CA1099031A - Process and article for printed circuit board manufacture - Google Patents
Process and article for printed circuit board manufactureInfo
- Publication number
- CA1099031A CA1099031A CA299,132A CA299132A CA1099031A CA 1099031 A CA1099031 A CA 1099031A CA 299132 A CA299132 A CA 299132A CA 1099031 A CA1099031 A CA 1099031A
- Authority
- CA
- Canada
- Prior art keywords
- article
- copper
- copper layer
- contacting
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 42
- 229910052802 copper Inorganic materials 0.000 claims abstract description 41
- 239000010949 copper Substances 0.000 claims abstract description 41
- 239000003082 abrasive agent Substances 0.000 claims abstract description 10
- 239000007800 oxidant agent Substances 0.000 claims abstract description 7
- 239000000126 substance Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 15
- 230000000873 masking effect Effects 0.000 claims description 14
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 claims description 4
- 229960002218 sodium chlorite Drugs 0.000 claims description 4
- 239000001488 sodium phosphate Substances 0.000 claims description 4
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 claims description 4
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 229910000406 trisodium phosphate Inorganic materials 0.000 claims description 3
- 235000019801 trisodium phosphate Nutrition 0.000 claims description 3
- 238000000354 decomposition reaction Methods 0.000 claims description 2
- 239000000428 dust Substances 0.000 claims description 2
- 235000013312 flour Nutrition 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- 239000012858 resilient material Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims 1
- 239000000725 suspension Substances 0.000 claims 1
- 238000011282 treatment Methods 0.000 description 9
- 230000001590 oxidative effect Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000012876 carrier material Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000007900 aqueous suspension Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- RNLHVODSMDJCBR-VURMDHGXSA-N (z)-3-methyl-5-(2,2,3-trimethylcyclopent-3-en-1-yl)pent-4-en-2-ol Chemical compound CC(O)C(C)\C=C/C1CC=C(C)C1(C)C RNLHVODSMDJCBR-VURMDHGXSA-N 0.000 description 1
- 208000035874 Excoriation Diseases 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- NEHMKBQYUWJMIP-UHFFFAOYSA-N chloromethane Chemical compound ClC NEHMKBQYUWJMIP-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000000454 electroless metal deposition Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 235000011008 sodium phosphates Nutrition 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- ing And Chemical Polishing (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2713391A DE2713391C3 (de) | 1977-03-23 | 1977-03-23 | Verfahren zum Herstellen eines Trägermaterials für gedruckte Schaltungen |
| DEP2713391.1 | 1977-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1099031A true CA1099031A (en) | 1981-04-07 |
Family
ID=6004742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA299,132A Expired CA1099031A (en) | 1977-03-23 | 1978-03-17 | Process and article for printed circuit board manufacture |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JPS53147265A (de) |
| AT (1) | AT379279B (de) |
| AU (1) | AU516016B2 (de) |
| CA (1) | CA1099031A (de) |
| DE (1) | DE2713391C3 (de) |
| FR (1) | FR2385192A1 (de) |
| GB (1) | GB1588998A (de) |
| IT (1) | IT7848565A0 (de) |
| NL (1) | NL180163C (de) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0117258B1 (de) * | 1983-02-23 | 1987-05-20 | Ibm Deutschland Gmbh | Verfahren zur Herstellung von haftfesten Metallschichten auf Kunststoffsubstraten |
| JPS59227188A (ja) * | 1983-06-07 | 1984-12-20 | 松下電器産業株式会社 | プリント基板 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2997521A (en) * | 1960-04-11 | 1961-08-22 | Sanders Associates Inc | Insulated electric circuit assembly |
| US3481777A (en) * | 1967-02-17 | 1969-12-02 | Ibm | Electroless coating method for making printed circuits |
-
1977
- 1977-03-23 DE DE2713391A patent/DE2713391C3/de not_active Expired
-
1978
- 1978-03-17 CA CA299,132A patent/CA1099031A/en not_active Expired
- 1978-03-20 GB GB10853/78A patent/GB1588998A/en not_active Expired
- 1978-03-22 NL NLAANVRAGE7803106,A patent/NL180163C/xx not_active IP Right Cessation
- 1978-03-22 AT AT0205078A patent/AT379279B/de not_active IP Right Cessation
- 1978-03-23 IT IT7848565A patent/IT7848565A0/it unknown
- 1978-03-23 FR FR7808487A patent/FR2385192A1/fr active Granted
- 1978-03-23 JP JP3401678A patent/JPS53147265A/ja active Pending
- 1978-04-03 AU AU34697/78A patent/AU516016B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| AT379279B (de) | 1985-12-10 |
| FR2385192A1 (fr) | 1978-10-20 |
| DE2713391A1 (de) | 1978-09-28 |
| IT7848565A0 (it) | 1978-03-23 |
| NL180163B (nl) | 1986-08-01 |
| DE2713391B2 (de) | 1979-06-28 |
| ATA205078A (de) | 1985-04-15 |
| JPS53147265A (en) | 1978-12-21 |
| NL180163C (nl) | 1987-01-02 |
| AU3469778A (en) | 1979-10-11 |
| GB1588998A (en) | 1981-05-07 |
| FR2385192B1 (de) | 1980-10-17 |
| AU516016B2 (en) | 1981-05-14 |
| DE2713391C3 (de) | 1980-03-06 |
| NL7803106A (nl) | 1978-09-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0321067B1 (de) | Verfahren zur Behandlung einer Kupferoberfläche | |
| EP0380545B1 (de) | SCHALTUNGSPLATTENMATERIAL UND ELEKTROPLATTIERUNGSBAD FüR SEINE HERSTELLUNG | |
| US4601916A (en) | Process for bonding metals to electrophoretically deposited resin coatings | |
| US5501350A (en) | Process for producing printed wiring board | |
| US4597988A (en) | Process for preparing printed circuit board thru-holes | |
| US4705592A (en) | Process for producing printed circuits | |
| US4775444A (en) | Process for fabricating multilayer circuit boards | |
| US4336100A (en) | Method of production of electrically conductive panels and insulating base materials | |
| EP0352973B1 (de) | Verfahren zur Herstellung eines ein Kupferelement enthaltenden Verbundgegenstandes | |
| EP0170414B1 (de) | Verfahren zur Behandlung von Metalloberflächen | |
| US3884771A (en) | Process of producing resinous board having a rough surface usable for firmly supporting thereon a printed circuit | |
| US4810326A (en) | Interlaminate adhesion between polymeric materials and electrolytic copper surfaces | |
| US4144118A (en) | Method of providing printed circuits | |
| US5066366A (en) | Method for making foil | |
| US4724040A (en) | Method for producing electric circuits on a base boad | |
| US20040040148A1 (en) | Manufacture of flexible printed circuit boards | |
| CN1248300A (zh) | 微多孔性铜覆膜及用于制备该铜覆膜的化学镀铜液 | |
| CA1099031A (en) | Process and article for printed circuit board manufacture | |
| US4323632A (en) | Metal composites and laminates formed therefrom | |
| JPS59215790A (ja) | 印刷回路板の製造法 | |
| EP0187150B1 (de) | Zusammensetzung und verfahren zur konditionierung der oberfläche von kunststoffsubstraten vor der metallplattierung | |
| JPS63168077A (ja) | プリント配線板の製造法 | |
| CA1051559A (en) | Process for the production of printed circuits with solder rejecting sub-zones | |
| JPH0217953B2 (de) | ||
| US4234395A (en) | Metal composites and laminates formed therefrom |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |