BRPI0923092B1 - Dispositivo e método para tratamento e/ou revestimento de superfícies de componentes de substrato por deposição a partir da fase gasosa - Google Patents
Dispositivo e método para tratamento e/ou revestimento de superfícies de componentes de substrato por deposição a partir da fase gasosa Download PDFInfo
- Publication number
- BRPI0923092B1 BRPI0923092B1 BRPI0923092-0A BRPI0923092A BRPI0923092B1 BR PI0923092 B1 BRPI0923092 B1 BR PI0923092B1 BR PI0923092 A BRPI0923092 A BR PI0923092A BR PI0923092 B1 BRPI0923092 B1 BR PI0923092B1
- Authority
- BR
- Brazil
- Prior art keywords
- treatment
- coating
- deposition
- substrate
- substrate components
- Prior art date
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 117
- 239000011248 coating agent Substances 0.000 title claims abstract description 115
- 239000000758 substrate Substances 0.000 title claims abstract description 102
- 238000000034 method Methods 0.000 title claims abstract description 63
- 230000008021 deposition Effects 0.000 title claims abstract description 32
- 239000007792 gaseous phase Substances 0.000 title description 3
- 238000011282 treatment Methods 0.000 claims abstract description 99
- 238000009434 installation Methods 0.000 claims abstract description 34
- 238000000151 deposition Methods 0.000 claims abstract description 31
- 239000000969 carrier Substances 0.000 claims abstract description 30
- 238000005240 physical vapour deposition Methods 0.000 claims abstract description 27
- 239000000126 substance Substances 0.000 claims abstract description 17
- 238000001704 evaporation Methods 0.000 claims abstract description 7
- 230000008020 evaporation Effects 0.000 claims abstract description 7
- 238000002955 isolation Methods 0.000 claims abstract description 7
- 238000004381 surface treatment Methods 0.000 claims abstract description 7
- 238000005289 physical deposition Methods 0.000 claims abstract description 6
- 238000010276 construction Methods 0.000 claims description 16
- 238000010438 heat treatment Methods 0.000 claims description 13
- 125000004122 cyclic group Chemical group 0.000 claims description 3
- 238000005192 partition Methods 0.000 claims description 3
- 230000001360 synchronised effect Effects 0.000 claims description 3
- 230000000717 retained effect Effects 0.000 claims description 2
- 230000008569 process Effects 0.000 description 21
- 238000009413 insulation Methods 0.000 description 12
- 239000012071 phase Substances 0.000 description 10
- 239000007789 gas Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 238000005253 cladding Methods 0.000 description 4
- 238000005553 drilling Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002052 molecular layer Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000009489 vacuum treatment Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 230000035899 viability Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008062332A DE102008062332A1 (de) | 2008-12-15 | 2008-12-15 | Vorrichtung zur Oberflächenbehandlung und/oder -beschichtung von Substratkomponenten |
| DE102008062332.6 | 2008-12-15 | ||
| PCT/DE2009/001712 WO2010069289A1 (de) | 2008-12-15 | 2009-12-04 | Vorrichtung zur oberflächenbehandlung und/oder -beschichtung von substratkomponenten |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| BRPI0923092A2 BRPI0923092A2 (pt) | 2016-07-26 |
| BRPI0923092B1 true BRPI0923092B1 (pt) | 2020-02-11 |
Family
ID=41818515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0923092-0A BRPI0923092B1 (pt) | 2008-12-15 | 2009-12-04 | Dispositivo e método para tratamento e/ou revestimento de superfícies de componentes de substrato por deposição a partir da fase gasosa |
Country Status (13)
| Country | Link |
|---|---|
| US (2) | US20110305833A1 (enExample) |
| EP (1) | EP2373828B1 (enExample) |
| JP (1) | JP5700454B2 (enExample) |
| KR (1) | KR20110098764A (enExample) |
| CN (1) | CN102245799B (enExample) |
| AU (1) | AU2009328788B2 (enExample) |
| BR (1) | BRPI0923092B1 (enExample) |
| CA (1) | CA2748893A1 (enExample) |
| DE (1) | DE102008062332A1 (enExample) |
| EA (1) | EA023891B1 (enExample) |
| MX (1) | MX2011006238A (enExample) |
| SG (1) | SG172178A1 (enExample) |
| WO (1) | WO2010069289A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010032591A1 (de) | 2010-07-23 | 2012-01-26 | Leybold Optics Gmbh | Vorrichtung und Verfahren zur Vakuumbeschichtung |
| CN102560373B (zh) * | 2010-12-16 | 2014-12-17 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 基片加热腔室、使用基片加热腔室的方法及基片处理设备 |
| CN102560381A (zh) * | 2010-12-29 | 2012-07-11 | 鸿富锦精密工业（深圳）有限公司 | 溅镀装置 |
| EP2664690B1 (en) * | 2012-05-15 | 2015-09-16 | ZhongAo HuiCheng Technology Co. Ltd. | A magnetron sputtering coating device and the preparation method of a nano-multilayer film |
| EP2868768B1 (en) | 2013-10-29 | 2021-06-16 | Oerlikon Surface Solutions AG, Pfäffikon | Shutter system |
| CN103643205B (zh) * | 2013-12-04 | 2015-11-18 | 王普 | 一种真空镀膜机 |
| WO2015161469A1 (zh) * | 2014-04-23 | 2015-10-29 | 中奥汇成科技股份有限公司 | 一种人工关节臼杯、磁控溅射镀膜装置及其制备方法 |
| CN104120389B (zh) * | 2014-08-04 | 2016-08-24 | 上海和辉光电有限公司 | 镀膜设备 |
| JP6823392B2 (ja) * | 2016-07-05 | 2021-02-03 | 東京エレクトロン株式会社 | 絶縁膜を形成する方法 |
| CN107130213B (zh) * | 2017-05-03 | 2019-04-09 | 成都真锐科技涂层技术有限公司 | 多元合金复合薄膜制备设备和制备方法 |
| CN112166208B (zh) * | 2017-07-19 | 2023-12-12 | 因特瓦克公司 | 用于形成纳米层合光学涂层的系统 |
| KR102022927B1 (ko) * | 2017-10-19 | 2019-09-19 | 재단법인 오송첨단의료산업진흥재단 | 의료용 peek 소재 표면의 마이크로 기공 구조의 타이타늄 코팅 방법 |
| CN109023245B (zh) * | 2017-12-08 | 2020-04-03 | 西安穿越光电科技有限公司 | 一种高稳定性oled蒸镀设备 |
| KR20210130762A (ko) * | 2019-02-20 | 2021-11-01 | 외를리콘 서피스 솔루션즈 아게, 페피콘 | 모듈식 코팅 시설에서 기판을 수송 및 이동시키기 위한 최적화된 시스템 및 방법 |
| CN109898062A (zh) * | 2019-03-07 | 2019-06-18 | 厦门阿匹斯智能制造系统有限公司 | 一种磁控溅射镀膜设备及镀膜方法 |
| CN115896747B (zh) * | 2021-09-30 | 2024-10-15 | 馗鼎奈米科技(深圳)有限公司 | 表面处理设备 |
| US12331400B2 (en) | 2022-11-07 | 2025-06-17 | Creating Nano Technologies, Inc. | Surface treatment apparatus |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4485759A (en) * | 1983-01-19 | 1984-12-04 | Multi-Arc Vacuum Systems Inc. | Planetary substrate support apparatus for vapor vacuum deposition coating |
| JPS59157281A (ja) * | 1983-02-24 | 1984-09-06 | Tokuda Seisakusho Ltd | スパツタリング装置 |
| US5328583A (en) * | 1991-11-05 | 1994-07-12 | Canon Kabushiki Kaisha | Sputtering apparatus and process for forming lamination film employing the apparatus |
| GB9405442D0 (en) * | 1994-03-19 | 1994-05-04 | Applied Vision Ltd | Apparatus for coating substrates |
| GB9514773D0 (en) * | 1995-07-19 | 1995-09-20 | Teer Coatings Ltd | Methods for improving the sputter deposition of metal-sulphur coatings e.g.molybdenum disulphide(MoS2) coatings |
| US6054029A (en) * | 1996-02-23 | 2000-04-25 | Singulus Technologies Gmbh | Device for gripping, holdings and/or transporting substrates |
| DE29615190U1 (de) * | 1996-03-11 | 1996-11-28 | Balzers Verschleissschutz GmbH, 55411 Bingen | Anlage zur Beschichtung von Werkstücken |
| US6174377B1 (en) * | 1997-03-03 | 2001-01-16 | Genus, Inc. | Processing chamber for atomic layer deposition processes |
| DE19738234C1 (de) * | 1997-09-02 | 1998-10-22 | Fraunhofer Ges Forschung | Einrichtung zum Aufstäuben von Hartstoffschichten |
| US6051113A (en) | 1998-04-27 | 2000-04-18 | Cvc Products, Inc. | Apparatus and method for multi-target physical-vapor deposition of a multi-layer material structure using target indexing |
| US6576062B2 (en) * | 2000-01-06 | 2003-06-10 | Tokyo Electron Limited | Film forming apparatus and film forming method |
| US6630053B2 (en) * | 2000-08-22 | 2003-10-07 | Asm Japan K.K. | Semiconductor processing module and apparatus |
| JP2006051594A (ja) * | 2004-07-14 | 2006-02-23 | Mitsubishi Materials Corp | 耐熱合金の高速重切削で硬質被覆層がすぐれた耐チッピング性を発揮する表面被覆超硬合金製切削工具 |
| CH697552B1 (de) | 2004-11-12 | 2008-11-28 | Oerlikon Trading Ag | Vakuumbehandlungsanlage. |
| US9997338B2 (en) * | 2005-03-24 | 2018-06-12 | Oerlikon Surface Solutions Ag, Pfäffikon | Method for operating a pulsed arc source |
| US20070218702A1 (en) * | 2006-03-15 | 2007-09-20 | Asm Japan K.K. | Semiconductor-processing apparatus with rotating susceptor |
| DE102006020004B4 (de) | 2006-04-26 | 2011-06-01 | Systec System- Und Anlagentechnik Gmbh & Co.Kg | Vorrichtung und Verfahren zur homogenen PVD-Beschichtung |
| WO2008013469A1 (en) * | 2006-07-26 | 2008-01-31 | Dmitry Davidovich Spivakov | Method for ion-plasma application of film coatings and a device for carrying out said method |
| CN100575540C (zh) * | 2006-08-28 | 2009-12-30 | 北京有色金属研究总院 | 批量化制备双面高温超导薄膜装置 |
| JPWO2008050384A1 (ja) * | 2006-10-23 | 2010-02-25 | オーエスジー株式会社 | 硬質積層被膜、硬質積層被膜被覆工具、および被膜形成方法 |
| JP4768699B2 (ja) * | 2006-11-30 | 2011-09-07 | キヤノンアネルバ株式会社 | 電力導入装置及び成膜方法 |
-
2008
- 2008-12-15 DE DE102008062332A patent/DE102008062332A1/de not_active Withdrawn
-
2009
- 2009-12-04 KR KR1020117014943A patent/KR20110098764A/ko not_active Ceased
- 2009-12-04 CN CN200980150003.0A patent/CN102245799B/zh not_active Expired - Fee Related
- 2009-12-04 SG SG2011043791A patent/SG172178A1/en unknown
- 2009-12-04 AU AU2009328788A patent/AU2009328788B2/en not_active Ceased
- 2009-12-04 WO PCT/DE2009/001712 patent/WO2010069289A1/de not_active Ceased
- 2009-12-04 CA CA2748893A patent/CA2748893A1/en not_active Abandoned
- 2009-12-04 EP EP09807664.9A patent/EP2373828B1/de active Active
- 2009-12-04 JP JP2011539893A patent/JP5700454B2/ja active Active
- 2009-12-04 MX MX2011006238A patent/MX2011006238A/es active IP Right Grant
- 2009-12-04 BR BRPI0923092-0A patent/BRPI0923092B1/pt not_active IP Right Cessation
- 2009-12-04 EA EA201170814A patent/EA023891B1/ru not_active IP Right Cessation
-
2011
- 2011-05-10 US US13/104,394 patent/US20110305833A1/en not_active Abandoned
-
2013
- 2013-04-01 US US13/854,311 patent/US10711349B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| AU2009328788A1 (en) | 2011-07-28 |
| MX2011006238A (es) | 2011-06-28 |
| EP2373828B1 (de) | 2014-11-12 |
| CA2748893A1 (en) | 2010-06-24 |
| US20110305833A1 (en) | 2011-12-15 |
| EA201170814A1 (ru) | 2011-12-30 |
| SG172178A1 (en) | 2011-07-28 |
| JP2012512321A (ja) | 2012-05-31 |
| DE102008062332A1 (de) | 2010-06-17 |
| AU2009328788B2 (en) | 2015-10-29 |
| JP5700454B2 (ja) | 2015-04-15 |
| CN102245799B (zh) | 2014-02-12 |
| KR20110098764A (ko) | 2011-09-01 |
| US20130216711A1 (en) | 2013-08-22 |
| WO2010069289A1 (de) | 2010-06-24 |
| EP2373828A1 (de) | 2011-10-12 |
| CN102245799A (zh) | 2011-11-16 |
| BRPI0923092A2 (pt) | 2016-07-26 |
| EA023891B1 (ru) | 2016-07-29 |
| US10711349B2 (en) | 2020-07-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| BRPI0923092B1 (pt) | Dispositivo e método para tratamento e/ou revestimento de superfícies de componentes de substrato por deposição a partir da fase gasosa | |
| US8574367B2 (en) | Evaporation source | |
| JP2012512321A5 (enExample) | ||
| CN103906856B (zh) | 用于通过真空蒸发沉积薄膜的装置的喷射系统 | |
| EP1777320B1 (en) | Apparatus and method for depositing thin films | |
| KR20140057208A (ko) | 조합식 및 풀 기판 스퍼터 증착 도구 및 방법 | |
| KR20200033457A (ko) | 리니어소스 및 그를 가지는 기판처리장치 | |
| CN215517609U (zh) | 一种电子束蒸镀装置 | |
| US6206975B1 (en) | Vacuum treatment system for application of thin, hard layers | |
| US20090136663A1 (en) | Vacuum vapor deposition apparatus and method, and vapor deposited article formed therewith | |
| CN115287607B (zh) | 一种高效率的涡轮叶片电子束物理气相沉积装置 | |
| CN101962751B (zh) | 一种多步物理气相沉积设备 | |
| US20050241585A1 (en) | System for vaporizing materials onto a substrate surface | |
| CN118109786B (zh) | 一种氧解离辅助物理气相沉积制备热障涂层的装置与方法 | |
| KR20130052102A (ko) | 박막 증착용 증발기 | |
| KR102517747B1 (ko) | Pcb 기판용 회전형 열 증발 확산 증착장치 | |
| US12270099B2 (en) | Film-forming device, film-forming unit, and film-forming method | |
| CN118932296A (zh) | 蒸镀源组件、蒸镀装置及蒸镀方法 | |
| JP2012072460A (ja) | 蒸着装置 | |
| KR101111352B1 (ko) | 다층 박막코팅용 타겟장치 | |
| CN113652666A (zh) | 具有冷却装置的真空镀膜系统 | |
| JP2022003159A (ja) | 蒸着装置 | |
| JP2023501929A (ja) | アイドルシールド、堆積装置、堆積システム、ならびに組み立てる方法および動作させる方法 | |
| KR20140030418A (ko) | 웨이퍼 개별 회전 제어가 가능한 서셉터를 구비하는 증착 장치 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B06F | Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette] | ||
| B15K | Others concerning applications: alteration of classification |
Free format text: AS CLASSIFICACOES ANTERIORES ERAM: C23C 14/35 , C23C 14/56 Ipc: C23C 14/00 (1985.01), C23C 14/56 (1985.01), C23C 1 |
|
| B06T | Formal requirements before examination [chapter 6.20 patent gazette] | ||
| B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
| B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 11/02/2020, OBSERVADAS AS CONDICOES LEGAIS. |
|
| B21F | Lapse acc. art. 78, item iv - on non-payment of the annual fees in time |
Free format text: REFERENTE A 15A ANUIDADE. |
|
| B24J | Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12) |
Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2804 DE 01-10-2024 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |