GB1541274A - Method and apparatus for joining continuous conductive filaments to predetermined terminal areas of an element - Google Patents
Method and apparatus for joining continuous conductive filaments to predetermined terminal areas of an elementInfo
- Publication number
- GB1541274A GB1541274A GB25711/76A GB2571176A GB1541274A GB 1541274 A GB1541274 A GB 1541274A GB 25711/76 A GB25711/76 A GB 25711/76A GB 2571176 A GB2571176 A GB 2571176A GB 1541274 A GB1541274 A GB 1541274A
- Authority
- GB
- United Kingdom
- Prior art keywords
- conductor
- connecting point
- predetermined terminal
- continuous conductive
- conductive filaments
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D295/00—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms
- C07D295/04—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms
- C07D295/12—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms
- C07D295/125—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms with the ring nitrogen atoms and the substituent nitrogen atoms attached to the same carbon chain, which is not interrupted by carbocyclic rings
- C07D295/13—Heterocyclic compounds containing polymethylene-imine rings with at least five ring members, 3-azabicyclo [3.2.2] nonane, piperazine, morpholine or thiomorpholine rings, having only hydrogen atoms directly attached to the ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms substituted by singly or doubly bound nitrogen atoms with the ring nitrogen atoms and the substituent nitrogen atoms attached to the same carbon chain, which is not interrupted by carbocyclic rings to an acyclic saturated chain
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01021—Scandium [Sc]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0106—Neodymium [Nd]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01075—Rhenium [Re]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/1026—Compound semiconductors
- H01L2924/1027—IV
- H01L2924/10272—Silicon Carbide [SiC]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
Abstract
A conductor (15) which comes from a supply coil (16) and is in the form of a wire is guided tightly in a channel (14, 19, 20) which is directed to a connecting point (37) of the component (12). The conductor (15) can be moved by means of a feed device (18) in such a manner that its free end comes to rest above the connecting point (37). The conductor (15) is fixed by means of a clamping device (38, 40). The projecting free end is connected to the connecting point (37) by means of a thermal compression device (64). The conductor (15) is thereupon pushed on loosely, a section of the conductor (15) being aligned with a connecting point of an external connecting element and likewise being connected thereto. A plurality of conductors (15A, 15M) are arranged and processed in this manner in order simultaneously to connect them to a plurality of connecting points (37) of the component (12) and to associated connecting points of a plurality of external connecting elements. The method and the device are suitable, in particular, for quick and reliable wiring of integrated semiconductor components. <IMAGE>
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US59057275A | 1975-06-26 | 1975-06-26 | |
US05/667,541 US4140265A (en) | 1975-06-26 | 1976-03-16 | Method and apparatus for positioning the end of a conductive filament at a predetermined and repeatable geometric location for coupling to a predetermined terminal area of an element |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1541274A true GB1541274A (en) | 1979-02-28 |
Family
ID=27080881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB25711/76A Expired GB1541274A (en) | 1975-06-26 | 1976-06-21 | Method and apparatus for joining continuous conductive filaments to predetermined terminal areas of an element |
Country Status (10)
Country | Link |
---|---|
JP (1) | JPS524173A (en) |
AT (1) | AT368320B (en) |
AU (1) | AU507497B2 (en) |
CA (1) | CA1088281A (en) |
CH (1) | CH612296A5 (en) |
DE (1) | DE2628519C3 (en) |
FR (1) | FR2317770A1 (en) |
GB (1) | GB1541274A (en) |
IT (1) | IT1066563B (en) |
NL (1) | NL7606943A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2177639A (en) * | 1985-07-08 | 1987-01-28 | Philips Electronic Associated | Ultrasonic wire bonder and method of manufacturing a semiconductor therewith |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57143717A (en) * | 1981-03-03 | 1982-09-06 | Nippon Telegr & Teleph Corp <Ntt> | Magnetic head for magnetic disk |
DE4218741C2 (en) * | 1992-06-06 | 1994-10-20 | Vossloh Schwabe Gmbh | Method for wiring connection points of electrical devices or assembly elements |
JPH07103897A (en) * | 1993-09-30 | 1995-04-21 | Shimadzu Corp | Emission spectrochemical analyzer |
DE102008048081B4 (en) * | 2008-09-19 | 2015-06-18 | Cascade Microtech, Inc. | Method for testing electronic components of a repeating structure under defined thermal conditions |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL142018B (en) * | 1964-11-26 | 1974-04-16 | Philips Nv | PROCEDURE FOR THE MANUFACTURE OF A SEMI-CONDUCTIVE DEVICE AND DEVICE MANUFACTURED ACCORDING TO THE PROCESS. |
BE755950A (en) * | 1969-09-11 | 1971-03-09 | Philips Nv | PROCESS FOR ESTABLISHING ELECTRICAL LINKS BETWEEN CONTACT LOCATIONS OF A SEMICONDUCTOR BODY AND SUPPLY CONDUCTORS |
US3648354A (en) * | 1969-11-17 | 1972-03-14 | Gen Motors Corp | Tailless bonder for filamentary wire leads |
-
1976
- 1976-05-27 AU AU14370/76A patent/AU507497B2/en not_active Expired
- 1976-06-21 GB GB25711/76A patent/GB1541274A/en not_active Expired
- 1976-06-22 CH CH795776A patent/CH612296A5/en not_active IP Right Cessation
- 1976-06-22 CA CA255,403A patent/CA1088281A/en not_active Expired
- 1976-06-23 DE DE2628519A patent/DE2628519C3/en not_active Expired
- 1976-06-23 AT AT0458876A patent/AT368320B/en not_active IP Right Cessation
- 1976-06-24 JP JP51075964A patent/JPS524173A/en active Granted
- 1976-06-25 FR FR7619343A patent/FR2317770A1/en active Granted
- 1976-06-25 IT IT50151/76A patent/IT1066563B/en active
- 1976-06-25 NL NL7606943A patent/NL7606943A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2177639A (en) * | 1985-07-08 | 1987-01-28 | Philips Electronic Associated | Ultrasonic wire bonder and method of manufacturing a semiconductor therewith |
Also Published As
Publication number | Publication date |
---|---|
ATA458876A (en) | 1982-01-15 |
NL7606943A (en) | 1976-12-28 |
AU1437076A (en) | 1977-12-01 |
FR2317770B1 (en) | 1978-05-05 |
JPS5750057B2 (en) | 1982-10-25 |
FR2317770A1 (en) | 1977-02-04 |
CH612296A5 (en) | 1979-07-13 |
DE2628519B2 (en) | 1980-10-02 |
AT368320B (en) | 1982-10-11 |
DE2628519A1 (en) | 1976-12-30 |
AU507497B2 (en) | 1980-02-14 |
IT1066563B (en) | 1985-03-12 |
JPS524173A (en) | 1977-01-13 |
DE2628519C3 (en) | 1981-06-04 |
CA1088281A (en) | 1980-10-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |