CA1077643A - Diphase polymeric substrates for electroless metal deposition - Google Patents
Diphase polymeric substrates for electroless metal depositionInfo
- Publication number
- CA1077643A CA1077643A CA255,541A CA255541A CA1077643A CA 1077643 A CA1077643 A CA 1077643A CA 255541 A CA255541 A CA 255541A CA 1077643 A CA1077643 A CA 1077643A
- Authority
- CA
- Canada
- Prior art keywords
- liquid
- polymer
- constituent
- ethylenic unsaturation
- phase rich
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000454 electroless metal deposition Methods 0.000 title claims description 11
- 239000000758 substrate Substances 0.000 title abstract description 26
- 229920000642 polymer Polymers 0.000 claims abstract description 67
- 239000007788 liquid Substances 0.000 claims abstract description 54
- 239000000203 mixture Substances 0.000 claims abstract description 40
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 28
- 239000012705 liquid precursor Substances 0.000 claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 22
- 230000008021 deposition Effects 0.000 claims abstract description 12
- 230000001590 oxidative effect Effects 0.000 claims abstract description 8
- 239000000470 constituent Substances 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 38
- 230000008569 process Effects 0.000 claims description 25
- 239000007787 solid Substances 0.000 claims description 23
- 239000004593 Epoxy Substances 0.000 claims description 19
- 230000001464 adherent effect Effects 0.000 claims description 18
- 229920003986 novolac Polymers 0.000 claims description 13
- KAKZBPTYRLMSJV-UHFFFAOYSA-N butadiene group Chemical class C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 12
- 238000000151 deposition Methods 0.000 claims description 11
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 claims description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 8
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 4
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 claims description 4
- 230000000379 polymerizing effect Effects 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims 2
- 239000005007 epoxy-phenolic resin Substances 0.000 claims 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 13
- 230000003647 oxidation Effects 0.000 abstract description 11
- 239000000463 material Substances 0.000 description 22
- 239000000047 product Substances 0.000 description 14
- 238000011282 treatment Methods 0.000 description 14
- 239000002904 solvent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 9
- 239000011159 matrix material Substances 0.000 description 9
- 229920001971 elastomer Polymers 0.000 description 8
- 235000013824 polyphenols Nutrition 0.000 description 8
- 239000005060 rubber Substances 0.000 description 8
- 238000001465 metallisation Methods 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 6
- 238000010899 nucleation Methods 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 125000003700 epoxy group Chemical group 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000002243 precursor Substances 0.000 description 5
- 230000003197 catalytic effect Effects 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000004615 ingredient Substances 0.000 description 4
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical group COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 238000007766 curtain coating Methods 0.000 description 3
- 238000010525 oxidative degradation reaction Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- CFRNDJFRRKMHTL-UHFFFAOYSA-N [3-octanoyloxy-2,2-bis(octanoyloxymethyl)propyl] octanoate Chemical compound CCCCCCCC(=O)OCC(COC(=O)CCCCCCC)(COC(=O)CCCCCCC)COC(=O)CCCCCCC CFRNDJFRRKMHTL-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 2
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
- ALSTYHKOOCGGFT-KTKRTIGZSA-N (9Z)-octadecen-1-ol Chemical compound CCCCCCCC\C=C/CCCCCCCCO ALSTYHKOOCGGFT-KTKRTIGZSA-N 0.000 description 1
- GEEGPFGTMRWCID-UHFFFAOYSA-N 1-n,1-n,1-n',1-n'-tetramethylbutane-1,1-diamine Chemical compound CCCC(N(C)C)N(C)C GEEGPFGTMRWCID-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- KOGSPLLRMRSADR-UHFFFAOYSA-N 4-(2-aminopropan-2-yl)-1-methylcyclohexan-1-amine Chemical compound CC(C)(N)C1CCC(C)(N)CC1 KOGSPLLRMRSADR-UHFFFAOYSA-N 0.000 description 1
- CKDAPHXLBCKEKI-UHFFFAOYSA-N C=CC=C.C(=O)(O)C(C#N)=C Chemical compound C=CC=C.C(=O)(O)C(C#N)=C CKDAPHXLBCKEKI-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 101100409194 Rattus norvegicus Ppargc1b gene Proteins 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- QVYARBLCAHCSFJ-UHFFFAOYSA-N butane-1,1-diamine Chemical compound CCCC(N)N QVYARBLCAHCSFJ-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000018984 mastication Effects 0.000 description 1
- 238000010077 mastication Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- CFJYNSNXFXLKNS-UHFFFAOYSA-N p-menthane Chemical compound CC(C)C1CCC(C)CC1 CFJYNSNXFXLKNS-UHFFFAOYSA-N 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- BALXUFOVQVENIU-KXNXZCPBSA-N pseudoephedrine hydrochloride Chemical compound [H+].[Cl-].CN[C@@H](C)[C@@H](O)C1=CC=CC=C1 BALXUFOVQVENIU-KXNXZCPBSA-N 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- DSROZUMNVRXZNO-UHFFFAOYSA-K tris[(1-naphthalen-1-yl-3-phenylnaphthalen-2-yl)oxy]alumane Chemical compound C=1C=CC=CC=1C=1C=C2C=CC=CC2=C(C=2C3=CC=CC=C3C=CC=2)C=1O[Al](OC=1C(=C2C=CC=CC2=CC=1C=1C=CC=CC=1)C=1C2=CC=CC=C2C=CC=1)OC(C(=C1C=CC=CC1=C1)C=2C3=CC=CC=C3C=CC=2)=C1C1=CC=CC=C1 DSROZUMNVRXZNO-UHFFFAOYSA-K 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L13/00—Compositions of rubbers containing carboxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemically Coating (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US59877075A | 1975-07-25 | 1975-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1077643A true CA1077643A (en) | 1980-05-13 |
Family
ID=24396845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA255,541A Expired CA1077643A (en) | 1975-07-25 | 1976-06-23 | Diphase polymeric substrates for electroless metal deposition |
Country Status (13)
| Country | Link |
|---|---|
| JP (1) | JPS5953295B2 (OSRAM) |
| AT (1) | AT362008B (OSRAM) |
| AU (1) | AU503695B2 (OSRAM) |
| CA (1) | CA1077643A (OSRAM) |
| CH (1) | CH636631A5 (OSRAM) |
| DE (1) | DE2633094C3 (OSRAM) |
| FR (1) | FR2333024A1 (OSRAM) |
| GB (1) | GB1531826A (OSRAM) |
| IL (1) | IL50093A (OSRAM) |
| IT (1) | IT1066020B (OSRAM) |
| NL (1) | NL185935C (OSRAM) |
| SE (1) | SE7608413L (OSRAM) |
| ZA (1) | ZA763010B (OSRAM) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2809917B1 (de) * | 1978-03-08 | 1979-07-26 | Dynamit Nobel Ag | Basismaterial zum Herstellen gedruckter Schaltungen nach Additivverfahren und Verfahren zum Herstellen desselben |
| DE2828288C2 (de) * | 1978-06-28 | 1982-04-15 | Dynamit Nobel Ag, 5210 Troisdorf | Verfahren zur Herstellung von Basismaterial für gedruckte Schaltungen |
| US4797508A (en) * | 1986-09-19 | 1989-01-10 | Firan Corporation | Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby |
| CA1318416C (en) * | 1987-01-14 | 1993-05-25 | Kollmorgen Corporation | Bonding compositions for the manufacture of additive printed wiring boards and articles made with the bonding composition |
| JPH02117948A (ja) * | 1988-08-30 | 1990-05-02 | Japan Synthetic Rubber Co Ltd | 変性エポキシ組成物 |
| JP4722954B2 (ja) * | 2008-03-17 | 2011-07-13 | イビデン株式会社 | プリント配線板用接着剤および、プリント配線板用接着剤層の製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1790293B2 (de) * | 1966-02-22 | 1973-12-13 | Photocircuits Corp., Glen Cove, N.Y. (V.St.A.) | Verfahren zur Herstellung von ge druckten Schaltungen Ausscheidung aus 1665314 |
| AT310285B (de) * | 1966-02-22 | 1973-09-25 | Photocircuits Corp | Verfahren zur Herstellung eines Schichtkörpers für gedruckte Schaltungen |
-
1976
- 1976-05-20 ZA ZA763010A patent/ZA763010B/xx unknown
- 1976-06-23 CA CA255,541A patent/CA1077643A/en not_active Expired
- 1976-06-24 AU AU15255/76A patent/AU503695B2/en not_active Expired
- 1976-07-19 CH CH922376A patent/CH636631A5/de not_active IP Right Cessation
- 1976-07-20 DE DE2633094A patent/DE2633094C3/de not_active Expired
- 1976-07-21 IL IL50093A patent/IL50093A/xx unknown
- 1976-07-23 AT AT545376A patent/AT362008B/de not_active IP Right Cessation
- 1976-07-23 GB GB30744/76A patent/GB1531826A/en not_active Expired
- 1976-07-23 NL NLAANVRAGE7608242,A patent/NL185935C/xx not_active IP Right Cessation
- 1976-07-23 SE SE7608413A patent/SE7608413L/xx unknown
- 1976-07-26 IT IT50600/76A patent/IT1066020B/it active
- 1976-07-26 FR FR7622745A patent/FR2333024A1/fr active Granted
- 1976-07-26 JP JP51089616A patent/JPS5953295B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| NL185935C (nl) | 1990-08-16 |
| AT362008B (de) | 1981-04-27 |
| DE2633094A1 (de) | 1977-01-27 |
| SE7608413L (sv) | 1977-01-26 |
| NL185935B (nl) | 1990-03-16 |
| IL50093A0 (en) | 1976-09-30 |
| ZA763010B (en) | 1977-04-27 |
| GB1531826A (en) | 1978-11-08 |
| AU1525576A (en) | 1978-01-05 |
| IT1066020B (it) | 1985-03-04 |
| AU503695B2 (en) | 1979-09-13 |
| IL50093A (en) | 1980-01-31 |
| JPS5953295B2 (ja) | 1984-12-24 |
| FR2333024B1 (OSRAM) | 1979-05-25 |
| DE2633094B2 (de) | 1979-08-30 |
| DE2633094C3 (de) | 1987-02-12 |
| NL7608242A (nl) | 1977-01-27 |
| CH636631A5 (en) | 1983-06-15 |
| ATA545376A (de) | 1980-09-15 |
| JPS5215569A (en) | 1977-02-05 |
| FR2333024A1 (fr) | 1977-06-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE69426472T2 (de) | Klebstoffe für stromlose Metallisierung und Leiterplatten | |
| AU608215B2 (en) | Conductive copper paste composition | |
| US4391742A (en) | Paste composition for the production of electrically conductive and solderable structures | |
| AU608245B2 (en) | Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby | |
| US3347724A (en) | Metallizing flexible substrata | |
| US3259559A (en) | Method for electroless copper plating | |
| DE69418228T2 (de) | Katalytischen Metall-Polymer-Komplex enthaltende Zusammensetzung und mehrschichtiger Vorformling oder Laminat daraus | |
| US4832989A (en) | Method of improving the bond strength of electrolessly deposited metal layers on plastic-material surfaces | |
| CA1077643A (en) | Diphase polymeric substrates for electroless metal deposition | |
| US4522850A (en) | Polymeric substrates for electroless metal deposition | |
| JPH05502059A (ja) | ポリ（アリールエーテルケトン）表面の金属被覆 | |
| US3399268A (en) | Chemical metallization and products produced thereby | |
| CN111440364B (zh) | 树脂组合物、半固化片、电路基板和印制电路板 | |
| EP1236760A1 (en) | Solvent swell for texturing resinous material and desmearing and removing resinous material | |
| US3567487A (en) | Metallizable polyolefins | |
| US3770571A (en) | Fabrication of printed circuit boards | |
| US3697319A (en) | Method of metallizing an electrically insulating surface | |
| EP0138609A2 (en) | Resin compositions for laminated boards | |
| US3681474A (en) | Electrical substrates | |
| CA2046882A1 (en) | Electroless plating method | |
| US3616195A (en) | Printed circuit board having metal layer bonded to hydrocarbon base and method of making it | |
| US3781275A (en) | Electrical substrates | |
| US4687681A (en) | Method of making a chemically bonded coating on a fibrous or filamentous substrate | |
| JPH09124806A (ja) | プリプレグの製法 | |
| US5162438A (en) | Adhesive for printed circuit boards based on epoxy resins, hydrogenated polymer rubbers and curing agents |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |