CA1088281A - Attaching leads to integrated-circuit chips - Google Patents
Attaching leads to integrated-circuit chipsInfo
- Publication number
- CA1088281A CA1088281A CA255,403A CA255403A CA1088281A CA 1088281 A CA1088281 A CA 1088281A CA 255403 A CA255403 A CA 255403A CA 1088281 A CA1088281 A CA 1088281A
- Authority
- CA
- Canada
- Prior art keywords
- predetermined
- work station
- filaments
- carrier
- end portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D295/00—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms
- C07D295/04—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms
- C07D295/12—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms
- C07D295/125—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms with the ring nitrogen atoms and the substituent nitrogen atoms attached to the same carbon chain, which is not interrupted by carbocyclic rings
- C07D295/13—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms with the ring nitrogen atoms and the substituent nitrogen atoms attached to the same carbon chain, which is not interrupted by carbocyclic rings to an acyclic saturated chain
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01021—Scandium [Sc]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0106—Neodymium [Nd]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01075—Rhenium [Re]
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/1026—Compound semiconductors
- H01L2924/1027—IV
- H01L2924/10272—Silicon Carbide [SiC]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Abstract of the Disclosure Coupling of the end portion of a continuous conductive filament to an element mountable at a work station is attained in accordance with the method and apparatus of the instant invention by emplacing the conductive filament from a feed means so that the end portion of the conductive filament is congruent with a predetermined geometric location, and arranging the feed means relative to the work station so that the geometric locus defined by the position of the emplaced conductive filament is predetermined and repeatable.
Advantageously, the continuous conductive filament may be emplaced by pushing or pulling. The end portion is thereafter joined to a predetermined terminal area on an element which is coextensive with the predetermined geometric location.
Preferably, the conductive filament is subsequently joined to a second terminal area then cut or broken to form a permanent or temporary package. Moreover, in the preferred embodiment of the invention a plurality of continuous conductive filaments are initially joined in a gang to predetermined areas of the element and subsequently to predetermined terminal areas of a carrier member to form a permanent or temporary package.
Advantageously, the continuous conductive filament may be emplaced by pushing or pulling. The end portion is thereafter joined to a predetermined terminal area on an element which is coextensive with the predetermined geometric location.
Preferably, the conductive filament is subsequently joined to a second terminal area then cut or broken to form a permanent or temporary package. Moreover, in the preferred embodiment of the invention a plurality of continuous conductive filaments are initially joined in a gang to predetermined areas of the element and subsequently to predetermined terminal areas of a carrier member to form a permanent or temporary package.
Description
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~ 1088281 i ~ . . .
., ¦ 5 The present invention relates to terminal connector 6 systems, and more specifically to a method ant apparatus for ~ coupling a continuous conductive filament to a predetermined 8 terminal area of an element. The term "terminal area" as used 9 herein includes defined areas of integrated circuits, term~nat-io ing harnesses, hybrid circuits, printed circuits, optlcal ~;
~11 circuits, and fluidic circuits. In the preferret embod~ments, ~12 a plurality ~f continuous conductive filaments are ~oinet ~ ~ ~ to predetermined terminal areas tpads) of an element and -l ~ ~ subsequently ~oined to predetermined terminal areas o a ~15 carrier member.
With the aid of advanced technology, the cost of processing integrated cLrcults has fallen. Howeverj in contrast, the assembly of integrated circuits has remained ~
substantially a manunl operation so that with escalating -~ ~-wages the cost of assembly has steadily risen.
¦ ~ Generally, wire bonding has been the most commonly 22~ used t~chnique for connecting leads to integrated circuit i~ 23 ~ ¦ chipY. The ~cneral approach to wire bonding has been a ~24~ manual appro~ch to effcct a sequcnce of bonds ona at a time.
~Gcnerally, in carrying out the manual wirc bonding approach, ; 26`~ nn operator, ~7ith the aid of a microscope and manipul~tor, l~; ¦ m~ Iy posit~on~ ~ ~irc ~nd ~iFC bondinr5 tool to bond - ,'.:, . ,, ' '~
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1 a wire to a pad on an integrated circuit chip and then to 8
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., ¦ 5 The present invention relates to terminal connector 6 systems, and more specifically to a method ant apparatus for ~ coupling a continuous conductive filament to a predetermined 8 terminal area of an element. The term "terminal area" as used 9 herein includes defined areas of integrated circuits, term~nat-io ing harnesses, hybrid circuits, printed circuits, optlcal ~;
~11 circuits, and fluidic circuits. In the preferret embod~ments, ~12 a plurality ~f continuous conductive filaments are ~oinet ~ ~ ~ to predetermined terminal areas tpads) of an element and -l ~ ~ subsequently ~oined to predetermined terminal areas o a ~15 carrier member.
With the aid of advanced technology, the cost of processing integrated cLrcults has fallen. Howeverj in contrast, the assembly of integrated circuits has remained ~
substantially a manunl operation so that with escalating -~ ~-wages the cost of assembly has steadily risen.
¦ ~ Generally, wire bonding has been the most commonly 22~ used t~chnique for connecting leads to integrated circuit i~ 23 ~ ¦ chipY. The ~cneral approach to wire bonding has been a ~24~ manual appro~ch to effcct a sequcnce of bonds ona at a time.
~Gcnerally, in carrying out the manual wirc bonding approach, ; 26`~ nn operator, ~7ith the aid of a microscope and manipul~tor, l~; ¦ m~ Iy posit~on~ ~ ~irc ~nd ~iFC bondinr5 tool to bond - ,'.:, . ,, ' '~
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1 a wire to a pad on an integrated circuit chip and then to 8
2 finger of a lead frsme. The wire is then broken. Thi9
3 sequence i9 repeated for each pad on the integrated clrcult
4 chip. This manual approach to wire bonding adds appreciably to the cost of assembling integrated circuit packages.
6 Additionally, uncontrolled breaking of the bonded wires often 7 results in fracturing of the bonds causing early failure during use.
Attempts to automate the wire bonding operation with programmed tool movement and bonding sequences has resulted 11 in some improvement over the aforementioned manual approach.
12 However, a sequential de of operation as well as the need 13 to preciseLy position the integrated circuit chip relative 14 to certain reference points has prevented any broad acceptance ~f automatic wire bonders.
16 Various other techniques have challenged the afore-17 mentioned wire bonding techniques. However, these other 18 techniques are costly and not readily adaptable to the large 19 number of integrated circuit chip geometries encountered.
A relatively recent approach to coupling leads to 21 integrated circuit chips involves the use of an automated 22 film-carrier. Uith the film-carrler assembly approaeh, the 23 film carries a copper lead frame. The inner ends of the 24 leads are gang bonded to pads on an inte8rated circuit chip by an inner lead bonder.~ After blanking or punching these 26 leads are extended outwardly in cantilever fashion and are gang bonded to a package, i.e., a dual-in-line, or a ,: ~ .
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1 flexible or rigid circuit board. Sprocket holes along ~kuq~
the sides of the film are used to enable the drive mechanism C 3 for the inner lead bonder to advance the film after the 4 lntegrated circuit chip has been bonded to the film-carrier and a}so to register the lead frame over an integrated circuit 6 chipo 7 In addition to adding significantly to thé cost of the asse~bled package, with the film-carrier assembly approach, g the film-carrier must be carefully handled since the film is sub~ect to dimensional instability ant the leads are easily 11 deflected out of position during handling.
12 Details of the aforementioned film-carrier assembly 13 technique as well as other approaches to connecting leads to 14 integrated circuit chips is found in the article entitled '~lm-Carrier Technique Automates The Packaging Of IC Chips", 16 by Stephen E. Grossm 1-, Electronics, May 16, 1974 issue, pp.
17 89~95.
~ ~ 18 It is an ob~ect of the present invention to f~ ~ 19 provide an improved method and apparatus for ~oining a continuous conductive filament to a predetermined terminal 21 area of an element which overcomes the disadvantages of the 22 afor~mentioned prior ar~ techniques.
23 It is another object of the present invention to 24 provide a method and apparatus for reliably positioning the end of a continuous conductive filament at a predetermined 26 and repeatable geometric location to enable automatic assembly ~` of a contuctive filament to an element.
.:
lOt~8281 It is a still further object of the present invention to provide a method and apparatus for reliably joining the conductive filament to a second terminal area to enable the automated assembly of elements to form a permanent or temporar~v package.
It is a still further object of the present invention to provide a method and apparatus for fully automating the assembly of integrated circuit chip packages.
~It is a still further object of the present invention 'jY~10 to provide a method and apparatus for connecting leads to integrated circuit chips at greatly reduced cost.
Other objects, aspects, and advantages of the present invention will be apparent from the specification and the ~accampanying drawings.
-~Thus, one aspect of the present invention is defined as the improvement in a method for coupling the end portion of each of a plurality of continuous conductive filaments to an `~ 'element mountable at a work station, the improvement comprising:
establishing a plurality of predeterminea fixed paths between t~e end portions of the conductive filaments and the work station;
simultaneously pushing a fixed length of each of the conductive filaments including its end portion to move the filaments through the predetermined fixed paths and cause the end portions to assume ;~stationary and unsupported positions over the work station; sub-sequently joining the end portions positioned over the work station to predetermined terminal areas of the element mounted at the work station; positioning the element with the end portions of 28 the conductor filaments joined thereto in stationary position over ~, .
'' A ~ ~ 6 ~',, , 2~31 a carrier having terminal areas for receiving the conductor fila-ments; registering a predetermined portion of each of the conductor filaments with a terminal area of the carrier; joining the pre-determined portion of each of the conductor filaments with the registered terminal area of the carrier; and cutting the portions of the conductor filaments joining the terminal areas of the element with the terminal areas of the carrier from the remainder of the conductor filaments.
Another aspect of the present invention is defined as 10 the improvement in an apparatus for coupling the end portion of each of the plurality of continuous conductive filaments to an element mountable at a work station, the improvement comprising: -annular guide plate means for establishing a plurality of predeter-; mined fixed paths between the end portion of each of a plurality of the conductive filaments and the work station; feed means for pushing fixed lengths of each of the plurality of the conductive s filaments including the end portion thereof to move each the con-ductive filament along the annular guide plate and through the predetermined fixed paths and cause the end portions to assume 20 stationary and unsupported positions over the work station; and joining means for subsequently joining the end portions positioned , ~
over the work station to predetermined terminal areas of the element mounted at the work station.
~ The preferred embodiments of the present invention f~ are illustrated in the accompanying drawings. However, it should be expressly understood that the method and apparatus of the present invention should not be construed to be 28 limited solely to the preferred embodiments. The drawings are as follows:
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1~8281 FIGURE 1 is a top plan view of an apparatus for joining a plurality of continuous conductive filaments to pre-determined terminal areas (pads) of an element (integrated circuit chip) in accordance with the instant invention.
FIGURE 2 is a cross-sectional view taken along line , 2-2 of Fig. 1 and showing additional components of the apparatus;
r FIGURE 3 is a partial sectional view simllar to 10 Fig. 2 showing the suspended integrated circuit chip after -the continuous conductive filaments are joined thereto;
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1~88281 I FIGURE 4 is a partial cross-sectional view, wirh 2 parts broke~ away, show~ng a carrier bon~ing head and a carrier . 3 feed means for bonding the integrated circuit chip to a carrier .~ mem~er; . . .
FIGURES 5-7 are sectioral views s~m~lar to Figs. 2-4, : 6 showing another embodiment according to the present lnvention . :
~: ln which the apparatus moves inwardly and outwardly relative 8 to the work stat~on to deliver continuous conductive filaments ~ to registered integrated circuit chips for ~oining the fila~ents s 10 thereto and to facilitate subsequent joining to a carrier 11 member ; . ~
. 12 FIGURE 8 is a top plan view of another apparatu9 13 ~n accordance with the present invention for ~oining a plurality 14 of continuous conductive filaments to predetermined termLnal . 15 areas ~pads) of an element (integrated circuit chip);
.- 16 FIGURE 9 a cross-sectional view taken along line :~ : }7 9-g of Fig.8 showing a pair of filament guide members in their ~; 18 forwarded position, . 19 FIGURE ~ is a partial sectional view similar toFig.g , with parts broken away, showing the ends of a pair .~ 21 of continuous conductive filaments being 30ined to an 22 integrated c~rcuit chip with the filament guide me~bers in 23 their retracted position:
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FIGUREIl is a partial sectional view similar to 2 Flg. 9, with parts broken away, showing the filament guide 3 members in their intermediate position;
4 FlGURE 12 is a partial sectional view similar to Fig. 9, with parts broken away, showing the filament guide 6 ~e~bers in their intermediate position with the carrier bonding head in contact with the joined filaments;
8 FlGURE 13 is an enlarged view of one embodiment 9 of the carrier bonding head for introducing a notch into the joined filaments;
11 FIGURE 14 is an enlarged view of another embodiment 12 for introducing a notch into the ~oined filaments; and 13 FIGURE 15 is a partial sectional view similar to 14 Fig. 9~ with parts broken away, showing the joined fiia~ents postlons separated from the remainder of the continuous 16 conductive filaments and the filament guide members in their 17 retracted position.
18 Refërring to Fig. 1, an apparatus in accordance with 19 the present invention for ~oining continuous conductive filaments to terminal areas of integrated circuit chips is illustrated 21 generally at 10, Although the apparatus 10 is illustrated with 22 wire and integrated circuit chips, it shollld be undcrstood that 23 it is not so limlted, but may be employed to join conductive 24 filaments to any of the aforementioned terminal areas~. As previously mentioned the term "term~nal areas" as used herein 26 shoult be construed to include fixed areas of integrated 27 Fircuits-, terminating harnesses, hybrid circuitsV printed ~;' , ,i~ " . .
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1 circuits, optical circuiCs, and fluidic circuits. The tenm "~oln" or "joining" as used herein includes any technique 1 3 for providin~ the desired electrical, optical, or fluidic 4 connection. Examples of ~oining techniques are thermo-S compression bonding, ultrasonic bonding, adhesive bonding, soldering, welding, mechanical fastening, and the like.
7 The apparatus 10 includes a plurality of filament 8 eed channels 14A-X corresponding in number to the number of continuous conductive filaments, here wires 15A-X, to be ~; 10 ~oined to an element, here an integrated circuit chip 12.
; 11 As shown in Fig. 1, the apparatus 10 includes 24 filament 1~ feed channels 14A-X. Generally,-the number of filament feet 13 ¦ channels 14 will vary, as desired; 14 to 40 filament feed 14 channels 14 are commonly used for providing 14 to 40 connections to an integ;ated circuit chip 12. Each filament feed channel 16 14A-X includes a supply means, here spools 16A-X of fine metal ~ 17 wire lSA-X, hitch feed drives 18A-X for clamping and pushing `~ 18 the fine metal wire 15A-X, telescoping tubes l9A-X, conveying ,, 19 tubes 20A-X, and a filament cutter 22 having apertures 23A-Xj see Fig. 2. A recessed fila~ent guide plate 24 is positioned ~5' 21 below the filament cutter 22. The recessed filament g~ide 22 plate 24 has a plurali~y of machined grooves 26A-X for ; 23 receiving the fine wires 15A-X exiting from the conveying tubes ~ 2246 ¦¦ 20A-X ~nd llament cutter 22.
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iV~8;~81 The machined grooves 26A-X extend along the upper surface of the recessed filament guide plate 24 to a central aperture or window 28 of the recessed filament guide plate 24, The shape of the aperture or window 28 of the recessed filament i guide plate 24 is generally chosen to conform with the geometry of the integrated circuit chip 12 to which the wires 15A-X are to be joined. As shown in Fig. 1, the window 28 is generally rectangular or square in shape for use with similarly shaped ~ integrated circuit chips 12. However, it should be understood . 10 that integrated circuit chips having different geometries may be used with the apparatus 10 by simply changing the recessed wire guide plate 24 with a recessed wire guide plate conforming to the configuration of the integrated circuit chips to be used.
Advantageously, the width of the machined grooves 26A-X is slightly greater than the diameter of the fine wire 15A-X, e.g., about.0003" greater, to ensure that the fine wires 15A-X exiting .
from the wire cutter 22 pass easily into the machined grooves 26A-X and therethrough to the integrated circuit chip 12.
Referring to Fig. 2, apparatus 10 is positioned with ~i the window 28 overlying a work station 30. Integrated circuit chips 12A-N are successively registered at the work station 30 prior to joining the end portions of the wires to the ! integrated circuit chips. It should be understood that the sequence of operation is the same and is occurring simultaneously in each filament feed channel 14A-X. Therefore, for the sake of clarity, only the operation of the two filament feed channels 14A and 14M illustrated in Figs. 2-4 will be described.
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Advantageously, the integrated circuit chips 12A-N
may be formed as a wafer 32. The wafer 32 is securely mounted to a carrier plate 33 with an adhesive 36, e.g., wa~, having a low melting point. The wafer is then precisely cut into individual chips, e.g., with a diamond saw, and the carrier plate 33 is positioned on and registered with a suitably controlled X-Y table 34 for registering the integrated circuit chips 12A-N at the work station 30. See, e.g., United States Patent 3,706,409 (Lederer) for a discussion of one ` 10 technique for mounting and cutting a wafer, and positioning the cut chips or pellets at a work station for bonding leads thereto. `~
It should be understood that it is also within the scope of the instant invention to orient individual chips f manually or with the assistance of manipulators and a mi¢rosoope, or automatically with the use of optical recognition and positioning devices. With these latter approaches the wafer can be scribed and individual chips broken therefrom without the need to mount the wafer to an adhesive layer and then cut it into individual chips as described in the aforesaid Lederer patent.
~- The fine metal wire lSA-X may be bare metal or it may be insulated with heat strippable polyurethane. The metal ~, may be copper, gold plated copper, tinned copper, gold, or aluminum of any desired cross-sectional configuration with - a thickness or diameter in the range of about .7 mil to about 4 mils, normally 2 mils.
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~01~8Z81 The machined grooves 26A and 26M of the recessed filament guide plate 24 have their entrant ends enlarged or funnel-shaped to aid in capturing the ends of the wires exiting from the wire cutter 22. The machined grooves 26A and 26M
then guide the ends of the fine wire to the window 28 and precisely locate or register the wire end portions over the work station 30 closely spaced over or in contact with the terminal areas in the form of pads 37 on the integrated circuit chip 12A registered at the work station 30, Each integrated circuit chip 12A-N has a number of pads 37 corresponding to the number of fine wires 15 to be joined thereto, The pads 37 are advantageously gold topped or topped with solder to facilitate joining of the wire end portions thereto, as will be described below.
The X-Y table 34, the hitch feed drives 18A and 18M, the telescoping tubes l9A and l9M, the conveying tubes 20A and 20M, and the recessed filament guide plate 24 coact to ensure that the end portions of the fine wires are registered over the pads 37.
:~ 20 Each of the hitch feed drives 18A and 18M includes a stationary clamping member 38A and 38M and a movable clamping member 40A and 40M, respectively, which coact to clamp and pull the fine wire from the spools 16A and 16M, respectively. The length of the wire feed is advantageously adjustable in small increments in accordance with activation of the hitch feed drives 18A and 18M to feed fixed lengths of wire 15A and 15M
to the pads 37.
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.
8~32~1 The fine wire is fed by pneumatically activating the movable clamping mem~ers 40A and 40M so that pistons 42A and 42~ clamp tightly the wires 15A and 15M. Pistons 44A and 44M
are then pneumatically activated to slide housings 46A and 46M
along guides 48A and 48M. The clamped wires 15A and 15M are pushed through telescoping tubes l9A and l9M which are interconnected between slidable housings 46A and 46M and stationary piston housings 50A and 50M, respectively. The telescoping tubes l9A and l9M include smaller diameter tubes 52A and 52M, joined at one end to the slidable housings 46A and 46M, respectively, and larger diameter tubes 54A and 54M joined at one end to the stationary piston housings 50A and 50M. When the movable clamping members 40A and 40M slide forward on the guides 48A and 48M, the smaller diameter tubes 52A and 52M
telescope within the larger diameter tubes 54A and 54M, respectively.
Arranged on the side of housings 50A and 50M opposite to the telescoping tubes l9A and l9M are conveying tubes 20A
and 20M. The conveying tubes 20A and 20M have one end joined ,t~` 20 to stationary housings 50A and 50M and their other ends mounted within a rotatable support plate 60. The rotatable support ; plate 60 also includes channels 62A and 62M for receiving the wire exiting from the conveying tubes 20A and 20M. Positioned ~` below the rotatable support plate 60 is the stationary filament cutter 22. The filament cutter 22 includes enlarged apertures -~ 23A and 23M to receive the fine wires 15A and 15M. Positioned ~ -,~r below the wire cutter 22 and aligned with apertures 23A and 23M are machined grooves 26A and 26M of recessed filament f~ guide plate 2~.
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` ~088281 ~ Thus, the fine and flexible wires 15A and 15r~ are ¦ fully supported and guided along a closely confined fixed path - from the points of engagement by the movable clamping members 40A and 40M to the window 28. Thereafter, the fine wire 15A
and 15M is unsupported over an extension of the fixed path for a short distance and extends over the work station 30 with the end portions registered in a stationary position over predetermined fixed areas of the work station 30. It has generally been found that the maximum length of the total fixed path from the point of engagement of the wires 15A and 15r~ with the movable clamping members 40A and 40M to the end portions of the wires 15A and 15M registered over the predetermined fixed ~; areas of the work station 30 is approximately three orders of magnitude greater than the wire diameter, i,eO, 1000 times greater. Therefore, approximately 2 inches for 2 mil wire.
The end portions of the wires 15A and 15M exiting from the recessed filament guide plate 24 are unsupported for a relatively short distance of approximately 10 mils to 30 mils and assume a stationary position over the work station 30 for subsequent joining to predetermined areas or pads 37 of an ~ integrated circuit chip 12A mounted at the work station 30.
¦ When the wire end portions are registered over the pads 37 at the work station 30, a chip bonding head 64, e.g., which may advantageously be continuously or pulse heated, is reciprocated downwardly for simultaneous contact with all the ~ wire end portions registered over the pads 37, The heated chip '~ bonding head 64 effects a thermocompression bond of the wire ~ "
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end portions. If the integrated circuit chips 12 are conveyed to the work station 30 in wafer form, the heat generated by the bonding head 64 also melts the wax 36 and frees the individual integrated circuit chip 12A from the carrier plate 33.
After the wire end portions are bonded to the pads 37, the stationary clamping members 38A and 38M are pneumatically activated and pistons 66A and 66M grip the wires 15A and 15M.
Pistons 42A and 42M, and 44A and 44M are then deactivated and 10the housings 46A and 46M, along with attached smaller diameter tubes 52A and 52M, return to the position shown in Fig. 2 under ' influence of return springs (not shown) coupled to slidable -~-I housing 46A and 46M.
~ The chip bonding head 64 is then reciprocated -~
i;~ upwardly and to the right, and the X-Y table 34 and recessed -,~ , .
filament guide plate 24 are reciprocated downwardly and to the right, see Fig. 3. Thus, when the X-Y table 34 and ,~. . .
recessed filament guide plate 24 are moved away from the integrated circuit chip 12A, the integrated circuit chip 12A is effectively held suspended by the bonded wire portions, see Fig. 3. As shown in Figs. 2 and 3, a carried feed member 67, which carries a permanent or temporary carrier member or lead frame 68, is mechanically coupled to the X-Y table 34 and moved :
; ~ therewith via a shuttle 70. The shuttle 70 moves the carrier member 68 into registration with the bonded integrated circuit chip 12A at the work station 30. (Alternatively, the bonded ~; integrated circuit chip 12A may be conveyed to a second work t~ station, above the carrier feed member 67, as desired.), -,~ - 16 -s~ - bm:
, ~ .,:: - , , ,,~ ' , ~ .
10~82~1 The shuttle 70 may be driven by a suitable servomotor to alternately position the X-Y table 34 (integrated circuit chips) and the carrier feed member 66 (carrier members) at the work station 30.
As shown in Fig. 4, the carrier feed member 67 moves to the right and upwardly to engage and support the suspended integrated circuit chip 12A at the work station 30, While the pistons 66A and 66M are still gripping the wires 15A and 15M, a carrier bonding head 78 is reciprocated downwardly into contact with predetermined portions of the fine wires 15A and 15M to bond the predetermined wire portions to the carrier member 68. ~eat may be generated in the carrier bonding head 78 by an electric current or if the carrier member 68 is a temporary thermoplastic carrier, ultrasonic heating may be advantageously employed.
The integrated circuit chips 12A-N may be advantageously joined to permanent frames, such as a DIP
(Dual-In-Line-Package)lead frames, or to temporary carrier frames. Advantageously, heavier wires may be used for joining the integrated circuit chips to inexpensive ~, sprocketed film having apertures for accommodating the ~- integrated circuit chips and leads extending outwardly therefrom. Subsequently the outer ends of the wires may be directly joined to terminal areas on hybrid circuits or printed circuits, as desired ~. ,.
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1 Wh'le the carrier bonding head 78 is in contact 2 wit~ the fine wires 15A and 15M, as sho~ in Fig. 4, the ~ rotatable cupport plate 60 is rotated, e.g., 3 to 4', relat~ve i to the stationary .ila~ent cutter 22 to shear or cut the bonded w~re portions 74A and 74M from the remaining fine wire portions 6 76A and 76M. The wire portions 74A and 74M includes short - C stubs 72A and 72~ which protrude slightly upward from ~b~$r 8 their point of jointure with the carrier member 68. It ; 9 should be understood that in some applications it may bei 10 desirable tO cut the wires prior to bonding them to the carrier 11 member 68.
12 Referring to Figs. 5-7, elements si~ilar to those 13 appearing in Figq. 1-4 are s~m~-larly nu~bered. ~owever, in ~ 14 this embod;~ent the support plate 60 is fragmented into ;~; 15 a nu~b-r of support elements 83A-~ corresponding with the 17 number of wires 15A-~, and the filament gu~de plate 24 is ~; eliminated. Moreover, suDDort elements 83A and 83~ include `i~` 18 I elongate ch&~nels 62A1 2nd 6Z~' and the conveying tubes 20A
.''.~ , 19 . and 20M are eliminated. Additionally, ~ilament cutter 22, -~ 20 ~ ~ 21 wh;ch was positioned below rotatable support plate 60 in 22 Figs 1-4, is replaced with cutter me~bers 80A and 80~ ~unted ;~ 23 on the upper sur~ace of support elements a3A and 83~ and 24 having cutter elements 82A and 82M positioned a~ove correspondin, e~ t or ~ic ~ 84A and 84M oE ch~o~els 62A' and ~
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i 1 Referring specifically to Fig. S, preferably after an integrated circuit chip 12A is positioned at the work station 30, 3 support elements 83A ~nd 83~ are driven inwardly by pneu~atically activated pistons 86A and 86M to position exit orifices 84A ant 84M in closely spaced relat~onship with the work station 30 a~d ~, at a fixed distance from pads 37. A fixed length of the wires .~ ~ 15A and l~M is then pushed or projected fro~ the exit arifices 84h and 8~M and moves along an unsupported f~xed path so that the 9 wire end portlons register over the pads 37. S~bsequently, ch~p bonding head 64 is operated as described with reference to Figs.
il 2 and 3. Return springs (not shown) couple the support ele~nnts 12 83A and 83.~I to a stationa~y rra e 90 to return the support ele-13 ments 83A and 83.'I to the position shown in Fig. 6 after bondi 14 is conpleted and the ?istons 86A and 86~I are deactivated.
. 15 The inward ~ove~ent or su?~ort ele~ents 83.~ and 83M iQ
j 16 controlled by stops 88A and 88M, see Fig. 5, and the outward ..
17. movement of the support elements. 60A ant 60M is controlled 18 b~ stops 89A and 89M, see Fig. 6.
19 Referring to Fig. 6, subsequent to the gang b~r.ding ..
. .-, operation of Fig. 5, the bonding head 64 is ~oved upwardly . . snd to the right (see arrow), ant the X Y table 34 is vet i 23 downwardly and to the -ighe (see arrow), and the pistons ~ 24 86A and 86M a.e deactivated to return the support ele~ents :~ 25 83A and 83~ to the position shown in Fig. 6, thereby exposing . 26 predetermi~ed lengths of wires ~A and 92~. The gang bonded ~¦ 2/ li~teg - =d ie cbi7 1~ r _ s uspc~ded a~
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. 11 1088Z8~
. . , . . , 1 described with reference to Fig. 3. The~ the shuttle 70 2 positions the carrier feed me~ber 67 at the ~ork station 30 3 for supporting the integrated circuit chip 12`A znd reg~stering 4 the carrier memDer 68 with the wires 92A and 92~, see Flg. 7.
Ihe predetermined leni~ths of wires 92A and 92~ are then .
bonded to the carrier member 68 by carrier bonding head 78. .
7 Positioned atjacent to the outer surface of the bonding bead 8 78 and in contact therewith vla bearings 91 is a reciprocata~le g ~ember 94 which is moved d~nwardly to engage cutter ~embers -~
80A ,,~nd 80M' and depress cutter elements 8æA and 80~ for il cutting the ~ire portions 92~ znd 92~ while the fra~e 12 bonding head 78 is in contact therewith.
13 . ...................................... ..... __ _. . .
14 Generally, the sequence of operation of the embodiments of the present invention in accordance with Figures 1-7 is as 16 follous: .
17 An integrated circuit chip 12A is registered at the wor c 18 station 30, Remotely positioned fine wire is pullet irom spools 19 16A-X by energizing the hitch feed drives 18A-X and the wire end portions travel along predetermined fi~ed paths for 21 registration over the work station 30, specifically over pads 37 22 of the registered integratet circu~t chip 12A, The wire end 23 port~ons are then joined in a gang to the pads 37 by the chip 24 bonding head 64, which is then moved away from the work station 30. While the wax 36 ~nder the integrated circuit chip 12 is 26 in the molten state, the X-Y table 34 and the portions of the 27 predetermined fixed paths (filament guide plates 24 or support .
. ~ - 20 -~ . ' . ~ ~
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.~ 88281 ~ elements 83) ~d~acent the work station 30 are removed there-S 2 from, so that the bonded integrated circuit chip 12A is suspended ii 3 at the work station 30. The carrier feed member 67 carrying a csrrier member 68 is then moved into position at the work station 30 to support the integrated circuit chip 12 and register the ~, 6 carrier frame 68 with predetermined portions of the lengths of ;~ 7 fine wires bonted to the integratet circuit chip 12A. The 8 carrier bonding head 78 is then moved into contact with the 9 predetenmined portions for bonding the predetermined portions in a gang to the carrier me~ber 68. While the carrier bonding 1 head 78 is engaging the fine wire portions, a filament cutter 22 12 or 80 is activated to simultaneously shear or cut predetermined 13 lengths of the bonded wires. The bonded integratet circu~t 14 chip 12A and carrier member 68, the carrier bonding head 78, ~` 15 and carrier feed member 67 are then removed from the work ~ ~ 16 station 30 and the X-iY table 34 is reactivated for registering ii 17 -another integrated circuit chip at the work station 30. The ii~ lô abovementioned sequence of operation is then repeated ~` 19 continuously to produce completed integrated circuit packages.
Thus, gang bondi~g of t'he ent portions of f~e wires 21 to pads 37 on an integrated circuit chip 12A (inner bond) a~d , ~ 22 subsequentl~ g&~g bond~ng o~ o~her predet~r~ined pQrt~ons o~ t'he ,i onded flne wires to a carrier ~s~er 68 (outer bond) is rapidly :: 24 ant reliabIy achieved with an expected capability of providing in excess of 1000 comp~eted integrated circuit packages per hour.
~ ~ 227 "~ '' ' ' . ~~~ ' : , ; ~ ~ `: - 21 -~ ,,,~ . .~ ,' '.
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1 Referr~ng to Fig. 8~ an apparatus in accordance 2 -with the present inventi~n for ~oinin~ continuous conductiv~
~3 filaments to terminal areas of ~ntegrated circuit chips is 4 llluserated generally at 1- : :
~lthough the apparatus 100is shown in use with wi.e 6 ll~A-X and an integrated circuit chip 112,it should be understood 7 that it is not so limited, but may be employed to ~oin 8 continuous conductive filame~ts to any of the aforementioned g terminal areas The apparatus lCDincludes a plurality of ~ ~
filament or wi~a guide members 114A-Xcorresponding in 3~r . :
il ¦ number to the nu~ber of continuous conductive filsments, 12 ¦ here wires 115A-X,to be ~oined to an element, here a~
13 ¦ integrated c rcuit chip i2. As shown in Fig. 8a ~he ~ 1 14 ¦ apparatus ~ includes 24 filament guide members 114A-X. ~l ¦ Generally, the number of filament guide memberstl4 will vary, as 16 ¦ desired. As prev~ously mentioned, usually 14 to 40 filamen~
17 guide mPmbers will be used for providing 14 to 40 connections to 18 ¦ an integrated circuit chi~ 112. Each filament guite mQmber 19 ¦ 114A-X includes a supply means, here spools 116A-X of fine ¦ metal wire 115A-X~ stationary elements 118A-X, translatable 21 ¦ guide portions ll9A-~, filament_~uide channels 120A-X, having 22 I exit apertures lZ2A-X, and clampin~ means 123A-~ for en~agin~
23 ¦ portions of the filaments in the filament guide channels I2~A-X
¦ re~ote from th-ir end portions and pulling fixed lengths of the 26 ~llaments from t~e spools 116A-X. The filament guide members 27 . 114A-X are circ~meerentially spaced about a work station 124.
. - 22 - .
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1 As showr in Fig. 8, the integrated circuit chip 2 112 is generally rectangular or square in shape. However, 3 it should be understood that ~ntegrated circuit chips having 4 different geometries may be used with the apparatus 100 simply eliminating the use of some of the filament guite ~! 6 members 114A-X,adding additional filament guide members 7 and/or rearranging the spacing therebetween, as appropriate.
8 Advantageously, the ~idth of the filament guide channels 120A-X
is slightly greater than the diameter of the fine wires 115A-X, e.g., about .0003" greater, to closely confine the movement of -ll the wires115A-X therein and ensure that the fine wires 115A-X
12 exiting from the spools 116A-X pass easily therethrough.
Referring to Fig. 9, apparatus 10~ is shown 14 positioned at the work station 124. Integrated circuit ~1' chips ~ -N are successively reglstered at the wor~ station ; -~,~ 16 124 prior to ~oining the end portions of the wires 115A-X
17 to the integrated circuit chips112A-~. It should be understood 18 that the sequence of operation is the same and is occurring ` simultaneously in each filament guide memDer 114A-X. Therefore, for the sake of clarity, only the operation of the two filament 21 guide membersil4Aand 114~5will be described.
Advantageously, the integrated circuit chip~
i 23 llZA~Nmay be formed as a wafer 126- The wafer 126 ¦ 24 securely mounted to a carrier plate 173With an adhesive 130, l 2S e.g., wax, having a low melting point. The wafer is then A' 26 precisely cut into individual chips, e.g., with a diamond 27 saw, and the carrier platel28 is positioned on and registered ' '. ~' .. . . : .
. .:. , :
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1 with a suitably controlled X-Y tablel32 for registering the 2 integrated circuit chips ~2A-N at the work station 124.
i 3 For example, see United States Patent 3,706,409 (Lederer~ previou .
4 ¦ ly referred to, for a discussion of one technique for mounting . 5 and cutting a wafer, and positioning the cut chips or pellets at 6 a wor~ station for bonding leads thereto, _ 7 It should be understood that, as previously mentioned,j 8 with reference to Figs. 1-7, it is also within the scope of the 9 instant invention to orient individual chips manually, or with the assistance of manipulators and a microscope, or automaticall 11 with the use of optical recognition and positioning devices.
12 With these latter approaches the wafer can be scribed and 13 individual chips broken therefrom without the need to mount the 14 wafer to an adhesive layer and then cut into indivldual chips as described in the aforementioned Lederer patent.
",- ~ ....................................................... ~ .... .
16 The fine met_l wires 115A-X may be bare metal or 17 they may be insulated with heat strippable polyurethane.
18 The metal may be copper, gold plated copper, tinned copper, 1~ gold, or aluminum of any desired cross-sectional configuration with a thlckness or diameter in the range of about .7 mil 21 to about 4 mils, normally about 2 mils.
22 Ad.antaeously, ~ilament guide channels 12C~ and 23 120~of the translatable guide portionsll9A andll9M have their entrant ends enlarged or funnel-shaped to aid in capturing ~1.
the ends of the wires115A andll5M exiting from receiving 26 apertures 133A ant 133~1~n stationary members ~8A andll8M.
27 TSe filament guite channels 120A ~nd120M then guide the end ?~$ - 24 -1~ , .' . .
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¦portlons o e flne wires 115A andll5M to~ard thc exlt 2 apertures 122Aand 122M. Initially, for each new spool o 3 wire, the wires 115Aant 115M may be manually threaded through 4 the filament guide channels 120A andl20M so that the end portions of the wires 115A and115M extend a predeterminet 6 fixed distance from the exit apertures 122Aand 122M a ~ 8 position adjacent thë wor~ stationl24. Thereafter, the operatlon ~;~ is automatic until the spools of wire are e~hausted.
9 Each integrated circuit chipll2A-N ha~ a number of pads~34 corresponding to the number of fine wiresll5 il to be ~oined thereto. The padsl34 are advantageously gold i2 topped or toppet with solder to acilitate joining of the 13 wire end portions thereto, as will be described below.
14 The X-Y table]32j the translatable guide portionsll9A andll9M, '~ 15 and clamping means ~3A andl23M coact to ensure that the end 16 portions of the fine wires ~5A and ~5M are registered over 17 the pads134, assuming a stationary and unsupported position 18 over the pads ~4.
19 Initially, the translatable guide portions ~9A and U9M are in a retracted position relative to the work station 124, with the end portions of the wiresll5A andll5M extendlng 23 outwardly a predetermined fixed distance from the exit - spertures ~2A andl22M, see Fig.15. The clamping meansl23A
24 andl23M are positioned remote from the end portions of the -wires ~5A and ~5M for engaging a portion of the wiresllSA and 26 ~SM extending through fila~ent guide channelsL~OA and ~OM.
27 Preferably, the clamping meansl23A andl23M are positioned ~ ~ - 25 -,~ . . .
; ` . ! ` ~ `
., ~ 10~i82l9l ~
1 approximately midway along the leng,h of the filament 2 guide channels ~OA and ~OM and advantageously includ~
daphragm clamps. The clamping meansl23A and ~3M are 4 pneumatically activated from 8 remote source (not shown) to fixedly clamp and unclamp the wiresll5A and ~5M, as desired.
The clamped fine wires ~5A andll5M are translated 7 or moved into a forward position-at the work station 24, see Fig.
~ 8 ~,by pn~umatically activating horizontally arranged pistonsl36A
;; 9 and 136M. A pressure of 70 psig is adequate. The pneumatically ~ 10 activated pistonsl36A andl36~1 push or move translatable guide ;~ 11 portionsll9A andll9~ radially inwardly toward the work station 12 ~4 with the translatable guide portionsll9A andll9M sliding 13 along the bases ~8A antl38M of stationary members ~8A and 14 118M. Move~ent of the translatable guide portions ~9A and ~ . ;
I19M pulls a Cixed length of clamped wiresll5A and ~5M from 16 spools ~6A and 16M. This fixed length is proportional to the distance through which the translatable guide portions 18 l9A and ~9M are moved. A limit on the forward movement 19 of the translatable guide portionsll9A andll9M is provided by ~;~ adjustable forward stopsl40A andl40M coup~ed between the ~; 21 - eranslatable guide portions ~9A and ~9~I ana the stationary member~
118A andll8M. In the most forwart position, the wire ends ; ~ 115A and ~5~ assume a stationary and ~nsupported position at work station ~4 ~n~ ovcr b~ pads ~4, s~e T g. 9.
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Thus. the fine and flexible wires ~5A and ~5M
2 are fully supported and guided along a closely confined 3 fixed path from the points of engagement by the clamping 4 means ~3A and ~3M to the exit aperturesl22A and ~2M.
Thereafter, the fine wiresll5A and ~5M are unsupportet 6 for a short distance, e.g., 10 to 30 mils, with the end portions being registered in a stationary 8 and unsupported position over the wfork stationl24. It ha~
g generally been found that the maximum length of the total fixed path from the point at which the wires ~5A and ~,5M
11 are clamped to the end portions of the wires ~5A and ~5~
12 is approximately three orders of magnitude greater than the 13 wire diameter, i.e., 1~00 times greater. Therefore, 14 apprsximately 2 inches for 2 mil wires.
When the wire end portions are registered over the 16 padsl34 at the work station ~4, a chip bonting headl42, e.g., 17 which may be advantageously continuously or pulse heated, .~9 . ~.:
18 reciprocated downwardly for simultaneous contact with all the 19 wire end portions registered over the pads 134. The heated bonding head ~2 provides thermocompression bonding of all 21 the wire end portions to the pads B4. If the integrated 22 circuit chips ~2A-~ ~re conveyec to the work stationl24 in 23 wafer form, the heat generated by the bonding headl42 also 24 melts ~le wax ~0 and frees the individual integrated circui~
chlp ~2A from the carrier platel28.
26 After the wire end portions are bonded to the pads 27 134, the horlzontal pistons ~6A and ~6M and clampin~ mean~
28 123A and ~3M are deactivated enabling the translatable gulde ''''"`' '1 ' , ~.: :.. , . . .,. , : - - :
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. 1088281 1 l portions ~9A and ~9~ to be returned to their retracted position, 2 see Fig.lO~ under the influence of return springs144A andl44M
3 coupled between the translatable guide portions ~9A and U9~
4 and stationary members ~8A and ~8M. Rearward stops ~5A andl45M
S limit the rear~ard movement or retraction of the translatable 6 guide portions ~9A ant ~9M. -7 The chip bonding headl42 is then reciprocated upwardly 8 and to the right, and the X-Y tablel32 is reciprocatet downwardly 9 snd to the right, see Fig. 11. Thus, when the X-Y tablel32 is moved away fro~ the integrated circuit chipll2A, the integrated 11 circuit chipll2A is effectively held suspended by the bonded wires, see Fig. 1l. The clamping meansl23A and ~3M are then 13 pres~urized to clamp the wiresll5A andll5~ and the translatable 14 guide portionsll9A andll9M are moved to an intermediate position (bet~een the retracted and forward positions) by applying low pressure, e.g., 30 psig, to the horizontal 17 pistonsl36A andl36M. The force of the horizontal pistons 18 136A andl36M combine with a sprlng force resulting from bias 19 springsl46A andl46~ to overcome the spring force exerted on the translatable guide portionsll9A andll9M by return 21 springsl44A and ~4M to move the translatable guide portions 22 l9A andll9~ o a predetermined intermediate position. In 23 this intermediate position the force of horizontal pistons 24 ~ 36A and ~6~ and the force of the bias springsl46A andl46M
25 - which urge the translatable guide portionsll9A andll9~
26 towsrd the work station ~4 are in equilibrium with the force 27 of the return springol44A andl44M which urges the l - 2~ -~ ., ' . ~ .
~ , :.. .. .
' . ~
.'` ' .:' . .
' 1~ iO88Z81 S 2 ~¦ trsnslatabI guIde portioDs ~9A andll9M to a fully retra~ted~ position. The vement from the retracted position to the r~ 3 intermediate position with the clamping means ~3A andl23M
4 pressurized introduces slack into the bonded wires ~5A
S ant ~5M ad3acent their end portions, see Fig. 11. The presence of th~s slack in the wires ~5A andll5M tents to 7 compensate for thermoexpansion, neutralizing or eliminating 8 potentially detrimental effects on the bonded wire portions 9 resulting from differentials in thermoexpansion of the integratec circuit chipll2A and lts temporary or permanent carrier member.
Referring to Fig, l~,after slack is introduced 13 into the wiresll5A andll5M, and while the translatable 14 guide portionsll9A andll9M are still in the intermediate position, carrier feed memberl48, carrying a permanent or temporary carrier member or lead framel49~ mechanically coupled to the X-Y tablel32 is moved into contact with the 17 integrated circuit chiplL2A to provide support thereto via 18 a shuttlel50. (Alternatively, the bonded integrated ciscuit chip ~2A and filament guide membersll4A andll4~ may be conveyed ,:~21 to a second work station, above the carrier feed memberl48, , 22 as desired). The shuttlel50 ~ay be driven by a suitable `; ¦ servomotor to alternately position the X-Y tablel32 (integrated circuit chips) and the carrier feed memberl48 (carrier members) at ~he work stationl24.
26 As seen by the arrows in Fig. 12,the carrier 27 feed member ~8 moves to the right and upwardly to engage and support the suspell~ed i~ltegratet circuit chip ~2A at ~' ~ - 29 -., '' ,' ., - ~ : .
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:.'. Il io~8281 1 .
.
I the work station ~4. A carrier bonding headl52 is then 2 reciprocated downwardly into contact with predetermined 3 portions of the fine wires ~5A and ~5M to bon~ these pre-determined wire portions to the carrier memberl49. Heat , may be generated in the carrier bonding head ~2 by an electric current or if the carrier memberl49 ~s a ~- . temporary thermoplastic carrier, ultrasonic heating may be 8 advantageously employed.
,,For example, the integrated circuit chips ~2A-N
may be advantageously ~oined to permanent frames, such as DIP (Dual-In-Line-Package) lead frames, or to temporary 12 carrter frames. Advantageously, heavier wires may be used ,for ~oining the integrated circuit chips to inexpensive sprocketed films having apertures for accommodating the integrated circuit chips and leads extending outwardly therefrom. Subsequently,the outer ends of the leads may be 17 directly ~oined to terminal areas on hybrid circuits or 19 printed circuits, as desired.
Advantageously, as the carrier bonding headl52 engages 21 and bonds the fine wires ~5A sndll5M, see Fig. 12, notch o~
22 indentation is made in the fine wires ~5A and ~5M, a~acent the 23 outer bond to provide a predictable break for subsequently 24 separating the bonded wire portions from the remainder of the continuous wlresll5A andll5M, see Figs.13 and 14.
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L l 1088Z81 1 A~ shown in Fig. 13 the carrier bonting headl52 may i include an integrally formed cutter portionl54. Alternately, 3 a separate cutting elementl56 may be arranged circum~acent the 4 carrier bonding headl52, see Fig. 14. The cutting elements ~4
6 Additionally, uncontrolled breaking of the bonded wires often 7 results in fracturing of the bonds causing early failure during use.
Attempts to automate the wire bonding operation with programmed tool movement and bonding sequences has resulted 11 in some improvement over the aforementioned manual approach.
12 However, a sequential de of operation as well as the need 13 to preciseLy position the integrated circuit chip relative 14 to certain reference points has prevented any broad acceptance ~f automatic wire bonders.
16 Various other techniques have challenged the afore-17 mentioned wire bonding techniques. However, these other 18 techniques are costly and not readily adaptable to the large 19 number of integrated circuit chip geometries encountered.
A relatively recent approach to coupling leads to 21 integrated circuit chips involves the use of an automated 22 film-carrier. Uith the film-carrler assembly approaeh, the 23 film carries a copper lead frame. The inner ends of the 24 leads are gang bonded to pads on an inte8rated circuit chip by an inner lead bonder.~ After blanking or punching these 26 leads are extended outwardly in cantilever fashion and are gang bonded to a package, i.e., a dual-in-line, or a ,: ~ .
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1 flexible or rigid circuit board. Sprocket holes along ~kuq~
the sides of the film are used to enable the drive mechanism C 3 for the inner lead bonder to advance the film after the 4 lntegrated circuit chip has been bonded to the film-carrier and a}so to register the lead frame over an integrated circuit 6 chipo 7 In addition to adding significantly to thé cost of the asse~bled package, with the film-carrier assembly approach, g the film-carrier must be carefully handled since the film is sub~ect to dimensional instability ant the leads are easily 11 deflected out of position during handling.
12 Details of the aforementioned film-carrier assembly 13 technique as well as other approaches to connecting leads to 14 integrated circuit chips is found in the article entitled '~lm-Carrier Technique Automates The Packaging Of IC Chips", 16 by Stephen E. Grossm 1-, Electronics, May 16, 1974 issue, pp.
17 89~95.
~ ~ 18 It is an ob~ect of the present invention to f~ ~ 19 provide an improved method and apparatus for ~oining a continuous conductive filament to a predetermined terminal 21 area of an element which overcomes the disadvantages of the 22 afor~mentioned prior ar~ techniques.
23 It is another object of the present invention to 24 provide a method and apparatus for reliably positioning the end of a continuous conductive filament at a predetermined 26 and repeatable geometric location to enable automatic assembly ~` of a contuctive filament to an element.
.:
lOt~8281 It is a still further object of the present invention to provide a method and apparatus for reliably joining the conductive filament to a second terminal area to enable the automated assembly of elements to form a permanent or temporar~v package.
It is a still further object of the present invention to provide a method and apparatus for fully automating the assembly of integrated circuit chip packages.
~It is a still further object of the present invention 'jY~10 to provide a method and apparatus for connecting leads to integrated circuit chips at greatly reduced cost.
Other objects, aspects, and advantages of the present invention will be apparent from the specification and the ~accampanying drawings.
-~Thus, one aspect of the present invention is defined as the improvement in a method for coupling the end portion of each of a plurality of continuous conductive filaments to an `~ 'element mountable at a work station, the improvement comprising:
establishing a plurality of predeterminea fixed paths between t~e end portions of the conductive filaments and the work station;
simultaneously pushing a fixed length of each of the conductive filaments including its end portion to move the filaments through the predetermined fixed paths and cause the end portions to assume ;~stationary and unsupported positions over the work station; sub-sequently joining the end portions positioned over the work station to predetermined terminal areas of the element mounted at the work station; positioning the element with the end portions of 28 the conductor filaments joined thereto in stationary position over ~, .
'' A ~ ~ 6 ~',, , 2~31 a carrier having terminal areas for receiving the conductor fila-ments; registering a predetermined portion of each of the conductor filaments with a terminal area of the carrier; joining the pre-determined portion of each of the conductor filaments with the registered terminal area of the carrier; and cutting the portions of the conductor filaments joining the terminal areas of the element with the terminal areas of the carrier from the remainder of the conductor filaments.
Another aspect of the present invention is defined as 10 the improvement in an apparatus for coupling the end portion of each of the plurality of continuous conductive filaments to an element mountable at a work station, the improvement comprising: -annular guide plate means for establishing a plurality of predeter-; mined fixed paths between the end portion of each of a plurality of the conductive filaments and the work station; feed means for pushing fixed lengths of each of the plurality of the conductive s filaments including the end portion thereof to move each the con-ductive filament along the annular guide plate and through the predetermined fixed paths and cause the end portions to assume 20 stationary and unsupported positions over the work station; and joining means for subsequently joining the end portions positioned , ~
over the work station to predetermined terminal areas of the element mounted at the work station.
~ The preferred embodiments of the present invention f~ are illustrated in the accompanying drawings. However, it should be expressly understood that the method and apparatus of the present invention should not be construed to be 28 limited solely to the preferred embodiments. The drawings are as follows:
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1~8281 FIGURE 1 is a top plan view of an apparatus for joining a plurality of continuous conductive filaments to pre-determined terminal areas (pads) of an element (integrated circuit chip) in accordance with the instant invention.
FIGURE 2 is a cross-sectional view taken along line , 2-2 of Fig. 1 and showing additional components of the apparatus;
r FIGURE 3 is a partial sectional view simllar to 10 Fig. 2 showing the suspended integrated circuit chip after -the continuous conductive filaments are joined thereto;
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1~88281 I FIGURE 4 is a partial cross-sectional view, wirh 2 parts broke~ away, show~ng a carrier bon~ing head and a carrier . 3 feed means for bonding the integrated circuit chip to a carrier .~ mem~er; . . .
FIGURES 5-7 are sectioral views s~m~lar to Figs. 2-4, : 6 showing another embodiment according to the present lnvention . :
~: ln which the apparatus moves inwardly and outwardly relative 8 to the work stat~on to deliver continuous conductive filaments ~ to registered integrated circuit chips for ~oining the fila~ents s 10 thereto and to facilitate subsequent joining to a carrier 11 member ; . ~
. 12 FIGURE 8 is a top plan view of another apparatu9 13 ~n accordance with the present invention for ~oining a plurality 14 of continuous conductive filaments to predetermined termLnal . 15 areas ~pads) of an element (integrated circuit chip);
.- 16 FIGURE 9 a cross-sectional view taken along line :~ : }7 9-g of Fig.8 showing a pair of filament guide members in their ~; 18 forwarded position, . 19 FIGURE ~ is a partial sectional view similar toFig.g , with parts broken away, showing the ends of a pair .~ 21 of continuous conductive filaments being 30ined to an 22 integrated c~rcuit chip with the filament guide me~bers in 23 their retracted position:
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FIGUREIl is a partial sectional view similar to 2 Flg. 9, with parts broken away, showing the filament guide 3 members in their intermediate position;
4 FlGURE 12 is a partial sectional view similar to Fig. 9, with parts broken away, showing the filament guide 6 ~e~bers in their intermediate position with the carrier bonding head in contact with the joined filaments;
8 FlGURE 13 is an enlarged view of one embodiment 9 of the carrier bonding head for introducing a notch into the joined filaments;
11 FIGURE 14 is an enlarged view of another embodiment 12 for introducing a notch into the ~oined filaments; and 13 FIGURE 15 is a partial sectional view similar to 14 Fig. 9~ with parts broken away, showing the joined fiia~ents postlons separated from the remainder of the continuous 16 conductive filaments and the filament guide members in their 17 retracted position.
18 Refërring to Fig. 1, an apparatus in accordance with 19 the present invention for ~oining continuous conductive filaments to terminal areas of integrated circuit chips is illustrated 21 generally at 10, Although the apparatus 10 is illustrated with 22 wire and integrated circuit chips, it shollld be undcrstood that 23 it is not so limlted, but may be employed to join conductive 24 filaments to any of the aforementioned terminal areas~. As previously mentioned the term "term~nal areas" as used herein 26 shoult be construed to include fixed areas of integrated 27 Fircuits-, terminating harnesses, hybrid circuitsV printed ~;' , ,i~ " . .
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1 circuits, optical circuiCs, and fluidic circuits. The tenm "~oln" or "joining" as used herein includes any technique 1 3 for providin~ the desired electrical, optical, or fluidic 4 connection. Examples of ~oining techniques are thermo-S compression bonding, ultrasonic bonding, adhesive bonding, soldering, welding, mechanical fastening, and the like.
7 The apparatus 10 includes a plurality of filament 8 eed channels 14A-X corresponding in number to the number of continuous conductive filaments, here wires 15A-X, to be ~; 10 ~oined to an element, here an integrated circuit chip 12.
; 11 As shown in Fig. 1, the apparatus 10 includes 24 filament 1~ feed channels 14A-X. Generally,-the number of filament feet 13 ¦ channels 14 will vary, as desired; 14 to 40 filament feed 14 channels 14 are commonly used for providing 14 to 40 connections to an integ;ated circuit chip 12. Each filament feed channel 16 14A-X includes a supply means, here spools 16A-X of fine metal ~ 17 wire lSA-X, hitch feed drives 18A-X for clamping and pushing `~ 18 the fine metal wire 15A-X, telescoping tubes l9A-X, conveying ,, 19 tubes 20A-X, and a filament cutter 22 having apertures 23A-Xj see Fig. 2. A recessed fila~ent guide plate 24 is positioned ~5' 21 below the filament cutter 22. The recessed filament g~ide 22 plate 24 has a plurali~y of machined grooves 26A-X for ; 23 receiving the fine wires 15A-X exiting from the conveying tubes ~ 2246 ¦¦ 20A-X ~nd llament cutter 22.
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iV~8;~81 The machined grooves 26A-X extend along the upper surface of the recessed filament guide plate 24 to a central aperture or window 28 of the recessed filament guide plate 24, The shape of the aperture or window 28 of the recessed filament i guide plate 24 is generally chosen to conform with the geometry of the integrated circuit chip 12 to which the wires 15A-X are to be joined. As shown in Fig. 1, the window 28 is generally rectangular or square in shape for use with similarly shaped ~ integrated circuit chips 12. However, it should be understood . 10 that integrated circuit chips having different geometries may be used with the apparatus 10 by simply changing the recessed wire guide plate 24 with a recessed wire guide plate conforming to the configuration of the integrated circuit chips to be used.
Advantageously, the width of the machined grooves 26A-X is slightly greater than the diameter of the fine wire 15A-X, e.g., about.0003" greater, to ensure that the fine wires 15A-X exiting .
from the wire cutter 22 pass easily into the machined grooves 26A-X and therethrough to the integrated circuit chip 12.
Referring to Fig. 2, apparatus 10 is positioned with ~i the window 28 overlying a work station 30. Integrated circuit chips 12A-N are successively registered at the work station 30 prior to joining the end portions of the wires to the ! integrated circuit chips. It should be understood that the sequence of operation is the same and is occurring simultaneously in each filament feed channel 14A-X. Therefore, for the sake of clarity, only the operation of the two filament feed channels 14A and 14M illustrated in Figs. 2-4 will be described.
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Advantageously, the integrated circuit chips 12A-N
may be formed as a wafer 32. The wafer 32 is securely mounted to a carrier plate 33 with an adhesive 36, e.g., wa~, having a low melting point. The wafer is then precisely cut into individual chips, e.g., with a diamond saw, and the carrier plate 33 is positioned on and registered with a suitably controlled X-Y table 34 for registering the integrated circuit chips 12A-N at the work station 30. See, e.g., United States Patent 3,706,409 (Lederer) for a discussion of one ` 10 technique for mounting and cutting a wafer, and positioning the cut chips or pellets at a work station for bonding leads thereto. `~
It should be understood that it is also within the scope of the instant invention to orient individual chips f manually or with the assistance of manipulators and a mi¢rosoope, or automatically with the use of optical recognition and positioning devices. With these latter approaches the wafer can be scribed and individual chips broken therefrom without the need to mount the wafer to an adhesive layer and then cut it into individual chips as described in the aforesaid Lederer patent.
~- The fine metal wire lSA-X may be bare metal or it may be insulated with heat strippable polyurethane. The metal ~, may be copper, gold plated copper, tinned copper, gold, or aluminum of any desired cross-sectional configuration with - a thickness or diameter in the range of about .7 mil to about 4 mils, normally 2 mils.
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~01~8Z81 The machined grooves 26A and 26M of the recessed filament guide plate 24 have their entrant ends enlarged or funnel-shaped to aid in capturing the ends of the wires exiting from the wire cutter 22. The machined grooves 26A and 26M
then guide the ends of the fine wire to the window 28 and precisely locate or register the wire end portions over the work station 30 closely spaced over or in contact with the terminal areas in the form of pads 37 on the integrated circuit chip 12A registered at the work station 30, Each integrated circuit chip 12A-N has a number of pads 37 corresponding to the number of fine wires 15 to be joined thereto, The pads 37 are advantageously gold topped or topped with solder to facilitate joining of the wire end portions thereto, as will be described below.
The X-Y table 34, the hitch feed drives 18A and 18M, the telescoping tubes l9A and l9M, the conveying tubes 20A and 20M, and the recessed filament guide plate 24 coact to ensure that the end portions of the fine wires are registered over the pads 37.
:~ 20 Each of the hitch feed drives 18A and 18M includes a stationary clamping member 38A and 38M and a movable clamping member 40A and 40M, respectively, which coact to clamp and pull the fine wire from the spools 16A and 16M, respectively. The length of the wire feed is advantageously adjustable in small increments in accordance with activation of the hitch feed drives 18A and 18M to feed fixed lengths of wire 15A and 15M
to the pads 37.
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8~32~1 The fine wire is fed by pneumatically activating the movable clamping mem~ers 40A and 40M so that pistons 42A and 42~ clamp tightly the wires 15A and 15M. Pistons 44A and 44M
are then pneumatically activated to slide housings 46A and 46M
along guides 48A and 48M. The clamped wires 15A and 15M are pushed through telescoping tubes l9A and l9M which are interconnected between slidable housings 46A and 46M and stationary piston housings 50A and 50M, respectively. The telescoping tubes l9A and l9M include smaller diameter tubes 52A and 52M, joined at one end to the slidable housings 46A and 46M, respectively, and larger diameter tubes 54A and 54M joined at one end to the stationary piston housings 50A and 50M. When the movable clamping members 40A and 40M slide forward on the guides 48A and 48M, the smaller diameter tubes 52A and 52M
telescope within the larger diameter tubes 54A and 54M, respectively.
Arranged on the side of housings 50A and 50M opposite to the telescoping tubes l9A and l9M are conveying tubes 20A
and 20M. The conveying tubes 20A and 20M have one end joined ,t~` 20 to stationary housings 50A and 50M and their other ends mounted within a rotatable support plate 60. The rotatable support ; plate 60 also includes channels 62A and 62M for receiving the wire exiting from the conveying tubes 20A and 20M. Positioned ~` below the rotatable support plate 60 is the stationary filament cutter 22. The filament cutter 22 includes enlarged apertures -~ 23A and 23M to receive the fine wires 15A and 15M. Positioned ~ -,~r below the wire cutter 22 and aligned with apertures 23A and 23M are machined grooves 26A and 26M of recessed filament f~ guide plate 2~.
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` ~088281 ~ Thus, the fine and flexible wires 15A and 15r~ are ¦ fully supported and guided along a closely confined fixed path - from the points of engagement by the movable clamping members 40A and 40M to the window 28. Thereafter, the fine wire 15A
and 15M is unsupported over an extension of the fixed path for a short distance and extends over the work station 30 with the end portions registered in a stationary position over predetermined fixed areas of the work station 30. It has generally been found that the maximum length of the total fixed path from the point of engagement of the wires 15A and 15r~ with the movable clamping members 40A and 40M to the end portions of the wires 15A and 15M registered over the predetermined fixed ~; areas of the work station 30 is approximately three orders of magnitude greater than the wire diameter, i,eO, 1000 times greater. Therefore, approximately 2 inches for 2 mil wire.
The end portions of the wires 15A and 15M exiting from the recessed filament guide plate 24 are unsupported for a relatively short distance of approximately 10 mils to 30 mils and assume a stationary position over the work station 30 for subsequent joining to predetermined areas or pads 37 of an ~ integrated circuit chip 12A mounted at the work station 30.
¦ When the wire end portions are registered over the pads 37 at the work station 30, a chip bonding head 64, e.g., which may advantageously be continuously or pulse heated, is reciprocated downwardly for simultaneous contact with all the ~ wire end portions registered over the pads 37, The heated chip '~ bonding head 64 effects a thermocompression bond of the wire ~ "
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end portions. If the integrated circuit chips 12 are conveyed to the work station 30 in wafer form, the heat generated by the bonding head 64 also melts the wax 36 and frees the individual integrated circuit chip 12A from the carrier plate 33.
After the wire end portions are bonded to the pads 37, the stationary clamping members 38A and 38M are pneumatically activated and pistons 66A and 66M grip the wires 15A and 15M.
Pistons 42A and 42M, and 44A and 44M are then deactivated and 10the housings 46A and 46M, along with attached smaller diameter tubes 52A and 52M, return to the position shown in Fig. 2 under ' influence of return springs (not shown) coupled to slidable -~-I housing 46A and 46M.
~ The chip bonding head 64 is then reciprocated -~
i;~ upwardly and to the right, and the X-Y table 34 and recessed -,~ , .
filament guide plate 24 are reciprocated downwardly and to the right, see Fig. 3. Thus, when the X-Y table 34 and ,~. . .
recessed filament guide plate 24 are moved away from the integrated circuit chip 12A, the integrated circuit chip 12A is effectively held suspended by the bonded wire portions, see Fig. 3. As shown in Figs. 2 and 3, a carried feed member 67, which carries a permanent or temporary carrier member or lead frame 68, is mechanically coupled to the X-Y table 34 and moved :
; ~ therewith via a shuttle 70. The shuttle 70 moves the carrier member 68 into registration with the bonded integrated circuit chip 12A at the work station 30. (Alternatively, the bonded ~; integrated circuit chip 12A may be conveyed to a second work t~ station, above the carrier feed member 67, as desired.), -,~ - 16 -s~ - bm:
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10~82~1 The shuttle 70 may be driven by a suitable servomotor to alternately position the X-Y table 34 (integrated circuit chips) and the carrier feed member 66 (carrier members) at the work station 30.
As shown in Fig. 4, the carrier feed member 67 moves to the right and upwardly to engage and support the suspended integrated circuit chip 12A at the work station 30, While the pistons 66A and 66M are still gripping the wires 15A and 15M, a carrier bonding head 78 is reciprocated downwardly into contact with predetermined portions of the fine wires 15A and 15M to bond the predetermined wire portions to the carrier member 68. ~eat may be generated in the carrier bonding head 78 by an electric current or if the carrier member 68 is a temporary thermoplastic carrier, ultrasonic heating may be advantageously employed.
The integrated circuit chips 12A-N may be advantageously joined to permanent frames, such as a DIP
(Dual-In-Line-Package)lead frames, or to temporary carrier frames. Advantageously, heavier wires may be used for joining the integrated circuit chips to inexpensive ~, sprocketed film having apertures for accommodating the ~- integrated circuit chips and leads extending outwardly therefrom. Subsequently the outer ends of the wires may be directly joined to terminal areas on hybrid circuits or printed circuits, as desired ~. ,.
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1 Wh'le the carrier bonding head 78 is in contact 2 wit~ the fine wires 15A and 15M, as sho~ in Fig. 4, the ~ rotatable cupport plate 60 is rotated, e.g., 3 to 4', relat~ve i to the stationary .ila~ent cutter 22 to shear or cut the bonded w~re portions 74A and 74M from the remaining fine wire portions 6 76A and 76M. The wire portions 74A and 74M includes short - C stubs 72A and 72~ which protrude slightly upward from ~b~$r 8 their point of jointure with the carrier member 68. It ; 9 should be understood that in some applications it may bei 10 desirable tO cut the wires prior to bonding them to the carrier 11 member 68.
12 Referring to Figs. 5-7, elements si~ilar to those 13 appearing in Figq. 1-4 are s~m~-larly nu~bered. ~owever, in ~ 14 this embod;~ent the support plate 60 is fragmented into ;~; 15 a nu~b-r of support elements 83A-~ corresponding with the 17 number of wires 15A-~, and the filament gu~de plate 24 is ~; eliminated. Moreover, suDDort elements 83A and 83~ include `i~` 18 I elongate ch&~nels 62A1 2nd 6Z~' and the conveying tubes 20A
.''.~ , 19 . and 20M are eliminated. Additionally, ~ilament cutter 22, -~ 20 ~ ~ 21 wh;ch was positioned below rotatable support plate 60 in 22 Figs 1-4, is replaced with cutter me~bers 80A and 80~ ~unted ;~ 23 on the upper sur~ace of support elements a3A and 83~ and 24 having cutter elements 82A and 82M positioned a~ove correspondin, e~ t or ~ic ~ 84A and 84M oE ch~o~els 62A' and ~
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i 1 Referring specifically to Fig. S, preferably after an integrated circuit chip 12A is positioned at the work station 30, 3 support elements 83A ~nd 83~ are driven inwardly by pneu~atically activated pistons 86A and 86M to position exit orifices 84A ant 84M in closely spaced relat~onship with the work station 30 a~d ~, at a fixed distance from pads 37. A fixed length of the wires .~ ~ 15A and l~M is then pushed or projected fro~ the exit arifices 84h and 8~M and moves along an unsupported f~xed path so that the 9 wire end portlons register over the pads 37. S~bsequently, ch~p bonding head 64 is operated as described with reference to Figs.
il 2 and 3. Return springs (not shown) couple the support ele~nnts 12 83A and 83.~I to a stationa~y rra e 90 to return the support ele-13 ments 83A and 83.'I to the position shown in Fig. 6 after bondi 14 is conpleted and the ?istons 86A and 86~I are deactivated.
. 15 The inward ~ove~ent or su?~ort ele~ents 83.~ and 83M iQ
j 16 controlled by stops 88A and 88M, see Fig. 5, and the outward ..
17. movement of the support elements. 60A ant 60M is controlled 18 b~ stops 89A and 89M, see Fig. 6.
19 Referring to Fig. 6, subsequent to the gang b~r.ding ..
. .-, operation of Fig. 5, the bonding head 64 is ~oved upwardly . . snd to the right (see arrow), ant the X Y table 34 is vet i 23 downwardly and to the -ighe (see arrow), and the pistons ~ 24 86A and 86M a.e deactivated to return the support ele~ents :~ 25 83A and 83~ to the position shown in Fig. 6, thereby exposing . 26 predetermi~ed lengths of wires ~A and 92~. The gang bonded ~¦ 2/ li~teg - =d ie cbi7 1~ r _ s uspc~ded a~
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. . , . . , 1 described with reference to Fig. 3. The~ the shuttle 70 2 positions the carrier feed me~ber 67 at the ~ork station 30 3 for supporting the integrated circuit chip 12`A znd reg~stering 4 the carrier memDer 68 with the wires 92A and 92~, see Flg. 7.
Ihe predetermined leni~ths of wires 92A and 92~ are then .
bonded to the carrier member 68 by carrier bonding head 78. .
7 Positioned atjacent to the outer surface of the bonding bead 8 78 and in contact therewith vla bearings 91 is a reciprocata~le g ~ember 94 which is moved d~nwardly to engage cutter ~embers -~
80A ,,~nd 80M' and depress cutter elements 8æA and 80~ for il cutting the ~ire portions 92~ znd 92~ while the fra~e 12 bonding head 78 is in contact therewith.
13 . ...................................... ..... __ _. . .
14 Generally, the sequence of operation of the embodiments of the present invention in accordance with Figures 1-7 is as 16 follous: .
17 An integrated circuit chip 12A is registered at the wor c 18 station 30, Remotely positioned fine wire is pullet irom spools 19 16A-X by energizing the hitch feed drives 18A-X and the wire end portions travel along predetermined fi~ed paths for 21 registration over the work station 30, specifically over pads 37 22 of the registered integratet circu~t chip 12A, The wire end 23 port~ons are then joined in a gang to the pads 37 by the chip 24 bonding head 64, which is then moved away from the work station 30. While the wax 36 ~nder the integrated circuit chip 12 is 26 in the molten state, the X-Y table 34 and the portions of the 27 predetermined fixed paths (filament guide plates 24 or support .
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.~ 88281 ~ elements 83) ~d~acent the work station 30 are removed there-S 2 from, so that the bonded integrated circuit chip 12A is suspended ii 3 at the work station 30. The carrier feed member 67 carrying a csrrier member 68 is then moved into position at the work station 30 to support the integrated circuit chip 12 and register the ~, 6 carrier frame 68 with predetermined portions of the lengths of ;~ 7 fine wires bonted to the integratet circuit chip 12A. The 8 carrier bonding head 78 is then moved into contact with the 9 predetenmined portions for bonding the predetermined portions in a gang to the carrier me~ber 68. While the carrier bonding 1 head 78 is engaging the fine wire portions, a filament cutter 22 12 or 80 is activated to simultaneously shear or cut predetermined 13 lengths of the bonded wires. The bonded integratet circu~t 14 chip 12A and carrier member 68, the carrier bonding head 78, ~` 15 and carrier feed member 67 are then removed from the work ~ ~ 16 station 30 and the X-iY table 34 is reactivated for registering ii 17 -another integrated circuit chip at the work station 30. The ii~ lô abovementioned sequence of operation is then repeated ~` 19 continuously to produce completed integrated circuit packages.
Thus, gang bondi~g of t'he ent portions of f~e wires 21 to pads 37 on an integrated circuit chip 12A (inner bond) a~d , ~ 22 subsequentl~ g&~g bond~ng o~ o~her predet~r~ined pQrt~ons o~ t'he ,i onded flne wires to a carrier ~s~er 68 (outer bond) is rapidly :: 24 ant reliabIy achieved with an expected capability of providing in excess of 1000 comp~eted integrated circuit packages per hour.
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1 Referr~ng to Fig. 8~ an apparatus in accordance 2 -with the present inventi~n for ~oinin~ continuous conductiv~
~3 filaments to terminal areas of ~ntegrated circuit chips is 4 llluserated generally at 1- : :
~lthough the apparatus 100is shown in use with wi.e 6 ll~A-X and an integrated circuit chip 112,it should be understood 7 that it is not so limited, but may be employed to ~oin 8 continuous conductive filame~ts to any of the aforementioned g terminal areas The apparatus lCDincludes a plurality of ~ ~
filament or wi~a guide members 114A-Xcorresponding in 3~r . :
il ¦ number to the nu~ber of continuous conductive filsments, 12 ¦ here wires 115A-X,to be ~oined to an element, here a~
13 ¦ integrated c rcuit chip i2. As shown in Fig. 8a ~he ~ 1 14 ¦ apparatus ~ includes 24 filament guide members 114A-X. ~l ¦ Generally, the number of filament guide memberstl4 will vary, as 16 ¦ desired. As prev~ously mentioned, usually 14 to 40 filamen~
17 guide mPmbers will be used for providing 14 to 40 connections to 18 ¦ an integrated circuit chi~ 112. Each filament guite mQmber 19 ¦ 114A-X includes a supply means, here spools 116A-X of fine ¦ metal wire 115A-X~ stationary elements 118A-X, translatable 21 ¦ guide portions ll9A-~, filament_~uide channels 120A-X, having 22 I exit apertures lZ2A-X, and clampin~ means 123A-~ for en~agin~
23 ¦ portions of the filaments in the filament guide channels I2~A-X
¦ re~ote from th-ir end portions and pulling fixed lengths of the 26 ~llaments from t~e spools 116A-X. The filament guide members 27 . 114A-X are circ~meerentially spaced about a work station 124.
. - 22 - .
~'' ' ' 1 ' ' ' , .-. - . . .. - , - : . . ~ -- -, . , ~ -. I ` 108l9Z81 ~ I
,. . ,- .
1 As showr in Fig. 8, the integrated circuit chip 2 112 is generally rectangular or square in shape. However, 3 it should be understood that ~ntegrated circuit chips having 4 different geometries may be used with the apparatus 100 simply eliminating the use of some of the filament guite ~! 6 members 114A-X,adding additional filament guide members 7 and/or rearranging the spacing therebetween, as appropriate.
8 Advantageously, the ~idth of the filament guide channels 120A-X
is slightly greater than the diameter of the fine wires 115A-X, e.g., about .0003" greater, to closely confine the movement of -ll the wires115A-X therein and ensure that the fine wires 115A-X
12 exiting from the spools 116A-X pass easily therethrough.
Referring to Fig. 9, apparatus 10~ is shown 14 positioned at the work station 124. Integrated circuit ~1' chips ~ -N are successively reglstered at the wor~ station ; -~,~ 16 124 prior to ~oining the end portions of the wires 115A-X
17 to the integrated circuit chips112A-~. It should be understood 18 that the sequence of operation is the same and is occurring ` simultaneously in each filament guide memDer 114A-X. Therefore, for the sake of clarity, only the operation of the two filament 21 guide membersil4Aand 114~5will be described.
Advantageously, the integrated circuit chip~
i 23 llZA~Nmay be formed as a wafer 126- The wafer 126 ¦ 24 securely mounted to a carrier plate 173With an adhesive 130, l 2S e.g., wax, having a low melting point. The wafer is then A' 26 precisely cut into individual chips, e.g., with a diamond 27 saw, and the carrier platel28 is positioned on and registered ' '. ~' .. . . : .
. .:. , :
'~; ~ ' ' ' ' ' , ' ..
1 with a suitably controlled X-Y tablel32 for registering the 2 integrated circuit chips ~2A-N at the work station 124.
i 3 For example, see United States Patent 3,706,409 (Lederer~ previou .
4 ¦ ly referred to, for a discussion of one technique for mounting . 5 and cutting a wafer, and positioning the cut chips or pellets at 6 a wor~ station for bonding leads thereto, _ 7 It should be understood that, as previously mentioned,j 8 with reference to Figs. 1-7, it is also within the scope of the 9 instant invention to orient individual chips manually, or with the assistance of manipulators and a microscope, or automaticall 11 with the use of optical recognition and positioning devices.
12 With these latter approaches the wafer can be scribed and 13 individual chips broken therefrom without the need to mount the 14 wafer to an adhesive layer and then cut into indivldual chips as described in the aforementioned Lederer patent.
",- ~ ....................................................... ~ .... .
16 The fine met_l wires 115A-X may be bare metal or 17 they may be insulated with heat strippable polyurethane.
18 The metal may be copper, gold plated copper, tinned copper, 1~ gold, or aluminum of any desired cross-sectional configuration with a thlckness or diameter in the range of about .7 mil 21 to about 4 mils, normally about 2 mils.
22 Ad.antaeously, ~ilament guide channels 12C~ and 23 120~of the translatable guide portionsll9A andll9M have their entrant ends enlarged or funnel-shaped to aid in capturing ~1.
the ends of the wires115A andll5M exiting from receiving 26 apertures 133A ant 133~1~n stationary members ~8A andll8M.
27 TSe filament guite channels 120A ~nd120M then guide the end ?~$ - 24 -1~ , .' . .
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¦portlons o e flne wires 115A andll5M to~ard thc exlt 2 apertures 122Aand 122M. Initially, for each new spool o 3 wire, the wires 115Aant 115M may be manually threaded through 4 the filament guide channels 120A andl20M so that the end portions of the wires 115A and115M extend a predeterminet 6 fixed distance from the exit apertures 122Aand 122M a ~ 8 position adjacent thë wor~ stationl24. Thereafter, the operatlon ~;~ is automatic until the spools of wire are e~hausted.
9 Each integrated circuit chipll2A-N ha~ a number of pads~34 corresponding to the number of fine wiresll5 il to be ~oined thereto. The padsl34 are advantageously gold i2 topped or toppet with solder to acilitate joining of the 13 wire end portions thereto, as will be described below.
14 The X-Y table]32j the translatable guide portionsll9A andll9M, '~ 15 and clamping means ~3A andl23M coact to ensure that the end 16 portions of the fine wires ~5A and ~5M are registered over 17 the pads134, assuming a stationary and unsupported position 18 over the pads ~4.
19 Initially, the translatable guide portions ~9A and U9M are in a retracted position relative to the work station 124, with the end portions of the wiresll5A andll5M extendlng 23 outwardly a predetermined fixed distance from the exit - spertures ~2A andl22M, see Fig.15. The clamping meansl23A
24 andl23M are positioned remote from the end portions of the -wires ~5A and ~5M for engaging a portion of the wiresllSA and 26 ~SM extending through fila~ent guide channelsL~OA and ~OM.
27 Preferably, the clamping meansl23A andl23M are positioned ~ ~ - 25 -,~ . . .
; ` . ! ` ~ `
., ~ 10~i82l9l ~
1 approximately midway along the leng,h of the filament 2 guide channels ~OA and ~OM and advantageously includ~
daphragm clamps. The clamping meansl23A and ~3M are 4 pneumatically activated from 8 remote source (not shown) to fixedly clamp and unclamp the wiresll5A and ~5M, as desired.
The clamped fine wires ~5A andll5M are translated 7 or moved into a forward position-at the work station 24, see Fig.
~ 8 ~,by pn~umatically activating horizontally arranged pistonsl36A
;; 9 and 136M. A pressure of 70 psig is adequate. The pneumatically ~ 10 activated pistonsl36A andl36~1 push or move translatable guide ;~ 11 portionsll9A andll9~ radially inwardly toward the work station 12 ~4 with the translatable guide portionsll9A andll9M sliding 13 along the bases ~8A antl38M of stationary members ~8A and 14 118M. Move~ent of the translatable guide portions ~9A and ~ . ;
I19M pulls a Cixed length of clamped wiresll5A and ~5M from 16 spools ~6A and 16M. This fixed length is proportional to the distance through which the translatable guide portions 18 l9A and ~9M are moved. A limit on the forward movement 19 of the translatable guide portionsll9A andll9M is provided by ~;~ adjustable forward stopsl40A andl40M coup~ed between the ~; 21 - eranslatable guide portions ~9A and ~9~I ana the stationary member~
118A andll8M. In the most forwart position, the wire ends ; ~ 115A and ~5~ assume a stationary and ~nsupported position at work station ~4 ~n~ ovcr b~ pads ~4, s~e T g. 9.
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;
Thus. the fine and flexible wires ~5A and ~5M
2 are fully supported and guided along a closely confined 3 fixed path from the points of engagement by the clamping 4 means ~3A and ~3M to the exit aperturesl22A and ~2M.
Thereafter, the fine wiresll5A and ~5M are unsupportet 6 for a short distance, e.g., 10 to 30 mils, with the end portions being registered in a stationary 8 and unsupported position over the wfork stationl24. It ha~
g generally been found that the maximum length of the total fixed path from the point at which the wires ~5A and ~,5M
11 are clamped to the end portions of the wires ~5A and ~5~
12 is approximately three orders of magnitude greater than the 13 wire diameter, i.e., 1~00 times greater. Therefore, 14 apprsximately 2 inches for 2 mil wires.
When the wire end portions are registered over the 16 padsl34 at the work station ~4, a chip bonting headl42, e.g., 17 which may be advantageously continuously or pulse heated, .~9 . ~.:
18 reciprocated downwardly for simultaneous contact with all the 19 wire end portions registered over the pads 134. The heated bonding head ~2 provides thermocompression bonding of all 21 the wire end portions to the pads B4. If the integrated 22 circuit chips ~2A-~ ~re conveyec to the work stationl24 in 23 wafer form, the heat generated by the bonding headl42 also 24 melts ~le wax ~0 and frees the individual integrated circui~
chlp ~2A from the carrier platel28.
26 After the wire end portions are bonded to the pads 27 134, the horlzontal pistons ~6A and ~6M and clampin~ mean~
28 123A and ~3M are deactivated enabling the translatable gulde ''''"`' '1 ' , ~.: :.. , . . .,. , : - - :
;', ' . :- . - ~
~' ~
. 1088281 1 l portions ~9A and ~9~ to be returned to their retracted position, 2 see Fig.lO~ under the influence of return springs144A andl44M
3 coupled between the translatable guide portions ~9A and U9~
4 and stationary members ~8A and ~8M. Rearward stops ~5A andl45M
S limit the rear~ard movement or retraction of the translatable 6 guide portions ~9A ant ~9M. -7 The chip bonding headl42 is then reciprocated upwardly 8 and to the right, and the X-Y tablel32 is reciprocatet downwardly 9 snd to the right, see Fig. 11. Thus, when the X-Y tablel32 is moved away fro~ the integrated circuit chipll2A, the integrated 11 circuit chipll2A is effectively held suspended by the bonded wires, see Fig. 1l. The clamping meansl23A and ~3M are then 13 pres~urized to clamp the wiresll5A andll5~ and the translatable 14 guide portionsll9A andll9M are moved to an intermediate position (bet~een the retracted and forward positions) by applying low pressure, e.g., 30 psig, to the horizontal 17 pistonsl36A andl36M. The force of the horizontal pistons 18 136A andl36M combine with a sprlng force resulting from bias 19 springsl46A andl46~ to overcome the spring force exerted on the translatable guide portionsll9A andll9M by return 21 springsl44A and ~4M to move the translatable guide portions 22 l9A andll9~ o a predetermined intermediate position. In 23 this intermediate position the force of horizontal pistons 24 ~ 36A and ~6~ and the force of the bias springsl46A andl46M
25 - which urge the translatable guide portionsll9A andll9~
26 towsrd the work station ~4 are in equilibrium with the force 27 of the return springol44A andl44M which urges the l - 2~ -~ ., ' . ~ .
~ , :.. .. .
' . ~
.'` ' .:' . .
' 1~ iO88Z81 S 2 ~¦ trsnslatabI guIde portioDs ~9A andll9M to a fully retra~ted~ position. The vement from the retracted position to the r~ 3 intermediate position with the clamping means ~3A andl23M
4 pressurized introduces slack into the bonded wires ~5A
S ant ~5M ad3acent their end portions, see Fig. 11. The presence of th~s slack in the wires ~5A andll5M tents to 7 compensate for thermoexpansion, neutralizing or eliminating 8 potentially detrimental effects on the bonded wire portions 9 resulting from differentials in thermoexpansion of the integratec circuit chipll2A and lts temporary or permanent carrier member.
Referring to Fig, l~,after slack is introduced 13 into the wiresll5A andll5M, and while the translatable 14 guide portionsll9A andll9M are still in the intermediate position, carrier feed memberl48, carrying a permanent or temporary carrier member or lead framel49~ mechanically coupled to the X-Y tablel32 is moved into contact with the 17 integrated circuit chiplL2A to provide support thereto via 18 a shuttlel50. (Alternatively, the bonded integrated ciscuit chip ~2A and filament guide membersll4A andll4~ may be conveyed ,:~21 to a second work station, above the carrier feed memberl48, , 22 as desired). The shuttlel50 ~ay be driven by a suitable `; ¦ servomotor to alternately position the X-Y tablel32 (integrated circuit chips) and the carrier feed memberl48 (carrier members) at ~he work stationl24.
26 As seen by the arrows in Fig. 12,the carrier 27 feed member ~8 moves to the right and upwardly to engage and support the suspell~ed i~ltegratet circuit chip ~2A at ~' ~ - 29 -., '' ,' ., - ~ : .
.~ ,. ~ , .
- i, , ~ ~ , , ' . ' ~ :
:.'. Il io~8281 1 .
.
I the work station ~4. A carrier bonding headl52 is then 2 reciprocated downwardly into contact with predetermined 3 portions of the fine wires ~5A and ~5M to bon~ these pre-determined wire portions to the carrier memberl49. Heat , may be generated in the carrier bonding head ~2 by an electric current or if the carrier memberl49 ~s a ~- . temporary thermoplastic carrier, ultrasonic heating may be 8 advantageously employed.
,,For example, the integrated circuit chips ~2A-N
may be advantageously ~oined to permanent frames, such as DIP (Dual-In-Line-Package) lead frames, or to temporary 12 carrter frames. Advantageously, heavier wires may be used ,for ~oining the integrated circuit chips to inexpensive sprocketed films having apertures for accommodating the integrated circuit chips and leads extending outwardly therefrom. Subsequently,the outer ends of the leads may be 17 directly ~oined to terminal areas on hybrid circuits or 19 printed circuits, as desired.
Advantageously, as the carrier bonding headl52 engages 21 and bonds the fine wires ~5A sndll5M, see Fig. 12, notch o~
22 indentation is made in the fine wires ~5A and ~5M, a~acent the 23 outer bond to provide a predictable break for subsequently 24 separating the bonded wire portions from the remainder of the continuous wlresll5A andll5M, see Figs.13 and 14.
27 _ 30 -. :
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L l 1088Z81 1 A~ shown in Fig. 13 the carrier bonting headl52 may i include an integrally formed cutter portionl54. Alternately, 3 a separate cutting elementl56 may be arranged circum~acent the 4 carrier bonding headl52, see Fig. 14. The cutting elements ~4
5 orl56 are reciprocated into contact with the wires ~5A andll5M
forming notches therein. i 7 Referring to Fig.15, while the clamping meansl23A and 8 23M are pressurizet snd the carrier bonding headl52 is in contact 9 with the bonded wires ~5A andll5M, the horizontal pistons ~6A
10 andl36M are deactivated. The aeactivation of the horizontal ~-~ 11 pistonsl36A andl36M causeo retract~on of the translatable wire 12 guidesll9A andll9M under influence of the return springsl44A
13 andl44M, thereby applying a force to the wires ~5A andll5M
~; 14 clamped between the carrier bonding headl52 and the clamping 15 ~eansl23A antl23M. Thus, the wiresll5A andll5M break 16 ~ predictably at the notches, see Fig.15~ with the r~sult that 17 a fixed length of wire extends outwardly from exit apertures 18 122A andl22M for ~oining to the next integrated circuit chipll2B.
19 The carrier bondLng headl52 and carrier feed memberl48 are then 20 reciprocated away from the work stationl24 and the shuttlel50 ~' ..
21 registers the next integrated circuit chipll2B at the work stationl24.
23 Although in the embodiment shown in Figs. 8-15, notches are introduced into the joined wires and the ~oined ~! ~ 25 wire portions are separated by breaking, it should be under-26 stood that the wires may be cut if desired as lllustrated in 27 th~ embodiments shown in Figs. 1-7.
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:, , . . . :, , ~ 108B281 1 Generally, the preferred sequence of operation of the 2 embodiment of the present lnvent~on in accortance with Figs. 8-3 15 i9 8~ follows: `
~ An integrated circuit chip 112A is registered at the work station 124. To commence operation, with the translatable ~ guide portions ll9A-X in the retracted position, the wires 115A-X .
are manually threaded through the filament guide members 114A-X
8 with the end portions of the wires 115A-X extending outwardly from the exit apertures 122A-X a predetermined distance, as previously described. The remotely positioned fine wires 115A-X
11 are then clamped by pressurizing clamping means 123A-X ant the horizontal pistons 136A-X are pressurized to ve the 13 translatable guide portions ll9A-X forward, thereby .
l4 s~multaneously pulling fixed lengths of wires ~5A-X fro~ the spool$
IS 16A-X for positioning the end portions of the wiresll5A-X over the 16 padsl34 of an integrated circuit chipll2A registered at the work 17 stationl24. The wire end portions are then contacted by the chip 18 bonding headl42 and the wire end portions are simultaneously or ga~s 19 bonded to the padsl34. The clamping meansl23A-X and horizontal pistons ~6A-X are depressurized and the translatable guide portion~
21 l9A-X are returnet to their normal or retracted position. With th~
2t waxl30 u~ler the ir.~egrated circuit chipll2 in the molten state, t~c 23 X-Y tablel32 and the chip bonding headl42 are retracted, so that t~s t4 bonded integra~ed clrcuit chipll2A is suspended at the wor~ statio~
4. The clamping meansl23h-X is then pressurized and the horizon-26 tal pistons 136A-X partially pressurized to'move the translatable t7 guide portionsll9A-X to an intermediate position introducing slac~
,~ : ~ : . .
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~ Z81 .. . . ...
1 ~nto the wlresll5A-X. The carrier feed memberl48 carrying a carri~;
~,~ 2 member ~ is then moYed into position at the work stationl24 to Qupport the integrated circuit chipl 2A and register the carrier . ~ m~mberl49 with predetermined portions of the fine wires bonded to the integrated circuit chipll2A. The carrier bonding headl52 is moved into contact with the predeter~ined portions for bcndi~g , . these predetermined portions in a g2ng to the carrier memberl49.
8 Simultaneously or subsequently, as desired, a notch is introduced ~ 9 into the wiresll5A-X ad3acent the outer bonds while the carrier s~ `10 bonding head ~2 is still engaging the wire. The horlzontal 11 pistonsl36A-X are then depressurized to fully retract the 12 translatable guide portlonsll9A-X, exerting forces on the bonded wires ~5A-X thereby allowi~g the bo~ded wiresll5A-X to undergo predictable breaks at the notches. The bonded integrated circuit¦
chipll2A and ~the carrier memberl~9, the carrier bonding head ~2, 16 and carrier feed memberl48 are then removed from the work station ; 17 24 and the X-Y tablel32 registers another integrated circuit chlp 18 112B at the wor~ stationl24.
The abovementioned sequence of operation Is then repeated continuously to produce com~letet Integrated circ~it psckages (inner and outer bords). Advantsgeously, t~e cycle j 22 time to complete s-p;cksge is e~pected t4 be between about 1.5 ; and 3 secor.ds which approximates the ti~e required wlth the ~-~ tS
f, film carrier ~ethod to obtzin only inner bonds. Moreover, if ~, 26 ~o. 43 AWG wire is used the width of the ends of the translatable27 guide portionsll9A-X at the exit aperturesl22A-X is only about !. ¦ 28 5.5 mils.
_ 33 -, ' .
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. .
,. .~ .
, I Thu~, gang bonding of the end portions of the fine t 2 wiresll5A-X to pads ~4 on an integrated circuit chipll2A
,5 3 (i~nner bond) and subsequently gang bonding of predetermined , 4 portions of the bonded fine wires to a carrier memberl49 (outer ,~ . 5 bo~d) is rapidly and reliably achieved and is expected to provide .~ in excess of iO00 completed integrated circuit packages per ~,l 7 hour.
~.. ; 8 In accordance with the preferred embodiments of .~'9 the present invention, accurate positioning of the wire ,.O end portions over the pads 37 or 134 ~terminaI area~) of an ,s1l Lntegrated circuit chip 12A o'r'll2A tel'ement) i8 attainet by:
12 1. Mounting a wafer 32 or 126 of integrated circuit chlips 1~ 112A-N and its carrier plate33 or 128 on an X-Y j ' 1~ table 34 or 132,'the relati've'position of each ' : :, 15 integrated circuit chip within the wafer 32 or ' 16~ 126 being intrinsically accurate so that ¦
, ~ , 17 each successive integrated circuit chip 18 can be accurately positioned at a work . !,.,, ~ ~tation 30 or 124. j ,~ ~ 20 2. Utilizing filament feed channels 14A-X, ~ , 21 with or without the filament guide plate 24, '! 22 or translatable ~uide portions 119A-X to 23 provide predetermined paths for accurately ~"~ . 24 positioning t'ne wires 15A-X or llSA-X
~' ~ ~ 25 adjacent the worX station 30 or 124 and re~isterin~
~,' 26 the end portions of the wires 15A-X or llSA-X with i'~, ~ predetermined terminal areas at the work ; ' 28 station 30 or 124.
~,~, ' '' ^ 34 -~ ~ ,, .
- ,, . . , . . -:, . . : ' 88:~81 3. Controlling the length of feed of the fine wires 15A-X or 115A-X in small increments to position fixed lengths of wire over predetermined terminal areas at the work station 30 or 124.
In summary, the present invention provides a method and associated apparatus for coupling the end portions of one or more continuous conductive filaments to one or more :
terminal areas on an element mountable at a work station by ~
emplacing the conductive filaments from feed means so that ~ -their end portions are congruent with predetermined geometric -~
~ locations and arranging the feed means relative to the work ~
j station so that the geometric loci defined by the positions of `
-'~ the emplaced conductive filaments are predetermined and repeatable. -It should be understood that various modifications : ~
may be made in the sequence employed in carrying out the present invention and in the specific apparatus illustrated therein. For example, the element (integrated circuit) may be registered at the work station subsequent to feeding the end portions of the wires to the work station as well as before- -hand, as desired. Additionally, the joining or bonding steps may take place at the same work station or at different work ~` stations, It should also be understood that various drive feed means may be employed for feeding the wire, including pneumatic 7i~
diaphragm clamps and piston type wire clamps and the hitch feed drive means may be substituted by a programmable capstan-roller feed , , ~:
.. ~ -:~,.:
~ - 35 -J -bm:
ii~88Z81 l ~eans. Moreover, the horizontal pistons may be replaced by 2 solenoids, cams, lead screws, and the like. Various type~ of 3 ~oining or bonding heads may also be used, e.g., those heated 4 intenmittently or continuously. Also, the integrated circuit chips may be maintained at ambient temperature or preheated to a suitable base temperature, as desiret.
7 It shoult also be understoot that the size snd 8 cross-sectional configuration of the fine wire, its i g composition, and any insulation thereon may vary ant are tO dependent upon the specific application. Fine gold wire, e.g., .7 mlls or l mil may be used. A bare copper wire, 12 tinned or gold plated, if desired, having a diameter of 13 .0022 inches (No. 43 AWG) is suitable for thermocompression ; bonding or similar ~oining applications. Copper wire, tinned if desired, and having heat strippable polyurethane insulation i~ 16 may be uset to obtain eutectic solder reflow ~oiryts, l7 particularly when long wire leads are desired for complex 18 interconnection requirements. Aluminum leads may also be 19 employed for ultrasonic bonding directly to an integrated circuit chip.
21 It should also be understood that the apparatus j 2. of the present invention may be used with a number of similar ¦~ 23 apparatus to transfer and connect integrated circuit chip~
24 from a wafer directly to the interconnection circuit in an 25 ¦~ asserbly L e type o~eratio .
'': ,: ' ~. ' ' ' ' ,. . . . . .
~' 10~8281 1 -i'~ ' .
. `
It should be further understood by those skilled in the art that various modifications may be made in the present invention without departing from the spirit and scope thereof, as described in the specification and defined in the 5 appended c l=a.
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forming notches therein. i 7 Referring to Fig.15, while the clamping meansl23A and 8 23M are pressurizet snd the carrier bonding headl52 is in contact 9 with the bonded wires ~5A andll5M, the horizontal pistons ~6A
10 andl36M are deactivated. The aeactivation of the horizontal ~-~ 11 pistonsl36A andl36M causeo retract~on of the translatable wire 12 guidesll9A andll9M under influence of the return springsl44A
13 andl44M, thereby applying a force to the wires ~5A andll5M
~; 14 clamped between the carrier bonding headl52 and the clamping 15 ~eansl23A antl23M. Thus, the wiresll5A andll5M break 16 ~ predictably at the notches, see Fig.15~ with the r~sult that 17 a fixed length of wire extends outwardly from exit apertures 18 122A andl22M for ~oining to the next integrated circuit chipll2B.
19 The carrier bondLng headl52 and carrier feed memberl48 are then 20 reciprocated away from the work stationl24 and the shuttlel50 ~' ..
21 registers the next integrated circuit chipll2B at the work stationl24.
23 Although in the embodiment shown in Figs. 8-15, notches are introduced into the joined wires and the ~oined ~! ~ 25 wire portions are separated by breaking, it should be under-26 stood that the wires may be cut if desired as lllustrated in 27 th~ embodiments shown in Figs. 1-7.
,,'1 ~ :
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: , . ::, .
:, , . . . :, , ~ 108B281 1 Generally, the preferred sequence of operation of the 2 embodiment of the present lnvent~on in accortance with Figs. 8-3 15 i9 8~ follows: `
~ An integrated circuit chip 112A is registered at the work station 124. To commence operation, with the translatable ~ guide portions ll9A-X in the retracted position, the wires 115A-X .
are manually threaded through the filament guide members 114A-X
8 with the end portions of the wires 115A-X extending outwardly from the exit apertures 122A-X a predetermined distance, as previously described. The remotely positioned fine wires 115A-X
11 are then clamped by pressurizing clamping means 123A-X ant the horizontal pistons 136A-X are pressurized to ve the 13 translatable guide portions ll9A-X forward, thereby .
l4 s~multaneously pulling fixed lengths of wires ~5A-X fro~ the spool$
IS 16A-X for positioning the end portions of the wiresll5A-X over the 16 padsl34 of an integrated circuit chipll2A registered at the work 17 stationl24. The wire end portions are then contacted by the chip 18 bonding headl42 and the wire end portions are simultaneously or ga~s 19 bonded to the padsl34. The clamping meansl23A-X and horizontal pistons ~6A-X are depressurized and the translatable guide portion~
21 l9A-X are returnet to their normal or retracted position. With th~
2t waxl30 u~ler the ir.~egrated circuit chipll2 in the molten state, t~c 23 X-Y tablel32 and the chip bonding headl42 are retracted, so that t~s t4 bonded integra~ed clrcuit chipll2A is suspended at the wor~ statio~
4. The clamping meansl23h-X is then pressurized and the horizon-26 tal pistons 136A-X partially pressurized to'move the translatable t7 guide portionsll9A-X to an intermediate position introducing slac~
,~ : ~ : . .
¦ 3 2 ,^i:l .
r - .
~ -~
`` ` I' ~
~ Z81 .. . . ...
1 ~nto the wlresll5A-X. The carrier feed memberl48 carrying a carri~;
~,~ 2 member ~ is then moYed into position at the work stationl24 to Qupport the integrated circuit chipl 2A and register the carrier . ~ m~mberl49 with predetermined portions of the fine wires bonded to the integrated circuit chipll2A. The carrier bonding headl52 is moved into contact with the predeter~ined portions for bcndi~g , . these predetermined portions in a g2ng to the carrier memberl49.
8 Simultaneously or subsequently, as desired, a notch is introduced ~ 9 into the wiresll5A-X ad3acent the outer bonds while the carrier s~ `10 bonding head ~2 is still engaging the wire. The horlzontal 11 pistonsl36A-X are then depressurized to fully retract the 12 translatable guide portlonsll9A-X, exerting forces on the bonded wires ~5A-X thereby allowi~g the bo~ded wiresll5A-X to undergo predictable breaks at the notches. The bonded integrated circuit¦
chipll2A and ~the carrier memberl~9, the carrier bonding head ~2, 16 and carrier feed memberl48 are then removed from the work station ; 17 24 and the X-Y tablel32 registers another integrated circuit chlp 18 112B at the wor~ stationl24.
The abovementioned sequence of operation Is then repeated continuously to produce com~letet Integrated circ~it psckages (inner and outer bords). Advantsgeously, t~e cycle j 22 time to complete s-p;cksge is e~pected t4 be between about 1.5 ; and 3 secor.ds which approximates the ti~e required wlth the ~-~ tS
f, film carrier ~ethod to obtzin only inner bonds. Moreover, if ~, 26 ~o. 43 AWG wire is used the width of the ends of the translatable27 guide portionsll9A-X at the exit aperturesl22A-X is only about !. ¦ 28 5.5 mils.
_ 33 -, ' .
:, . , - ,:
~ ' ' : ' .
1 10t~8~
. .
,. .~ .
, I Thu~, gang bonding of the end portions of the fine t 2 wiresll5A-X to pads ~4 on an integrated circuit chipll2A
,5 3 (i~nner bond) and subsequently gang bonding of predetermined , 4 portions of the bonded fine wires to a carrier memberl49 (outer ,~ . 5 bo~d) is rapidly and reliably achieved and is expected to provide .~ in excess of iO00 completed integrated circuit packages per ~,l 7 hour.
~.. ; 8 In accordance with the preferred embodiments of .~'9 the present invention, accurate positioning of the wire ,.O end portions over the pads 37 or 134 ~terminaI area~) of an ,s1l Lntegrated circuit chip 12A o'r'll2A tel'ement) i8 attainet by:
12 1. Mounting a wafer 32 or 126 of integrated circuit chlips 1~ 112A-N and its carrier plate33 or 128 on an X-Y j ' 1~ table 34 or 132,'the relati've'position of each ' : :, 15 integrated circuit chip within the wafer 32 or ' 16~ 126 being intrinsically accurate so that ¦
, ~ , 17 each successive integrated circuit chip 18 can be accurately positioned at a work . !,.,, ~ ~tation 30 or 124. j ,~ ~ 20 2. Utilizing filament feed channels 14A-X, ~ , 21 with or without the filament guide plate 24, '! 22 or translatable ~uide portions 119A-X to 23 provide predetermined paths for accurately ~"~ . 24 positioning t'ne wires 15A-X or llSA-X
~' ~ ~ 25 adjacent the worX station 30 or 124 and re~isterin~
~,' 26 the end portions of the wires 15A-X or llSA-X with i'~, ~ predetermined terminal areas at the work ; ' 28 station 30 or 124.
~,~, ' '' ^ 34 -~ ~ ,, .
- ,, . . , . . -:, . . : ' 88:~81 3. Controlling the length of feed of the fine wires 15A-X or 115A-X in small increments to position fixed lengths of wire over predetermined terminal areas at the work station 30 or 124.
In summary, the present invention provides a method and associated apparatus for coupling the end portions of one or more continuous conductive filaments to one or more :
terminal areas on an element mountable at a work station by ~
emplacing the conductive filaments from feed means so that ~ -their end portions are congruent with predetermined geometric -~
~ locations and arranging the feed means relative to the work ~
j station so that the geometric loci defined by the positions of `
-'~ the emplaced conductive filaments are predetermined and repeatable. -It should be understood that various modifications : ~
may be made in the sequence employed in carrying out the present invention and in the specific apparatus illustrated therein. For example, the element (integrated circuit) may be registered at the work station subsequent to feeding the end portions of the wires to the work station as well as before- -hand, as desired. Additionally, the joining or bonding steps may take place at the same work station or at different work ~` stations, It should also be understood that various drive feed means may be employed for feeding the wire, including pneumatic 7i~
diaphragm clamps and piston type wire clamps and the hitch feed drive means may be substituted by a programmable capstan-roller feed , , ~:
.. ~ -:~,.:
~ - 35 -J -bm:
ii~88Z81 l ~eans. Moreover, the horizontal pistons may be replaced by 2 solenoids, cams, lead screws, and the like. Various type~ of 3 ~oining or bonding heads may also be used, e.g., those heated 4 intenmittently or continuously. Also, the integrated circuit chips may be maintained at ambient temperature or preheated to a suitable base temperature, as desiret.
7 It shoult also be understoot that the size snd 8 cross-sectional configuration of the fine wire, its i g composition, and any insulation thereon may vary ant are tO dependent upon the specific application. Fine gold wire, e.g., .7 mlls or l mil may be used. A bare copper wire, 12 tinned or gold plated, if desired, having a diameter of 13 .0022 inches (No. 43 AWG) is suitable for thermocompression ; bonding or similar ~oining applications. Copper wire, tinned if desired, and having heat strippable polyurethane insulation i~ 16 may be uset to obtain eutectic solder reflow ~oiryts, l7 particularly when long wire leads are desired for complex 18 interconnection requirements. Aluminum leads may also be 19 employed for ultrasonic bonding directly to an integrated circuit chip.
21 It should also be understood that the apparatus j 2. of the present invention may be used with a number of similar ¦~ 23 apparatus to transfer and connect integrated circuit chip~
24 from a wafer directly to the interconnection circuit in an 25 ¦~ asserbly L e type o~eratio .
'': ,: ' ~. ' ' ' ' ,. . . . . .
~' 10~8281 1 -i'~ ' .
. `
It should be further understood by those skilled in the art that various modifications may be made in the present invention without departing from the spirit and scope thereof, as described in the specification and defined in the 5 appended c l=a.
'~' 9 11 .
f 13 4 , ' ' '.
17 .
18 . .
J` 19 . .
~ ~ l ~
, . . . , ~ . - . . ~ .
Claims (19)
OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. In a method for coupling the end portion of each of a plurality of continuous conductive filaments to an element mountable at a work station, the improvement which comprises:
establishing a plurality of predetermined fixed paths between said end portions of the conductive filaments and the work station;
simultaneously pushing a fixed length of each of the conductive filaments including its end portion to move said fila-ments through said predetermined fixed paths and cause said end por-tions to assume stationary and unsupported positions over the work station;
subsequently joining said end portions positioned over the work station to predetermined terminal areas of the element mounted at the work station;
positioning said element with said end portions of said conductor filaments joined thereto in stationary position over a carrier having terminal areas for receiving said conductor filaments;
registering a predetermined portion of each of the conductor filaments with a terminal area of said carrier;
joining said predetermined portion of each of said conductor filaments with said registered terminal area of said carrier; and cutting the portions of the conductor filaments join-ing the terminal areas of said element with the terminal areas of said carrier from the remainder of the conductor filaments.
establishing a plurality of predetermined fixed paths between said end portions of the conductive filaments and the work station;
simultaneously pushing a fixed length of each of the conductive filaments including its end portion to move said fila-ments through said predetermined fixed paths and cause said end por-tions to assume stationary and unsupported positions over the work station;
subsequently joining said end portions positioned over the work station to predetermined terminal areas of the element mounted at the work station;
positioning said element with said end portions of said conductor filaments joined thereto in stationary position over a carrier having terminal areas for receiving said conductor filaments;
registering a predetermined portion of each of the conductor filaments with a terminal area of said carrier;
joining said predetermined portion of each of said conductor filaments with said registered terminal area of said carrier; and cutting the portions of the conductor filaments join-ing the terminal areas of said element with the terminal areas of said carrier from the remainder of the conductor filaments.
2. The method recited in claim 1, including the step of:
closely confining the movement of the conductive fila-ments over a portion of said predetermined fixed paths.
closely confining the movement of the conductive fila-ments over a portion of said predetermined fixed paths.
3. The method recited in claim 2, wherein:
said predetermined fixed paths include unsupported portions over the work station.
said predetermined fixed paths include unsupported portions over the work station.
4. The method recited in claim 1, wherein:
the maximum length of said predetermined fixed paths is approximately three orders of magnitude of the thickness of the conductive filaments.
the maximum length of said predetermined fixed paths is approximately three orders of magnitude of the thickness of the conductive filaments.
5. The method recited in claim 1, including the step of:
registering the element with the work station prior to the pushing step.
registering the element with the work station prior to the pushing step.
6. The method recited in claim 1, wherein:
the joining step is attained by thermocompression bonding of said end portions of the conductive filaments to the predetermined terminal areas of the element.
the joining step is attained by thermocompression bonding of said end portions of the conductive filaments to the predetermined terminal areas of the element.
7. The method recited in claim 1, wherein:
said end portions of the conductive filaments are joined in a gang to said first predetermined terminal areas of the element and subsequently said predetermined portions are joined to said predetermined terminal areas of said carrier in a gang.
said end portions of the conductive filaments are joined in a gang to said first predetermined terminal areas of the element and subsequently said predetermined portions are joined to said predetermined terminal areas of said carrier in a gang.
8. The method recited in claim 1, wherein:
said end portions of the conductive filaments are joined in a gang to the predetermined terminal areas.
said end portions of the conductive filaments are joined in a gang to the predetermined terminal areas.
9. In an apparatus for coupling the end portion of each of a plurality of continuous conductive filaments to an element mountable at a work station, the improvement which comprises:
annular guide plate means for establishing a plurality of predetermined fixed paths between the end portions of each of a plurality of the conductive filaments and the work station;
feed means for pushing fixed lengths of each of said plurality of said conductive filaments including the end portion thereof to move each said conductive filament along said annular guide plate and through said predetermined fixed paths and cause the end portions to assume stationary and unsupported positions over the work station; and joining means for subsequently joining the end portions positioned over the work station to predetermined terminal areas of the element mounted at the work station.
annular guide plate means for establishing a plurality of predetermined fixed paths between the end portions of each of a plurality of the conductive filaments and the work station;
feed means for pushing fixed lengths of each of said plurality of said conductive filaments including the end portion thereof to move each said conductive filament along said annular guide plate and through said predetermined fixed paths and cause the end portions to assume stationary and unsupported positions over the work station; and joining means for subsequently joining the end portions positioned over the work station to predetermined terminal areas of the element mounted at the work station.
10. The apparatus recited in claim 9, wherein:
said annular guide plate means closely confines the movement of the conductive filaments over a portion of said predetermined fixed paths.
said annular guide plate means closely confines the movement of the conductive filaments over a portion of said predetermined fixed paths.
11. The apparatus recited in claim 10, wherein:
said predetermined fixed paths include unsupported portions over the work station.
said predetermined fixed paths include unsupported portions over the work station.
12. The apparatus recited in claim 9, wherein:
the maximum length of said predetermined fixed paths is approximately three orders of magnitude of the thickness of the conductive filaments.
the maximum length of said predetermined fixed paths is approximately three orders of magnitude of the thickness of the conductive filaments.
13. The apparatus recited in claim 9, including positioning means for registering the element with the work station prior to activation of said feed means.
14. The apparatus recited in claim 9, wherein:
said joining means includes a thermocompression bonding head for joining the end portions of the conductive filaments to predetermined terminal areas of the element.
said joining means includes a thermocompression bonding head for joining the end portions of the conductive filaments to predetermined terminal areas of the element.
15. The apparatus recited in claim 9, including:
positioning means for effecting registration between predetermined portions of the conductive filaments and second predetermined terminal areas;
joining means for joining said predetermined portions to said second predetermined terminal areas; and cutting means for cutting the portions of the conduc-tive filaments joining said first and second predetermined ter-minal areas from the remainder of the conductive filaments.
positioning means for effecting registration between predetermined portions of the conductive filaments and second predetermined terminal areas;
joining means for joining said predetermined portions to said second predetermined terminal areas; and cutting means for cutting the portions of the conduc-tive filaments joining said first and second predetermined ter-minal areas from the remainder of the conductive filaments.
16. The apparatus recited in claim 15, including:
shuttle means for effecting relative movement between said guide means and the work station prior to activation of said positioning means.
shuttle means for effecting relative movement between said guide means and the work station prior to activation of said positioning means.
17. The apparatus recited in claim 15, wherein:
said first joining means joins the end portions of the conductive filaments in a gang to said first predetermined terminal areas and said second joining means subsequently joins said predetermined portions to said second predetermined terminal areas in a gang.
said first joining means joins the end portions of the conductive filaments in a gang to said first predetermined terminal areas and said second joining means subsequently joins said predetermined portions to said second predetermined terminal areas in a gang.
18. The apparatus recited in claim 15, including:
second positioning means for registering a carrier member including said second predetermined terminal areas with the element.
second positioning means for registering a carrier member including said second predetermined terminal areas with the element.
19. The apparatus recited in claim 9, in which said joining means includes means for joining the end portions of the conductive filaments in a gang to the predetermined terminal areas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA333,383A CA1088282A (en) | 1975-06-26 | 1979-08-08 | Atttaching leads to integrated-circuit chips |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US59057275A | 1975-06-26 | 1975-06-26 | |
| US667,541 | 1976-03-16 | ||
| US05/667,541 US4140265A (en) | 1975-06-26 | 1976-03-16 | Method and apparatus for positioning the end of a conductive filament at a predetermined and repeatable geometric location for coupling to a predetermined terminal area of an element |
| US590,572 | 1990-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1088281A true CA1088281A (en) | 1980-10-28 |
Family
ID=27080881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA255,403A Expired CA1088281A (en) | 1975-06-26 | 1976-06-22 | Attaching leads to integrated-circuit chips |
Country Status (10)
| Country | Link |
|---|---|
| JP (1) | JPS524173A (en) |
| AT (1) | AT368320B (en) |
| AU (1) | AU507497B2 (en) |
| CA (1) | CA1088281A (en) |
| CH (1) | CH612296A5 (en) |
| DE (1) | DE2628519C3 (en) |
| FR (1) | FR2317770A1 (en) |
| GB (1) | GB1541274A (en) |
| IT (1) | IT1066563B (en) |
| NL (1) | NL7606943A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57143717A (en) * | 1981-03-03 | 1982-09-06 | Nippon Telegr & Teleph Corp <Ntt> | Magnetic head for magnetic disk |
| GB2177639B (en) * | 1985-07-08 | 1988-12-29 | Philips Electronic Associated | Ultrasonic wire bonder and method of manufacturing a semiconductor device therewith |
| DE4218741C2 (en) * | 1992-06-06 | 1994-10-20 | Vossloh Schwabe Gmbh | Method for wiring connection points of electrical devices or assembly elements |
| JPH07103897A (en) * | 1993-09-30 | 1995-04-21 | Shimadzu Corp | Emission spectrochemical analyzer |
| DE102008048081B4 (en) * | 2008-09-19 | 2015-06-18 | Cascade Microtech, Inc. | Method for testing electronic components of a repeating structure under defined thermal conditions |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL142018B (en) * | 1964-11-26 | 1974-04-16 | Philips Nv | PROCEDURE FOR THE MANUFACTURE OF A SEMI-CONDUCTIVE DEVICE AND DEVICE MANUFACTURED ACCORDING TO THE PROCESS. |
| BE755950A (en) * | 1969-09-11 | 1971-03-09 | Philips Nv | PROCESS FOR ESTABLISHING ELECTRICAL LINKS BETWEEN CONTACT LOCATIONS OF A SEMICONDUCTOR BODY AND SUPPLY CONDUCTORS |
| US3648354A (en) * | 1969-11-17 | 1972-03-14 | Gen Motors Corp | Tailless bonder for filamentary wire leads |
-
1976
- 1976-05-27 AU AU14370/76A patent/AU507497B2/en not_active Expired
- 1976-06-21 GB GB25711/76A patent/GB1541274A/en not_active Expired
- 1976-06-22 CA CA255,403A patent/CA1088281A/en not_active Expired
- 1976-06-22 CH CH795776A patent/CH612296A5/en not_active IP Right Cessation
- 1976-06-23 AT AT0458876A patent/AT368320B/en not_active IP Right Cessation
- 1976-06-23 DE DE2628519A patent/DE2628519C3/en not_active Expired
- 1976-06-24 JP JP51075964A patent/JPS524173A/en active Granted
- 1976-06-25 FR FR7619343A patent/FR2317770A1/en active Granted
- 1976-06-25 NL NL7606943A patent/NL7606943A/en not_active Application Discontinuation
- 1976-06-25 IT IT50151/76A patent/IT1066563B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| FR2317770B1 (en) | 1978-05-05 |
| GB1541274A (en) | 1979-02-28 |
| JPS524173A (en) | 1977-01-13 |
| AU507497B2 (en) | 1980-02-14 |
| DE2628519A1 (en) | 1976-12-30 |
| AT368320B (en) | 1982-10-11 |
| FR2317770A1 (en) | 1977-02-04 |
| DE2628519B2 (en) | 1980-10-02 |
| IT1066563B (en) | 1985-03-12 |
| DE2628519C3 (en) | 1981-06-04 |
| CH612296A5 (en) | 1979-07-13 |
| AU1437076A (en) | 1977-12-01 |
| JPS5750057B2 (en) | 1982-10-25 |
| ATA458876A (en) | 1982-01-15 |
| NL7606943A (en) | 1976-12-28 |
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