CA1152226A - Methode de fabrication de circuits imprimes - Google Patents
Methode de fabrication de circuits imprimesInfo
- Publication number
- CA1152226A CA1152226A CA000357874A CA357874A CA1152226A CA 1152226 A CA1152226 A CA 1152226A CA 000357874 A CA000357874 A CA 000357874A CA 357874 A CA357874 A CA 357874A CA 1152226 A CA1152226 A CA 1152226A
- Authority
- CA
- Canada
- Prior art keywords
- copper
- process according
- boreholes
- bath
- chemical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims abstract description 46
- 230000008569 process Effects 0.000 title claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 41
- 229910052802 copper Inorganic materials 0.000 claims abstract description 41
- 239000010949 copper Substances 0.000 claims abstract description 41
- 239000000126 substance Substances 0.000 claims abstract description 23
- 239000004020 conductor Substances 0.000 claims abstract description 18
- 230000009471 action Effects 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000004922 lacquer Substances 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 13
- 238000005476 soldering Methods 0.000 claims abstract description 9
- 238000003475 lamination Methods 0.000 claims abstract description 8
- 230000002829 reductive effect Effects 0.000 claims abstract description 6
- 239000002904 solvent Substances 0.000 claims abstract description 5
- 238000004080 punching Methods 0.000 claims abstract description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 claims description 12
- 239000003513 alkali Substances 0.000 claims description 10
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 8
- 229910000978 Pb alloy Inorganic materials 0.000 claims description 7
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 7
- 230000002378 acidificating effect Effects 0.000 claims description 7
- 239000000470 constituent Substances 0.000 claims description 7
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims description 7
- 150000001879 copper Chemical class 0.000 claims description 6
- 238000007650 screen-printing Methods 0.000 claims description 6
- 229940065287 selenium compound Drugs 0.000 claims description 6
- 150000003343 selenium compounds Chemical class 0.000 claims description 6
- 239000003381 stabilizer Substances 0.000 claims description 6
- 238000007639 printing Methods 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 4
- 239000004160 Ammonium persulphate Substances 0.000 claims description 3
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims description 3
- 235000019395 ammonium persulphate Nutrition 0.000 claims description 3
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 claims description 3
- 229960002218 sodium chlorite Drugs 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052783 alkali metal Inorganic materials 0.000 claims description 2
- -1 alkali metal seleno-cyanate Chemical class 0.000 claims description 2
- 239000000155 melt Substances 0.000 claims description 2
- 229940083608 sodium hydroxide Drugs 0.000 claims 1
- 235000011121 sodium hydroxide Nutrition 0.000 claims 1
- 239000000243 solution Substances 0.000 description 20
- 239000010410 layer Substances 0.000 description 7
- ICSNLGPSRYBMBD-UHFFFAOYSA-N 2-aminopyridine Chemical compound NC1=CC=CC=N1 ICSNLGPSRYBMBD-UHFFFAOYSA-N 0.000 description 4
- 238000005238 degreasing Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000001117 sulphuric acid Substances 0.000 description 2
- 235000011149 sulphuric acid Nutrition 0.000 description 2
- VDMJCVUEUHKGOY-JXMROGBWSA-N (1e)-4-fluoro-n-hydroxybenzenecarboximidoyl chloride Chemical compound O\N=C(\Cl)C1=CC=C(F)C=C1 VDMJCVUEUHKGOY-JXMROGBWSA-N 0.000 description 1
- FQRJWIRWWRZJAD-UHFFFAOYSA-N C(C)N(CC)B.[Na] Chemical compound C(C)N(CC)B.[Na] FQRJWIRWWRZJAD-UHFFFAOYSA-N 0.000 description 1
- 102100022183 E3 ubiquitin-protein ligase MIB1 Human genes 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 101000973503 Homo sapiens E3 ubiquitin-protein ligase MIB1 Proteins 0.000 description 1
- 241001648341 Orites Species 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 150000003959 diselenides Chemical class 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- UTVVREMVDJTZAC-UHFFFAOYSA-N furan-2-amine Chemical compound NC1=CC=CO1 UTVVREMVDJTZAC-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000006864 oxidative decomposition reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- RFLFDJSIZCCYIP-UHFFFAOYSA-L palladium(2+);sulfate Chemical compound [Pd+2].[O-]S([O-])(=O)=O RFLFDJSIZCCYIP-UHFFFAOYSA-L 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0542—Continuous temporary metal layer over metal pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1423—Applying catalyst before etching, e.g. plating catalyst in holes before etching circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEP2932536.8 | 1979-08-09 | ||
| DE19792932536 DE2932536A1 (de) | 1979-08-09 | 1979-08-09 | Verfahren zur herstellung von gedruckten schaltungen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1152226A true CA1152226A (fr) | 1983-08-16 |
Family
ID=6078196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000357874A Expired CA1152226A (fr) | 1979-08-09 | 1980-08-08 | Methode de fabrication de circuits imprimes |
Country Status (10)
| Country | Link |
|---|---|
| JP (1) | JPS5629395A (fr) |
| CA (1) | CA1152226A (fr) |
| CH (1) | CH647372A5 (fr) |
| DE (1) | DE2932536A1 (fr) |
| FR (1) | FR2463569B1 (fr) |
| GB (1) | GB2057774B (fr) |
| IE (1) | IE49971B1 (fr) |
| IT (1) | IT1131716B (fr) |
| NL (1) | NL8003939A (fr) |
| SE (1) | SE454476B (fr) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3275452D1 (en) * | 1982-04-05 | 1987-03-19 | Kanto Kasei Co | Process of manufacturing printed wiring boards and printed wiring boards manufactured by the same |
| FI88241C (fi) * | 1990-10-30 | 1993-04-13 | Nokia Mobile Phones Ltd | Foerfarande foer framstaellning av kretskort |
| US5358602A (en) * | 1993-12-06 | 1994-10-25 | Enthone-Omi Inc. | Method for manufacture of printed circuit boards |
| US5620612A (en) * | 1995-08-22 | 1997-04-15 | Macdermid, Incorporated | Method for the manufacture of printed circuit boards |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1378154A (fr) * | 1962-09-24 | 1964-11-13 | North American Aviation Inc | Interconnexions électriques pour panneaux de circuits imprimés |
| US3269861A (en) * | 1963-06-21 | 1966-08-30 | Day Company | Method for electroless copper plating |
| DE1690224B1 (de) * | 1967-08-29 | 1971-03-25 | Standard Elek K Lorenz Ag | Bad fuer die stromlose verkupferung von kunststoffplatten |
| FR2128355A1 (fr) * | 1971-03-01 | 1972-10-20 | Fernseh Gmbh | |
| JPS5489276A (en) * | 1977-12-27 | 1979-07-16 | Fujitsu Ltd | Method of producing printed board |
-
1979
- 1979-08-09 DE DE19792932536 patent/DE2932536A1/de not_active Withdrawn
-
1980
- 1980-07-08 NL NL8003939A patent/NL8003939A/nl not_active Application Discontinuation
- 1980-07-17 CH CH5489/80A patent/CH647372A5/de not_active IP Right Cessation
- 1980-07-18 IT IT23530/80A patent/IT1131716B/it active
- 1980-07-29 SE SE8005443A patent/SE454476B/sv not_active IP Right Cessation
- 1980-08-07 FR FR8017460A patent/FR2463569B1/fr not_active Expired
- 1980-08-08 GB GB8025868A patent/GB2057774B/en not_active Expired
- 1980-08-08 CA CA000357874A patent/CA1152226A/fr not_active Expired
- 1980-08-08 IE IE1669/80A patent/IE49971B1/en unknown
- 1980-08-08 JP JP10841080A patent/JPS5629395A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5629395A (en) | 1981-03-24 |
| SE454476B (sv) | 1988-05-02 |
| CH647372A5 (de) | 1985-01-15 |
| IT1131716B (it) | 1986-06-25 |
| IE801669L (en) | 1981-02-09 |
| GB2057774A (en) | 1981-04-01 |
| IE49971B1 (en) | 1986-01-22 |
| GB2057774B (en) | 1983-09-07 |
| NL8003939A (nl) | 1981-02-11 |
| DE2932536A1 (de) | 1981-02-26 |
| FR2463569A1 (fr) | 1981-02-20 |
| FR2463569B1 (fr) | 1985-09-20 |
| SE8005443L (sv) | 1981-02-10 |
| IT8023530A0 (it) | 1980-07-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1152225A (fr) | Methode de fabrication de circuits imprimes | |
| EP0060805A1 (fr) | Procédé pour la production de plaquettes imprimées et les plaquettes fabriquées par ce procédé | |
| US7591956B2 (en) | Method and composition for selectively stripping nickel from a substrate | |
| US5474798A (en) | Method for the manufacture of printed circuit boards | |
| WO1999031293A1 (fr) | Fluide et procede de pretraitement destines a un depot autocatalytique de nickel | |
| US6254758B1 (en) | Method of forming conductor pattern on wiring board | |
| CA1152226A (fr) | Methode de fabrication de circuits imprimes | |
| IE50821B1 (en) | Process for the selective chemical deposition and/or electrodeposition of metal coatings,especially for the production of printed circuits | |
| JPH0376599B2 (fr) | ||
| US4874635A (en) | Method for removing residual precious metal catalyst from the surface of metal-plated plastics | |
| US4433009A (en) | Method of manufacturing printed circuits | |
| GB2118369A (en) | Making printed circuit boards | |
| JPS586319B2 (ja) | プリント配線板の製造方法 | |
| US6403146B1 (en) | Process for the manufacture of printed circuit boards | |
| JPH08139435A (ja) | プリント配線板の製造方法 | |
| JPH04188696A (ja) | プリント配線板の製造方法 | |
| JP2001172769A (ja) | 無電解ニッケルめっき用還元性活性化処理液及びそれを用いたプリント配線板の製造方法 | |
| JPH0249547B2 (ja) | Purintohaisenbannoseizohoho | |
| DE3543615A1 (de) | Verfahren zum herstellen eines stromlos abgeschiedenen metallbelages auf einer keramischen unterlage | |
| JPH05206639A (ja) | 回路板の銅回路の処理方法 | |
| JPH05102656A (ja) | 多層印刷配線板及びその内層電気回路用銅箔 | |
| JPH04250642A (ja) | ポリイミド樹脂の溶解方法 | |
| JPS6220719B2 (fr) | ||
| JPH03122289A (ja) | 無電解金属めっき方法 | |
| JPS62598B2 (fr) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |