Classifications

• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
  • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
  • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
  • C23C16/54—Apparatus specially adapted for continuous coating
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
  • C23C14/34—Sputtering
  • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
  • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks

Definitions

• the invention relates to a device and a method for surface treatment and / or coating of substrate components by deposition from the gas phase, in particular by physical vapor deposition after the PVD (Physical Vapor Deposition) or the reactive PVD method, according to the preamble of Patent claim 1 or claim 14.
• PVD Physical Vapor Deposition
• the reactive PVD method according to the preamble of Patent claim 1 or claim 14.
• workpiece surfaces ie on substrate components very thin layers, such as corrosion or wear protection layers such.
• Such thin films often find in tool production, especially in the production of precision cutting tools, such. As drilling, milling or reaming tools application.
• the coating material is first by applying a suitable physical effects, such. B. evaporated by an electron beam, an arc (Arc-PVD) or by sputtering. The vaporized material then impinges on the substrate surface, where it comes to film formation. In order for the vapor particles to reach the substrate, it is necessary to work with negative pressure. In this process, there is a linear particle movement, so that the substrate must be moved so that the entire substrate surface can be uniformly and homogeneously coated.
• PVD physical vapor deposition
• sputtering including magnetron sputtering, ion plating, including reactive ion plating, or laser evaporation or vacuum evaporation.
• All methods have in common that in order to achieve the desired coating or treatment effect, the process parameters such as gas atmosphere, temperature and orientation of the substrate surface to the coating material must be maintained very accurately. Therefore, conventional coating systems have been constructed so that the treatment chamber room for several substrate carriers and coating and / or treatment units such.
• evaporator sources, cathodes, targets, magnetrons, etc. offers.
• Such vacuum treatment plants are z. For example, in DE 102005 050 358 A1 or in DE 102006 020 004 A1.
• the substrates to be coated or treated can be provided with only a single layer type. Even if this type of layer is a multi-layer, as described for example in document US Pat. No. 6,051,113, this means for conventional coating systems that only one type of layer can be deposited over the entire charge of the coating systems, even if the layer thickness differs over the entire charge can behave. As a result, conventional coating systems can often only be operated uneconomically. Because the percentage of most process time in the coating and / or treatment plants according to the PVD process described above is consumed during heating and cooling of the substrates and their holding devices. In addition, because in many coating centers, the spectrum of substrate components to be coated is broad, also different layers are required for the different substrate components. Since the volume of the coating system is fixed due to the dimensions of the coating boiler, the number of substrates or substrate components that require a certain layer type is often not sufficient to fill a coating system to 100%, ultimately the required delivery times can not be met.
• the invention is therefore an apparatus for surface treatment and / or coating of substrate components by deposition from the gas phase, in particular by physical vapor deposition by the PVD method, and a method for operating such a device to provide, with or with the it succeeds in minimizing the process and delivery times.
• the device is constructed in such a way that it can be equipped with modules in such a way that the substrate components introduced into the charge device in a charge after closing the coating / treatment space undergo a different treatment, ie a coating or a surface treatment , can be subjected.
• a different treatment ie a coating or a surface treatment
• the inventive design of the device to increase the utilization rate of the coating system considerably and also to operate the coating system much more economical and with greatly improved energy efficiency. Because the inventively larger number of substrate components in the coating system is only once to heat and cool, thereby process time is saved to a considerable extent.
• the method according to the invention is characterized in the core in that coating and / or treatment units and shielding modules are assembled according to a desired coating and / or treatment program for substrate components to be coated differently, and then the substrate carriers are loaded with those substrate components which are in a batch of the same treatment. After closing the treatment chamber, the shielding modules and the process control of the system then ensure that the substrate components combined on the individual substrate carriers are subjected to an individual coating and / or treatment program. In this case, according to a development of the method, a different treatment of the substrate components at different locations of the coating chamber can even take place simultaneously.
• the available space of the treatment chamber is advantageously utilized, with the additional advantage that the different treatments of the substrate components can occur simultaneously due to the spatial separation of the treatment stations.
• this opens up the possibility of subjecting different substrate carriers, before selected coating and / or treatment units, to individual treatment with precisely controlled process parameters, without being affected by adjacent hard coating and / or treatment units to be influenced. This makes it possible to achieve a very accurate and homogeneous growth rate of the layer.
• the shielding device according to claim 3 which is preferably in turn formed as a module, it is possible to save valuable tree space, because by means of the shielding module substrate components can be subject to different treatment even in the smallest space.
• the partitions may be made of different materials, including ceramic and / or perforated sheet material.
• kinematics is provided with which the relative position between the substrate carriers and the coating and / or treatment units and / or heaters can be changed in the closed deposition or treatment chamber.
• the rotary drive device for the assembly table is simultaneously used as an indexing device for positioning selected substrate carriers with respect to selected coating and / or treatment units, as a result of which the complexity of the control technology becomes smaller.
• a rotary drive for example in the form of a shaft, is provided on each mounting location of the mounting table for a substrate carrier. It is possible in this way, the coating system at 100% To operate filling with uniformly coated substrate elements in a conventional manner, without losing the flexibility of the system described above.
• a selected substrate carrier in the immediate vicinity of a coating and / or treatment unit are set in rotary motion, without operating the clock mode, whereby it succeeds on these selected substrate components to deposit an extremely homogeneous and precisely defined in its thickness layer.
• the coating system according to the invention also makes it possible to operate selected coating and / or treatment units synchronously, thereby saving further processing time.
• FIG. 1 is a perspective view of the interior of a coating system with removed coating chamber wall.
• FIG. 2 is a schematic plan view of the coating installation according to FIG. 1 with the coating chamber closed;
• FIG. 3 shows a schematic sectional view of the coating installation according to FIG. 2 with a cutting guide according to HI-III in FIG. 2;
• FIG. 4 shows a perspective schematic view of selected drive components of the coating installation according to the invention.
• FIGS. 5A to 5D are diagrams for showing different mounting table positions in carrying out the method according to the invention.
• the figures schematically show the components accommodated in the interior of a process chamber of a coating installation (not shown) which are required for coating substrate components according to the PVD method or according to the reactive PVD method.
• the assemblies shown in the figures are arranged in an evacuable and preferably provided with different gas connections coating chamber or vacuum chamber.
• Such vacuum chambers are known, so that can be dispensed with a detailed description of this chamber here.
• the peculiarity of the coating system to be described in detail below is how the interior of the evacuatable deposition or treatment chamber can be equipped to significantly increase the efficiency in the operation of such a system and to minimize the process times of the system due to improved flexibility.
• coating and / or treatment modules 12 are arranged at predetermined angular intervals. These coating and / or treatment modules 12 are formed, for example, by evaporators or so-called sputtering cathodes with modularly populated targets, wherein in addition - so-called shutters - not shown in more detail - could be used. Such coating or treatment modules are known per se, so that a more detailed description of these components is unnecessary here. It should be emphasized, however, that the present invention is not limited to specific treatment / coating modules. Rather, all units regularly used in the coating process according to the PVD method can be used. In addition to the coating / treatment modules 12 heating units 14 are additionally provided, which are usually arranged between the treatment modules 12 and can also be designed as modules.
• etching anode denoted by 16 which interacts with a central filament cathode, not shown in the figures, which lie above the coating modules 12 and heating units 14 in the region of the dome of the coating chamber (not shown).
• Fig. 1 shows the arrangement of the modules required for the coating or treatment in the open deposition or treatment chamber, while in the plan view of FIG. 2, the arrangement is shown with the chamber closed. It follows from this illustration that part of the coating modules 12 and heating units 14 grouped around the assembly table 10 can be mounted on a separate component which serves as a loading door for the vacuum chamber. The remaining coating and heating modules are mounted on a support structure which - just like the loading door - has mounting points for the flexible arrangement of the coating and heating modules.
• the assembly table 10 is designed as a kind of carousel and it carries - as best seen in FIG. 2 - several, that is in the illustrated embodiment 8, preferably identically designed mounting positions 18-1 to 18-8, which can be equipped individually with different modules are.
• Each mounting place 18-1 to 18-8 is associated with a drive shaft 22, each having a vertical axis of rotation.
• the drive shaft 22 is rotatably coupled to a vertical support shaft 24, the turntable 26 in predetermined and preferably adjustable axial spacings with plug-in receptacles 30 for supporting substrate components eg boring tools.
• the plug-in receptacles are designed so that the drilling tools protrude with the to be coated or treated surface sections from the plug-on measures.
• the support shaft 24 is stabilized.
• the plug-in receptacles and thus also the substrate components when turning the turntable 26 perform a same or counter-rotating rotation about the also vertical axis of the plug-receptacle.
• FIG 4 is schematically indicated on the basis of a slightly different from the representation of Figures 1 to 3 kinematics, as the rotational movement of the mounting table 10 and the drive shafts 22 can be transmitted.
• a drive gear 32 which is in mesh with the internal teeth of a first ring gear 34.
• the ring gear 34 is rotatably connected to an axially offset, larger diameter second ring gear 36 which can be driven via its internal teeth by means of a first drive pinion 38.
• the drive gear 32 supporting shaft 22 extends rotatably supported by the mounting table 10 therethrough and is rotatably mounted in a likewise below the mounting table 10 lying gear 40 which is driven via a second drive pinion 42.
• the gear 40 takes the drive shafts 22 and thus the mounting table 10 in the direction of rotation with. In this way, the mounting table 10 can be clocked.
• the drive gears 32 roll on the internal teeth of the first ring gear 34.
• the rotational speed of the first ring gear 34 can be kept as large as the rotational speed of the gear 40, so that during the clock movement of the mounting table 10, a rotation of the drive shafts 22 is omitted.
• the assembly sites 18-1, 18-3, 18-5, and 18-7 are different from the assembly sites 18-2, 18-4, 18-6, and 18-8. They carry a cover plate 44 which has a holder 46 for a radially aligned shielding plate 48 above the covered drive shaft 22. Between the two adjacent shielding plates 48 of the assembly stations 18-1 and 18-7 or 18-3 and 18-5, a further, stationarily mounted Ablewandan extract 50 is provided, each of which is formed by a convex sheet 52 and a secahtenblech 54 and the shields the space between the adjacent radial shield plates 48 to the adjacent mounting locations.
• the shielding plates 48 and the shielding Wall arrangements 50 are designed as modules and, depending on the arrangement of the other treatment / coating components, they can be mounted at different locations in the interior of the coating chamber.
• the substrate carriers 2 can be modularly arranged and arranged such that the substrate components introduced into the system in a batch in the coating and treatment chamber have a different treatment (coating, Surface treatment) can be subjected.
• the substrate components such as e.g.
• a drive device with which the relative position between the substrate carriers 26 and the coating and / or treatment units 12 is variable with closed deposition or treatment chamber, there is the possibility of the coating system even if only a few substrate components be provided with a specific coating or subjected to a specific treatment to operate economically.
• the coating and / or treatment units 12 such as evaporator, cathodes, targets, magnetrons, filament cathode and etching anode and the shielding 48, 50 of modules in the deposition or treatment chamber according to a desired coating or treatment program for the Substrate components are assembled and, accordingly, the substrate carrier 26 are equipped with those substrate components to be subjected to the same treatment.
• the deposition or treatment chamber can be closed, after which the individual treatment or coating programs for the substrate components grouped together on the substrate carriers (26) can be run through in one batch.
• a multiple heating and cooling of the substrate components and substrate support can be omitted, which process time can be saved to a considerable extent and the utilization of the coating system can be greatly increased even for small batches.
• the process phases of pumping, heating and cooling are the same for all substrate carriers, the assembly table 10 or the carousel rotates about its axis.
• the carousel 10 stops and the substrate carriers 26 at positions 4 and 8 rotate about their own axis.
• the etching phase can begin (FIG. 5A).
• Positions 4 and 8 rotate about their own axis, and the right and left vaporizers with TiAl and Ti targets are ignited, and, if present, after burnout (if possible), a shutter not shown in detail is opened , Position 4 is - after building a suitable nitrogen atmosphere - coated with titanium nitride and position 8 with titanium aluminum nitride. Depending on the layer thickness achieved, the evaporators are switched off and / or the associated shutter is closed. The drive continues to clock in the position according to FIG. 5D.
• positions 2 and 6 can be coated with a nano-layer. If positions 2 and 6 reach the evaporator required for the next layer, the corresponding evaporator and / or the shutter, if present, will open. The respective situation can be separated. The position then rotates again about its own axis.
• Each position can be coated individually or simultaneously by different evaporators.
• Abschottmodule instead of the positionable at the assembly stations Abschottmodule also Abschott stylesen can be used, either radially or axially in inserted the interior of the treatment chamber, and or moved and / or erect.
• a kinematic reversal can take place in the region of the drive for the substrate carriers, so that the assembly table remains stationary and the treatment / coating units are driven.
• etching anode instead of the etching anode, it is also possible to use other functional units for the pretreatment of the substrate in the coating chamber, whereby the spatial arrangement of these functional units, for example due to the process, can vary within wide limits.
• the drive kinematics for providing the required relative movements between the substrate components and the coating or treatment units can be freely varied. The only thing that matters is that the drive is able to subject the mounting table, the substrate carrier and advantageously also the holder for the individual substrate components of a relative rotational movement with respect to the treatment units.
• Another possibility of operation is that the coating process is shortened by loading only selected substrate carriers and thus the system is charged only with a reduced amount and in the treatment only the sector is heated in which a treatment or coating is to be made ,
• the invention thus provides a device for surface treatment and / or coating of substrate components by deposition from the gas phase, in particular especially by physical vapor deposition after the PVD (Physical Vapor Deposition) - or the reactive PVD method.
• a plurality of substrate carriers and a plurality of coating and / or treatment units such as evaporator sources, cathodes, targets, magnetrons, filament cathode and etching anode are arranged.
• it can be equipped in such a modular manner that the substrate components introduced into the plant in a batch can be subjected to a different treatment (coating, surface treatment).
• the invention further provides a novel process for surface treatment and / or coating of substrate components, with which coating installations can be operated substantially more economically by the PVD (Physical Vapor Deposition) or the reactive PVD process. It is characterized by the following process steps: a) assembling coating and / or treatment units (evaporators, cathodes, targets, magnetrons, filament cathode and etching anode) as well as shielding elements of modules in the deposition or treatment chamber 0 corresponding to a desired coating or Treatment program for the substrate components; b) equipping the substrate carriers with those substrate components which are to be subjected to the same treatment; c) closing the deposition or treatment chamber; and d) passing through the individual treatment or coating programs for the substrate components combined in groups on the substrate carriers in one batch.
• PVD Physical Vapor Deposition
• reactive PVD reactive PVD

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• Chemical & Material Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Engineering & Computer Science (AREA)
• Materials Engineering (AREA)
• Mechanical Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• General Chemical & Material Sciences (AREA)
• Physical Vapour Deposition (AREA)

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Citations (6)

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• 2008
  • 2008-12-15 DE DE102008062332A patent/DE102008062332A1/de not_active Withdrawn
• 2009
  • 2009-12-04 KR KR1020117014943A patent/KR20110098764A/ko not_active Ceased
  • 2009-12-04 CN CN200980150003.0A patent/CN102245799B/zh not_active Expired - Fee Related
  • 2009-12-04 SG SG2011043791A patent/SG172178A1/en unknown
  • 2009-12-04 AU AU2009328788A patent/AU2009328788B2/en not_active Ceased
  • 2009-12-04 WO PCT/DE2009/001712 patent/WO2010069289A1/de not_active Ceased
  • 2009-12-04 CA CA2748893A patent/CA2748893A1/en not_active Abandoned
  • 2009-12-04 EP EP09807664.9A patent/EP2373828B1/de active Active
  • 2009-12-04 JP JP2011539893A patent/JP5700454B2/ja active Active
  • 2009-12-04 MX MX2011006238A patent/MX2011006238A/es active IP Right Grant
  • 2009-12-04 BR BRPI0923092-0A patent/BRPI0923092B1/pt not_active IP Right Cessation
  • 2009-12-04 EA EA201170814A patent/EA023891B1/ru not_active IP Right Cessation
• 2011
  • 2011-05-10 US US13/104,394 patent/US20110305833A1/en not_active Abandoned
• 2013
  • 2013-04-01 US US13/854,311 patent/US10711349B2/en active Active

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