CH647372A5 - Verfahren zur herstellung von gedruckten schaltungen. - Google Patents
Verfahren zur herstellung von gedruckten schaltungen. Download PDFInfo
- Publication number
- CH647372A5 CH647372A5 CH5489/80A CH548980A CH647372A5 CH 647372 A5 CH647372 A5 CH 647372A5 CH 5489/80 A CH5489/80 A CH 5489/80A CH 548980 A CH548980 A CH 548980A CH 647372 A5 CH647372 A5 CH 647372A5
- Authority
- CH
- Switzerland
- Prior art keywords
- copper
- solution
- holes
- chemical
- bath
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 31
- 229910052802 copper Inorganic materials 0.000 claims description 31
- 239000010949 copper Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 26
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- 238000005530 etching Methods 0.000 claims description 17
- 239000000126 substance Substances 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 15
- 239000002585 base Substances 0.000 claims description 13
- 239000010410 layer Substances 0.000 claims description 13
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 claims description 12
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 230000002378 acidificating effect Effects 0.000 claims description 8
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 239000004922 lacquer Substances 0.000 claims description 6
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 6
- 239000011241 protective layer Substances 0.000 claims description 6
- 238000005253 cladding Methods 0.000 claims description 5
- 230000002829 reductive effect Effects 0.000 claims description 5
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 4
- 229910001870 ammonium persulfate Inorganic materials 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 4
- 230000008021 deposition Effects 0.000 claims description 4
- 229940065287 selenium compound Drugs 0.000 claims description 4
- 150000003343 selenium compounds Chemical class 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 4
- 229910052783 alkali metal Inorganic materials 0.000 claims description 3
- -1 alkali metal cyanide Chemical class 0.000 claims description 3
- 239000008139 complexing agent Substances 0.000 claims description 3
- 150000001879 copper Chemical class 0.000 claims description 3
- 239000003960 organic solvent Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 239000003381 stabilizer Substances 0.000 claims description 3
- 239000000155 melt Substances 0.000 claims description 2
- 238000004080 punching Methods 0.000 claims description 2
- 230000001680 brushing effect Effects 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 claims 1
- 229960002218 sodium chlorite Drugs 0.000 claims 1
- 239000000243 solution Substances 0.000 description 20
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- VDMJCVUEUHKGOY-JXMROGBWSA-N (1e)-4-fluoro-n-hydroxybenzenecarboximidoyl chloride Chemical compound O\N=C(\Cl)C1=CC=C(F)C=C1 VDMJCVUEUHKGOY-JXMROGBWSA-N 0.000 description 2
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 2
- ICSNLGPSRYBMBD-UHFFFAOYSA-N 2-aminopyridine Chemical compound NC1=CC=CC=N1 ICSNLGPSRYBMBD-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 2
- GVRDSQPRIZURHB-UHFFFAOYSA-N B.C(C)NCC.[Na] Chemical compound B.C(C)NCC.[Na] GVRDSQPRIZURHB-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004182 chemical digestion Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000029087 digestion Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 1
- KYEKHFSRAXRJBR-UHFFFAOYSA-M potassium;selenocyanate Chemical compound [K+].[Se-]C#N KYEKHFSRAXRJBR-UHFFFAOYSA-M 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- CRDYSYOERSZTHZ-UHFFFAOYSA-M selenocyanate Chemical compound [Se-]C#N CRDYSYOERSZTHZ-UHFFFAOYSA-M 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0542—Continuous temporary metal layer over metal pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1423—Applying catalyst before etching, e.g. plating catalyst in holes before etching circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19792932536 DE2932536A1 (de) | 1979-08-09 | 1979-08-09 | Verfahren zur herstellung von gedruckten schaltungen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH647372A5 true CH647372A5 (de) | 1985-01-15 |
Family
ID=6078196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH5489/80A CH647372A5 (de) | 1979-08-09 | 1980-07-17 | Verfahren zur herstellung von gedruckten schaltungen. |
Country Status (10)
| Country | Link |
|---|---|
| JP (1) | JPS5629395A (it) |
| CA (1) | CA1152226A (it) |
| CH (1) | CH647372A5 (it) |
| DE (1) | DE2932536A1 (it) |
| FR (1) | FR2463569B1 (it) |
| GB (1) | GB2057774B (it) |
| IE (1) | IE49971B1 (it) |
| IT (1) | IT1131716B (it) |
| NL (1) | NL8003939A (it) |
| SE (1) | SE454476B (it) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0090900B1 (en) * | 1982-04-05 | 1987-02-11 | Kanto Kasei Co., Ltd. | Process of manufacturing printed wiring boards and printed wiring boards manufactured by the same |
| FI88241C (fi) * | 1990-10-30 | 1993-04-13 | Nokia Mobile Phones Ltd | Foerfarande foer framstaellning av kretskort |
| US5358602A (en) * | 1993-12-06 | 1994-10-25 | Enthone-Omi Inc. | Method for manufacture of printed circuit boards |
| US5620612A (en) * | 1995-08-22 | 1997-04-15 | Macdermid, Incorporated | Method for the manufacture of printed circuit boards |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1378154A (fr) * | 1962-09-24 | 1964-11-13 | North American Aviation Inc | Interconnexions électriques pour panneaux de circuits imprimés |
| US3269861A (en) * | 1963-06-21 | 1966-08-30 | Day Company | Method for electroless copper plating |
| DE1690224B1 (de) * | 1967-08-29 | 1971-03-25 | Standard Elek K Lorenz Ag | Bad fuer die stromlose verkupferung von kunststoffplatten |
| FR2128355A1 (it) * | 1971-03-01 | 1972-10-20 | Fernseh Gmbh | |
| JPS5489276A (en) * | 1977-12-27 | 1979-07-16 | Fujitsu Ltd | Method of producing printed board |
-
1979
- 1979-08-09 DE DE19792932536 patent/DE2932536A1/de not_active Withdrawn
-
1980
- 1980-07-08 NL NL8003939A patent/NL8003939A/nl not_active Application Discontinuation
- 1980-07-17 CH CH5489/80A patent/CH647372A5/de not_active IP Right Cessation
- 1980-07-18 IT IT23530/80A patent/IT1131716B/it active
- 1980-07-29 SE SE8005443A patent/SE454476B/sv not_active IP Right Cessation
- 1980-08-07 FR FR8017460A patent/FR2463569B1/fr not_active Expired
- 1980-08-08 IE IE1669/80A patent/IE49971B1/en unknown
- 1980-08-08 JP JP10841080A patent/JPS5629395A/ja active Pending
- 1980-08-08 CA CA000357874A patent/CA1152226A/en not_active Expired
- 1980-08-08 GB GB8025868A patent/GB2057774B/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| IT8023530A0 (it) | 1980-07-18 |
| GB2057774B (en) | 1983-09-07 |
| JPS5629395A (en) | 1981-03-24 |
| FR2463569B1 (fr) | 1985-09-20 |
| NL8003939A (nl) | 1981-02-11 |
| SE8005443L (sv) | 1981-02-10 |
| IT1131716B (it) | 1986-06-25 |
| DE2932536A1 (de) | 1981-02-26 |
| IE49971B1 (en) | 1986-01-22 |
| GB2057774A (en) | 1981-04-01 |
| IE801669L (en) | 1981-02-09 |
| CA1152226A (en) | 1983-08-16 |
| FR2463569A1 (fr) | 1981-02-20 |
| SE454476B (sv) | 1988-05-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |