CA1088281A - Attaching leads to integrated-circuit chips - Google Patents

Attaching leads to integrated-circuit chips

Info

Publication number
CA1088281A
CA1088281A CA255,403A CA255403A CA1088281A CA 1088281 A CA1088281 A CA 1088281A CA 255403 A CA255403 A CA 255403A CA 1088281 A CA1088281 A CA 1088281A
Authority
CA
Canada
Prior art keywords
predetermined
work station
filaments
carrier
end portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA255,403A
Other languages
English (en)
French (fr)
Inventor
Ronald Morino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/667,541 external-priority patent/US4140265A/en
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Priority to CA333,383A priority Critical patent/CA1088282A/en
Application granted granted Critical
Publication of CA1088281A publication Critical patent/CA1088281A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D295/00—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms
    • C07D295/04—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms
    • C07D295/12—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms
    • C07D295/125—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms with the ring nitrogen atoms and the substituent nitrogen atoms attached to the same carbon chain, which is not interrupted by carbocyclic rings
    • C07D295/13—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms with the ring nitrogen atoms and the substituent nitrogen atoms attached to the same carbon chain, which is not interrupted by carbocyclic rings to an acyclic saturated chain
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0444—Apparatus for wiring semiconductor or solid-state device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CA255,403A 1975-06-26 1976-06-22 Attaching leads to integrated-circuit chips Expired CA1088281A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA333,383A CA1088282A (en) 1975-06-26 1979-08-08 Atttaching leads to integrated-circuit chips

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US59057275A 1975-06-26 1975-06-26
US05/667,541 US4140265A (en) 1975-06-26 1976-03-16 Method and apparatus for positioning the end of a conductive filament at a predetermined and repeatable geometric location for coupling to a predetermined terminal area of an element
US667,541 1976-03-16
US590,572 1990-09-28

Publications (1)

Publication Number Publication Date
CA1088281A true CA1088281A (en) 1980-10-28

Family

ID=27080881

Family Applications (1)

Application Number Title Priority Date Filing Date
CA255,403A Expired CA1088281A (en) 1975-06-26 1976-06-22 Attaching leads to integrated-circuit chips

Country Status (10)

Country Link
JP (1) JPS524173A (ref)
AT (1) AT368320B (ref)
AU (1) AU507497B2 (ref)
CA (1) CA1088281A (ref)
CH (1) CH612296A5 (ref)
DE (1) DE2628519C3 (ref)
FR (1) FR2317770A1 (ref)
GB (1) GB1541274A (ref)
IT (1) IT1066563B (ref)
NL (1) NL7606943A (ref)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57143717A (en) * 1981-03-03 1982-09-06 Nippon Telegr & Teleph Corp <Ntt> Magnetic head for magnetic disk
GB2177639B (en) * 1985-07-08 1988-12-29 Philips Electronic Associated Ultrasonic wire bonder and method of manufacturing a semiconductor device therewith
DE4218741C2 (de) * 1992-06-06 1994-10-20 Vossloh Schwabe Gmbh Verfahren zum Verdrahten von Anschlußstellen elektrischer Geräte oder Baugruppenelemente
JPH07103897A (ja) * 1993-09-30 1995-04-21 Shimadzu Corp 発光分光分析装置
DE102008048081B4 (de) 2008-09-19 2015-06-18 Cascade Microtech, Inc. Verfahren zur Prüfung elektronischer Bauelemente einer Wiederholstruktur unter definierten thermischen Bedingungen
DE102020117641A1 (de) * 2020-07-03 2022-01-05 Hesse Gmbh Drahtführungsmodul und Ultraschall-Drahtbonder hiermit

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL142018B (nl) * 1964-11-26 1974-04-16 Philips Nv Werkwijze tot het vervaardigen van een halfgeleidende inrichting en inrichting vervaardigd volgens de werkwijze.
BE755950A (fr) * 1969-09-11 1971-03-09 Philips Nv Procede permettant d'etablir des liaisons electriques entre desemplacements de contact d'un corps semiconducteur et des conducteurs d'alimentation
US3648354A (en) * 1969-11-17 1972-03-14 Gen Motors Corp Tailless bonder for filamentary wire leads

Also Published As

Publication number Publication date
FR2317770A1 (fr) 1977-02-04
GB1541274A (en) 1979-02-28
IT1066563B (it) 1985-03-12
AT368320B (de) 1982-10-11
CH612296A5 (en) 1979-07-13
AU507497B2 (en) 1980-02-14
ATA458876A (de) 1982-01-15
NL7606943A (nl) 1976-12-28
DE2628519B2 (de) 1980-10-02
JPS524173A (en) 1977-01-13
AU1437076A (en) 1977-12-01
JPS5750057B2 (ref) 1982-10-25
DE2628519C3 (de) 1981-06-04
DE2628519A1 (de) 1976-12-30
FR2317770B1 (ref) 1978-05-05

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Legal Events

Date Code Title Description
MKEX Expiry