CA1106611A - Methode et appareil de polissage sans fixation de la piece - Google Patents

Methode et appareil de polissage sans fixation de la piece

Info

Publication number
CA1106611A
CA1106611A CA331,675A CA331675A CA1106611A CA 1106611 A CA1106611 A CA 1106611A CA 331675 A CA331675 A CA 331675A CA 1106611 A CA1106611 A CA 1106611A
Authority
CA
Canada
Prior art keywords
pad
workpiece
pads
polishing
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA331,675A
Other languages
English (en)
Inventor
Jagtar S. Basi
Vincent J. Lyons
Eric Mendel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of CA1106611A publication Critical patent/CA1106611A/fr
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CA331,675A 1978-08-15 1979-07-12 Methode et appareil de polissage sans fixation de la piece Expired CA1106611A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US93370578A 1978-08-15 1978-08-15
US933,705 1986-11-21

Publications (1)

Publication Number Publication Date
CA1106611A true CA1106611A (fr) 1981-08-11

Family

ID=25464383

Family Applications (1)

Application Number Title Priority Date Filing Date
CA331,675A Expired CA1106611A (fr) 1978-08-15 1979-07-12 Methode et appareil de polissage sans fixation de la piece

Country Status (5)

Country Link
EP (1) EP0008360B1 (fr)
JP (1) JPS5531582A (fr)
CA (1) CA1106611A (fr)
DE (1) DE2961004D1 (fr)
IT (1) IT1163691B (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6081959A (en) * 1996-07-01 2000-07-04 Umbrell; Richard Buffer centering system
US6105197A (en) * 1998-04-14 2000-08-22 Umbrell; Richard T. Centering system for buffing pad
US6298518B1 (en) 1998-04-14 2001-10-09 Richard T. Umbrell Heat dissipating buffing pad

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS639406Y2 (fr) * 1981-01-22 1988-03-19
US5533923A (en) * 1995-04-10 1996-07-09 Applied Materials, Inc. Chemical-mechanical polishing pad providing polishing unformity
DE10004578C1 (de) * 2000-02-03 2001-07-26 Wacker Siltronic Halbleitermat Verfahren zur Herstellung einer Halbleiterscheibe mit polierter Kante
DE102004010379A1 (de) * 2004-03-03 2005-09-22 Schott Ag Verfahren zur Herstellung von Wafern mit defektarmen Oberflächen, die Verwendung solcher Wafer und damit erhaltene elektronische Bauteile
JP5421628B2 (ja) * 2009-03-23 2014-02-19 富士紡ホールディングス株式会社 研磨布および研磨布の製造方法
JP5545536B2 (ja) * 2010-04-27 2014-07-09 株式会社Ｓｕｍｃｏ ウェーハの研磨方法、研磨パッド、研磨装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7010086A (fr) * 1969-07-18 1971-01-20
US3715842A (en) * 1970-07-02 1973-02-13 Tizon Chem Corp Silica polishing compositions having a reduced tendency to scratch silicon and germanium surfaces
NL7114274A (fr) * 1970-10-21 1972-04-25
US3691694A (en) * 1970-11-02 1972-09-19 Ibm Wafer polishing machine
DE2305188A1 (de) * 1973-02-02 1974-08-08 Wacker Chemitronic Verfahren zur herstellung von polierten halbleiteroberflaechen
JPS5363695A (en) * 1976-11-17 1978-06-07 Hitachi Ltd Method of finish polishing

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6081959A (en) * 1996-07-01 2000-07-04 Umbrell; Richard Buffer centering system
US6105197A (en) * 1998-04-14 2000-08-22 Umbrell; Richard T. Centering system for buffing pad
US6298518B1 (en) 1998-04-14 2001-10-09 Richard T. Umbrell Heat dissipating buffing pad

Also Published As

Publication number Publication date
JPS6234509B2 (fr) 1987-07-27
EP0008360B1 (fr) 1981-10-14
JPS5531582A (en) 1980-03-05
IT1163691B (it) 1987-04-08
EP0008360A1 (fr) 1980-03-05
DE2961004D1 (en) 1981-12-24
IT7924956A0 (it) 1979-08-07

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Legal Events

Date Code Title Description
MKEX Expiry