 1979-11-09 1980-11-07 Procede d'encapsulation de composants electroniques a l'aide d'une matiere moulable a base d'un prepolymere thermodurcissable Expired CA1165072A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR79/28145 1979-11-09
FR7928145A FR2469421A1 (fr) 1979-11-09 1979-11-09 Procede d'encapsulation de composants electroniques a l'aide d'une matiere moulable a base d'un prepolymere thermodurcissable

Publications (1)

Publication Number Publication Date
CA1165072A true CA1165072A (fr) 1984-04-10

Family

ID=9231693

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000364296A Expired CA1165072A (fr) 1979-11-09 1980-11-07 Procede d'encapsulation de composants electroniques a l'aide d'une matiere moulable a base d'un prepolymere thermodurcissable

Country Status (9)

Country Link
US (1) US4390596A (enExample)
EP (1) EP0028994B1 (enExample)
JP (1) JPS5672912A (enExample)
CA (1) CA1165072A (enExample)
DE (1) DE3069076D1 (enExample)
DK (1) DK472780A (enExample)
FR (1) FR2469421A1 (enExample)
GR (1) GR70321B (enExample)
IE (1) IE50538B1 (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57189327A (en) * 1981-05-15 1982-11-20 Kokuritsu Bosai Kagaku Gijutsu Center Recording and reproducing system of long play data recorder
CA1270998A (en) * 1986-07-15 1990-06-26 Akihiro Yamaguchi Thermosetting resin composition
US5023366A (en) * 1986-11-05 1991-06-11 Mitsui Toatsu Chemicals, Incorporated Salicylic acid copolymers and their metal salts, production process thereof, color-developing agents comprising metal salts of the copolymers, and color-developing sheets employing the agents
CA1317056C (en) * 1987-05-06 1993-04-27 Akihiro Yamaguchi Thermosetting resin composition
DE3874223T2 (de) * 1987-05-06 1993-04-08 Mitsui Toatsu Chemicals Waermehaertbare harzzubereitung.
EP0361040B1 (en) * 1988-08-15 1994-12-07 MITSUI TOATSU CHEMICALS, Inc. Odorless multi-valent metal modified products of salicylic acid copolymers, production processes thereof, and use thereof as color-developing agents for pressure-sensitive copying paper sheets
EP0532223A1 (en) * 1991-09-12 1993-03-17 Caddock Electronics, Inc. Film-type electrical resistor
US5252944A (en) * 1991-09-12 1993-10-12 Caddock Electronics, Inc. Film-type electrical resistor combination
US5304977A (en) * 1991-09-12 1994-04-19 Caddock Electronics, Inc. Film-type power resistor combination with anchored exposed substrate/heatsink
US6852814B2 (en) 1994-09-02 2005-02-08 Henkel Corporation Thermosetting resin compositions containing maleimide and/or vinyl compounds
US6960636B2 (en) 1994-09-02 2005-11-01 Henkel Corporation Thermosetting resin compositions containing maleimide and/or vinyl compounds
US7645899B1 (en) 1994-09-02 2010-01-12 Henkel Corporation Vinyl compounds
JPH10505599A (ja) * 1994-09-02 1998-06-02 クアンタム マテリアルズ，インコーポレイテッド マレイミド及び／又はビニル化合物を含有する熱硬化性樹脂組成物
US5951813A (en) * 1996-05-02 1999-09-14 Raytheon Company Top of die chip-on-board encapsulation
US6350840B1 (en) * 1998-07-02 2002-02-26 National Starch And Chemical Investment Holding Corporation Underfill encapsulants prepared from allylated amide compounds
US6316566B1 (en) 1998-07-02 2001-11-13 National Starch And Chemical Investment Holding Corporation Package encapsulant compositions for use in electronic devices
US6281314B1 (en) * 1998-07-02 2001-08-28 National Starch And Chemical Investment Holding Corporation Compositions for use in the fabrication of circuit components and printed wire boards
US6265530B1 (en) * 1998-07-02 2001-07-24 National Starch And Chemical Investment Holding Corporation Die attach adhesives for use in microelectronic devices
SG85658A1 (en) * 1998-07-02 2002-01-15 Nat Starch Chem Invest Package encapsulants prepared from allylated amide compounds
SG78377A1 (en) * 1998-07-02 2001-02-20 Nat Starch Chem Invest Method of making electronic component using reworkable adhesives
US6063828A (en) * 1998-07-02 2000-05-16 National Starch And Chemical Investment Holding Corporation Underfill encapsulant compositions for use in electronic devices
US6355750B1 (en) 1998-07-02 2002-03-12 National Starch And Chemical Investment Holding Corporation Dye attach adhesives for use in microelectronic devices
EP0969059A3 (en) * 1998-07-02 2000-02-23 National Starch and Chemical Investment Holding Corporation Compositions for use in the fabrication of circuit components and printed wire boards
SG82001A1 (en) * 1998-07-02 2001-07-24 Nat Starch Chem Invest Method of making an electronic component using reworkable underfill encapsulants
US6057381A (en) * 1998-07-02 2000-05-02 National Starch And Chemical Investment Holding Corporation Method of making an electronic component using reworkable underfill encapsulants
US7183485B2 (en) * 2003-03-11 2007-02-27 Micron Technology, Inc. Microelectronic component assemblies having lead frames adapted to reduce package bow
US7803457B2 (en) * 2003-12-29 2010-09-28 General Electric Company Composite coatings for groundwall insulation, method of manufacture thereof and articles derived therefrom

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3018290A (en) * 1959-11-12 1962-01-23 Union Carbide Corp Preparation of maleimides
US3297759A (en) 1964-01-13 1967-01-10 Upjohn Co Continuous process for producing mixtures of methylene-bridged polyphenyl polyamines
FR1481935A (fr) 1964-10-27 1967-05-26 Devoe & Raynolds Co Procédé de fabrication de condensats arylamine-aldéhyde
US3522271A (en) 1966-06-14 1970-07-28 Du Pont Method of making n,n'-arylenebismaleimides
FR1533696A (fr) 1966-08-05 1968-07-19 Mobay Chemical Corp Nouvelles polyamines et leur préparation
US3729814A (en) * 1967-04-04 1973-05-01 Gen Electric Method for making a composite
USRE29316E (en) 1967-07-13 1977-07-19 Rhone-Poulenc S.A. Cross-linked resins
FR1555564A (fr) 1967-07-13 1969-01-31 Rhone Poulenc Sa Nouvelles résines thermostables dérivées de bis-imides d'acides dicarboxyliques non saturés
US3551200A (en) * 1968-09-18 1970-12-29 Raychem Corp Electrical component insulated by poly(1,12 dodecamethylene pyromellitimide) or poly(1,13 tridecamethylene pyromellitimide)
JPS525586Y1 (enExample) * 1969-03-28 1977-02-04
BE754723A (fr) 1969-08-12 1971-02-11 Rhone Poulenc Sa Procede de preparation de
FR2094607A5 (enExample) * 1970-06-26 1972-02-04 Rhone Poulenc Sa
NL7114237A (enExample) * 1970-10-23 1972-04-25
US4064192A (en) * 1971-02-24 1977-12-20 Rhone-Poulenc S.A. Heat-stable polyimide resins
US3738969A (en) * 1971-04-30 1973-06-12 Gen Electric Polyimides
US3996203A (en) * 1972-09-13 1976-12-07 General Electric Company Solution process for the preparation of polyimides from diamines and anhydrides
FR2201289B1 (enExample) 1972-10-02 1975-03-14 Rhone Poulenc Ind
US3998786A (en) * 1973-05-25 1976-12-21 University Of Notre Dame Du Lac Process for preparing aromatic polyimides, polyimides prepared thereby
FR2392495A1 (fr) * 1977-05-25 1978-12-22 Radiotechnique Compelec Procede de realisation de dispositifs semi-conducteurs a reseau de conducteurs mono ou multicouche et dispositifs ainsi obtenus
FR2400014A1 (fr) 1977-08-09 1979-03-09 Rhone Poulenc Ind Preparation d'oligoimides
FR2460308A1 (fr) * 1979-07-03 1981-01-23 Rhone Poulenc Ind Procede de preparation de polymeres a groupements imide modifies par du silicium

Also Published As

Publication number Publication date
FR2469421B1 (enExample) 1984-07-06
EP0028994B1 (fr) 1984-08-29
IE802293L (en) 1981-05-09
EP0028994A2 (fr) 1981-05-20
DK472780A (da) 1981-05-10
FR2469421A1 (fr) 1981-05-22
JPS5672912A (en) 1981-06-17
GR70321B (enExample) 1982-09-13
US4390596A (en) 1983-06-28
DE3069076D1 (en) 1984-10-04
IE50538B1 (en) 1986-05-14
JPS6326685B2 (enExample) 1988-05-31
EP0028994A3 (en) 1981-05-27

Similar Documents

Publication Publication Date Title
EP0028994B1 (fr) Compositions et procédé d'encapsulation de composants électroniques à l'aide d'une matière moulable à base d'un prépolymère thermodurcissable
FR2661681A1 (fr) Particules enrobees de remplissage et procede pour preparer ces dernieres.
FR2610634A1 (fr) Nouveaux polyimide-siloxanes, procedes pour leur preparatio n et articles les contenant
FR2497524A1 (enExample)
JPS61287926A (ja) 高接着性シリコン含有ポリアミド酸の製造法
CA1073580A (fr) Compositions os fluides pour moulage
FR2605326A1 (fr) Composition potentiellement adhesive electriquement conductrice.
FR2560203A1 (fr) Compositions de resines epoxy thermodurcissables comportant comme agent de durcissement un polyorganosiloxane a fonction aminoimidonorbornyle
EP0174225A1 (fr) Compositions réactives à base de oligomères de polyamides et de résines époxydes
FR2503724A1 (fr) Compositions de caoutchouc de fluorosilicone et son procede de preparation
CA1099445A (fr) Polymeres a groupements imides
CA1119744A (fr) Polymeres a groupements imide
JPH03174423A (ja) 熱硬化性樹脂組成物
CA1160392A (fr) Procede de preparation de polymeres a groupements imide modifies par du silicium
EP0397581B1 (fr) Polymères à groupements imide à base de maléimides dont un bismaléimide siloxane et de diamines aromatiques et leur procédé de préparation
JPS61500851A (ja) イソイミドを使用する共重合体及びその製造方法
EP0334771B1 (fr) Polymères à groupements imides faits à partir de diamines encombrées et leurs procédés de préparation
CA1265293A (fr) Polymeres a groupements imides et procede de preparation
WO1992004395A1 (fr) Compositions thermodurcissables a base de composes cyanate ester et de composes polyimide a groupement(s) diorganopolysiloxane
EP0931803A1 (fr) Compositions de polymères, leurs préparations et leurs utilisations
FR2612196A1 (fr) Polymeres thermostables a base de maleimides dont un bismaleimide siloxane et de diamines aromatiques et leurs procedes de preparation
JP3359359B2 (ja) 硬化性組成物
FR2645539A1 (fr) Polymeres a groupements imides faits a partir de diamines encombrees
TWI834693B (zh) 熱固性樹脂組合物及半導體裝置
WO2023079959A1 (ja) 樹脂改質用シリコーン添加剤及びそれを含む硬化性樹脂組成物

Legal Events

Date Code Title Description
MKEX Expiry