IT8023530A0 - Procedimento di fabbricazione di circuiti stampati. - Google Patents

Procedimento di fabbricazione di circuiti stampati.

Info

Publication number
IT8023530A0
IT8023530A0 IT8023530A IT2353080A IT8023530A0 IT 8023530 A0 IT8023530 A0 IT 8023530A0 IT 8023530 A IT8023530 A IT 8023530A IT 2353080 A IT2353080 A IT 2353080A IT 8023530 A0 IT8023530 A0 IT 8023530A0
Authority
IT
Italy
Prior art keywords
procedure
printed circuits
manufacturing printed
manufacturing
circuits
Prior art date
Application number
IT8023530A
Other languages
English (en)
Other versions
IT1131716B (it
Inventor
Werner Claus Ruff
Original Assignee
Schering Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering Ag filed Critical Schering Ag
Publication of IT8023530A0 publication Critical patent/IT8023530A0/it
Application granted granted Critical
Publication of IT1131716B publication Critical patent/IT1131716B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0542—Continuous temporary metal layer over metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1423—Applying catalyst before etching, e.g. plating catalyst in holes before etching circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
IT23530/80A 1979-08-09 1980-07-18 Procedimento di fabbricazione di circuiti stampati IT1131716B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19792932536 DE2932536A1 (de) 1979-08-09 1979-08-09 Verfahren zur herstellung von gedruckten schaltungen

Publications (2)

Publication Number Publication Date
IT8023530A0 true IT8023530A0 (it) 1980-07-18
IT1131716B IT1131716B (it) 1986-06-25

Family

ID=6078196

Family Applications (1)

Application Number Title Priority Date Filing Date
IT23530/80A IT1131716B (it) 1979-08-09 1980-07-18 Procedimento di fabbricazione di circuiti stampati

Country Status (10)

Country Link
JP (1) JPS5629395A (it)
CA (1) CA1152226A (it)
CH (1) CH647372A5 (it)
DE (1) DE2932536A1 (it)
FR (1) FR2463569B1 (it)
GB (1) GB2057774B (it)
IE (1) IE49971B1 (it)
IT (1) IT1131716B (it)
NL (1) NL8003939A (it)
SE (1) SE454476B (it)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0090900B1 (en) * 1982-04-05 1987-02-11 Kanto Kasei Co., Ltd. Process of manufacturing printed wiring boards and printed wiring boards manufactured by the same
FI88241C (fi) * 1990-10-30 1993-04-13 Nokia Mobile Phones Ltd Foerfarande foer framstaellning av kretskort
US5358602A (en) * 1993-12-06 1994-10-25 Enthone-Omi Inc. Method for manufacture of printed circuit boards
US5620612A (en) * 1995-08-22 1997-04-15 Macdermid, Incorporated Method for the manufacture of printed circuit boards

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1378154A (fr) * 1962-09-24 1964-11-13 North American Aviation Inc Interconnexions électriques pour panneaux de circuits imprimés
US3269861A (en) * 1963-06-21 1966-08-30 Day Company Method for electroless copper plating
DE1690224B1 (de) * 1967-08-29 1971-03-25 Standard Elek K Lorenz Ag Bad fuer die stromlose verkupferung von kunststoffplatten
FR2128355A1 (it) * 1971-03-01 1972-10-20 Fernseh Gmbh
JPS5489276A (en) * 1977-12-27 1979-07-16 Fujitsu Ltd Method of producing printed board

Also Published As

Publication number Publication date
NL8003939A (nl) 1981-02-11
CA1152226A (en) 1983-08-16
IE49971B1 (en) 1986-01-22
SE8005443L (sv) 1981-02-10
IE801669L (en) 1981-02-09
SE454476B (sv) 1988-05-02
JPS5629395A (en) 1981-03-24
GB2057774A (en) 1981-04-01
IT1131716B (it) 1986-06-25
DE2932536A1 (de) 1981-02-26
CH647372A5 (de) 1985-01-15
FR2463569B1 (fr) 1985-09-20
FR2463569A1 (fr) 1981-02-20
GB2057774B (en) 1983-09-07

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