JPS5629395A - Method of manufacturing printing wire - Google Patents
Method of manufacturing printing wireInfo
- Publication number
- JPS5629395A JPS5629395A JP10841080A JP10841080A JPS5629395A JP S5629395 A JPS5629395 A JP S5629395A JP 10841080 A JP10841080 A JP 10841080A JP 10841080 A JP10841080 A JP 10841080A JP S5629395 A JPS5629395 A JP S5629395A
- Authority
- JP
- Japan
- Prior art keywords
- printing wire
- manufacturing printing
- manufacturing
- wire
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0542—Continuous temporary metal layer over metal pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1423—Applying catalyst before etching, e.g. plating catalyst in holes before etching circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19792932536 DE2932536A1 (en) | 1979-08-09 | 1979-08-09 | METHOD FOR PRODUCING PRINTED CIRCUITS |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5629395A true JPS5629395A (en) | 1981-03-24 |
Family
ID=6078196
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10841080A Pending JPS5629395A (en) | 1979-08-09 | 1980-08-08 | Method of manufacturing printing wire |
Country Status (10)
Country | Link |
---|---|
JP (1) | JPS5629395A (en) |
CA (1) | CA1152226A (en) |
CH (1) | CH647372A5 (en) |
DE (1) | DE2932536A1 (en) |
FR (1) | FR2463569B1 (en) |
GB (1) | GB2057774B (en) |
IE (1) | IE49971B1 (en) |
IT (1) | IT1131716B (en) |
NL (1) | NL8003939A (en) |
SE (1) | SE454476B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09102676A (en) * | 1995-08-22 | 1997-04-15 | Macdermid Inc | Manufacture of printed circuit board |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0090900B1 (en) * | 1982-04-05 | 1987-02-11 | Kanto Kasei Co., Ltd. | Process of manufacturing printed wiring boards and printed wiring boards manufactured by the same |
FI88241C (en) * | 1990-10-30 | 1993-04-13 | Nokia Mobile Phones Ltd | FOERFARANDE FOER FRAMSTAELLNING AV KRETSKORT |
US5358602A (en) * | 1993-12-06 | 1994-10-25 | Enthone-Omi Inc. | Method for manufacture of printed circuit boards |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5489276A (en) * | 1977-12-27 | 1979-07-16 | Fujitsu Ltd | Method of producing printed board |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1378154A (en) * | 1962-09-24 | 1964-11-13 | North American Aviation Inc | Electrical interconnections for printed circuit boards |
US3269861A (en) * | 1963-06-21 | 1966-08-30 | Day Company | Method for electroless copper plating |
DE1690224B1 (en) * | 1967-08-29 | 1971-03-25 | Standard Elek K Lorenz Ag | BATHROOM FOR ELECTRONIC COPPER PLATING OF PLASTIC PANELS |
FR2128355A1 (en) * | 1971-03-01 | 1972-10-20 | Fernseh Gmbh |
-
1979
- 1979-08-09 DE DE19792932536 patent/DE2932536A1/en not_active Withdrawn
-
1980
- 1980-07-08 NL NL8003939A patent/NL8003939A/en not_active Application Discontinuation
- 1980-07-17 CH CH5489/80A patent/CH647372A5/en not_active IP Right Cessation
- 1980-07-18 IT IT23530/80A patent/IT1131716B/en active
- 1980-07-29 SE SE8005443A patent/SE454476B/en not_active IP Right Cessation
- 1980-08-07 FR FR8017460A patent/FR2463569B1/en not_active Expired
- 1980-08-08 JP JP10841080A patent/JPS5629395A/en active Pending
- 1980-08-08 CA CA000357874A patent/CA1152226A/en not_active Expired
- 1980-08-08 GB GB8025868A patent/GB2057774B/en not_active Expired
- 1980-08-08 IE IE1669/80A patent/IE49971B1/en unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5489276A (en) * | 1977-12-27 | 1979-07-16 | Fujitsu Ltd | Method of producing printed board |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09102676A (en) * | 1995-08-22 | 1997-04-15 | Macdermid Inc | Manufacture of printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
CA1152226A (en) | 1983-08-16 |
DE2932536A1 (en) | 1981-02-26 |
SE454476B (en) | 1988-05-02 |
IE49971B1 (en) | 1986-01-22 |
IT8023530A0 (en) | 1980-07-18 |
SE8005443L (en) | 1981-02-10 |
IT1131716B (en) | 1986-06-25 |
FR2463569A1 (en) | 1981-02-20 |
GB2057774B (en) | 1983-09-07 |
NL8003939A (en) | 1981-02-11 |
IE801669L (en) | 1981-02-09 |
FR2463569B1 (en) | 1985-09-20 |
GB2057774A (en) | 1981-04-01 |
CH647372A5 (en) | 1985-01-15 |
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