CA1083263A - Prefabricated composite metallic heat-transmitting plate unit - Google Patents

Prefabricated composite metallic heat-transmitting plate unit

Info

Publication number
CA1083263A
CA1083263A CA303,080A CA303080A CA1083263A CA 1083263 A CA1083263 A CA 1083263A CA 303080 A CA303080 A CA 303080A CA 1083263 A CA1083263 A CA 1083263A
Authority
CA
Canada
Prior art keywords
heat
plate unit
accordance
metallic
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA303,080A
Other languages
English (en)
French (fr)
Inventor
Norman Hascoe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semi-Alloys Inc
Original Assignee
Semi-Alloys Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semi-Alloys Inc filed Critical Semi-Alloys Inc
Application granted granted Critical
Publication of CA1083263A publication Critical patent/CA1083263A/en
Expired legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • H10W40/257—
    • H10W40/70—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Laminated Bodies (AREA)
CA303,080A 1977-06-29 1978-05-11 Prefabricated composite metallic heat-transmitting plate unit Expired CA1083263A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US81108477A 1977-06-29 1977-06-29
US811,084 1977-06-29

Publications (1)

Publication Number Publication Date
CA1083263A true CA1083263A (en) 1980-08-05

Family

ID=25205506

Family Applications (1)

Application Number Title Priority Date Filing Date
CA303,080A Expired CA1083263A (en) 1977-06-29 1978-05-11 Prefabricated composite metallic heat-transmitting plate unit

Country Status (7)

Country Link
JP (1) JPS5412569A (esLanguage)
CA (1) CA1083263A (esLanguage)
DE (1) DE2826252A1 (esLanguage)
FR (1) FR2396263A1 (esLanguage)
GB (1) GB1588477A (esLanguage)
IT (1) IT1105422B (esLanguage)
NL (1) NL7806751A (esLanguage)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4283464A (en) * 1979-05-08 1981-08-11 Norman Hascoe Prefabricated composite metallic heat-transmitting plate unit
SE420964B (sv) * 1980-03-27 1981-11-09 Asea Ab Kompositmaterial och sett for dess framstellning
US4427993A (en) * 1980-11-21 1984-01-24 General Electric Company Thermal stress relieving bimetallic plate
US4396936A (en) * 1980-12-29 1983-08-02 Honeywell Information Systems, Inc. Integrated circuit chip package with improved cooling means
FR2511193A1 (fr) * 1981-08-07 1983-02-11 Thomson Csf Support en materiau colamine pour le refroidissement et l'encapsulation d'un substrat de circuit electronique
US5039335A (en) * 1988-10-21 1991-08-13 Texas Instruments Incorporated Composite material for a circuit system and method of making
CA1316303C (en) * 1988-12-23 1993-04-20 Thijs Eerkes Composite structure
JPH02231751A (ja) * 1989-03-03 1990-09-13 Sumitomo Special Metals Co Ltd リードフレーム用材料
US5310520A (en) * 1993-01-29 1994-05-10 Texas Instruments Incorporated Circuit system, a composite material for use therein, and a method of making the material
KR960000706B1 (ko) * 1993-07-12 1996-01-11 한국전기통신공사 전력소자용 플라스틱 패키지 구조 및 그 제조방법
JP2000503489A (ja) * 1996-11-08 2000-03-21 ダブリュ．エル．ゴア アンド アソシエイツ，インコーポレイティド 熱膨張率をコントロールするための銅層に形成された可変的穿孔密度の使用

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL183243C (nl) * 1953-11-30 Metallgesellschaft Ag Werkwijze voor het op metaaloppervlakken aanbrengen van fosfaatbekledingen.
US3296501A (en) * 1962-11-07 1967-01-03 Westinghouse Electric Corp Metallic ceramic composite contacts for semiconductor devices
GB1004020A (en) * 1964-04-24 1965-09-08 Standard Telephones Cables Ltd Improvements in or relating to the mounting of electrical components
US3368112A (en) * 1964-12-18 1968-02-06 Navy Usa Shielding of electrical circuits by metal deposition
US3928907A (en) * 1971-11-18 1975-12-30 John Chisholm Method of making thermal attachment to porous metal surfaces
JPS5039065A (esLanguage) * 1973-08-08 1975-04-10
FR2305025A1 (fr) * 1975-03-21 1976-10-15 Thomson Csf Element de liaison reliant un dispositif semi-conducteur a son support et dispositif comportant un tel element

Also Published As

Publication number Publication date
GB1588477A (en) 1981-04-23
FR2396263B1 (esLanguage) 1984-04-13
IT7849996A0 (it) 1978-06-22
IT1105422B (it) 1985-11-04
JPS5412569A (en) 1979-01-30
NL7806751A (nl) 1979-01-03
FR2396263A1 (fr) 1979-01-26
DE2826252A1 (de) 1979-01-04

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Legal Events

Date Code Title Description
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