BRPI0914048A2 - "sistema para conectar de maneira removível um primeiro membro a um segundo membro, lâmpada led para uso em um sistema e soquete para uso em um sistema" - Google Patents
"sistema para conectar de maneira removível um primeiro membro a um segundo membro, lâmpada led para uso em um sistema e soquete para uso em um sistema"Info
- Publication number
- BRPI0914048A2 BRPI0914048A2 BRPI0914048A BRPI0914048A BRPI0914048A2 BR PI0914048 A2 BRPI0914048 A2 BR PI0914048A2 BR PI0914048 A BRPI0914048 A BR PI0914048A BR PI0914048 A BRPI0914048 A BR PI0914048A BR PI0914048 A2 BRPI0914048 A2 BR PI0914048A2
- Authority
- BR
- Brazil
- Prior art keywords
- socket
- led lamp
- removably connecting
- removably
- lamp
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V14/00—Controlling the distribution of the light emitted by adjustment of elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/04—Fastening of light sources or lamp holders with provision for changing light source, e.g. turret
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08166569 | 2008-10-14 | ||
EP08166569-7 | 2008-10-14 | ||
PCT/IB2009/054387 WO2010044011A1 (en) | 2008-10-14 | 2009-10-07 | A system for heat conduction between two connectable members |
Publications (2)
Publication Number | Publication Date |
---|---|
BRPI0914048A2 true BRPI0914048A2 (pt) | 2015-11-03 |
BRPI0914048B1 BRPI0914048B1 (pt) | 2019-04-09 |
Family
ID=41510471
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0914048-4A BRPI0914048B1 (pt) | 2008-10-14 | 2009-10-07 | Sistema para conectar de maneira removível um primeiro membro a um segundo membro, lâmpada led para uso em um sistema e soquete para uso em um sistema |
Country Status (9)
Country | Link |
---|---|
US (1) | US8536768B2 (pt) |
EP (1) | EP2337997B1 (pt) |
JP (1) | JP5411938B2 (pt) |
KR (1) | KR101633615B1 (pt) |
CN (1) | CN102187149B (pt) |
BR (1) | BRPI0914048B1 (pt) |
RU (1) | RU2524400C2 (pt) |
TW (1) | TW201027025A (pt) |
WO (1) | WO2010044011A1 (pt) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MX2012012462A (es) | 2010-04-26 | 2012-11-30 | Xicato Inc | Acoplamiento del modulo de iluminacion a base de diodos emisores de luz para una instalacion de luz. |
DE102010031312A1 (de) * | 2010-07-14 | 2012-01-19 | Osram Ag | Befestigungselement, Leuchtmodul und Leuchtvorrichtung |
US8960989B2 (en) * | 2010-08-09 | 2015-02-24 | Cree, Inc. | Lighting devices with removable light engine components, lighting device elements and methods |
ITVI20100298A1 (it) * | 2010-11-09 | 2012-05-10 | Cbf Engineering S R L | Dissipatore di calore |
US9423119B2 (en) | 2011-09-26 | 2016-08-23 | Ideal Industries, Inc. | Device for securing a source of LED light to a heat sink surface |
WO2015138124A1 (en) * | 2011-09-26 | 2015-09-17 | Ideal Industries, Inc. | Device for securing a source of led light to a heat sink surface |
US9249955B2 (en) * | 2011-09-26 | 2016-02-02 | Ideal Industries, Inc. | Device for securing a source of LED light to a heat sink surface |
US9429309B2 (en) | 2011-09-26 | 2016-08-30 | Ideal Industries, Inc. | Device for securing a source of LED light to a heat sink surface |
US8858045B2 (en) | 2011-12-05 | 2014-10-14 | Xicato, Inc. | Reflector attachment to an LED-based illumination module |
EP3278018B1 (en) | 2015-03-31 | 2021-09-22 | Lumileds LLC | Led lighting module with heat sink and a method of replacing an led module |
US10253956B2 (en) | 2015-08-26 | 2019-04-09 | Abl Ip Holding Llc | LED luminaire with mounting structure for LED circuit board |
US10859325B2 (en) * | 2016-06-27 | 2020-12-08 | Neo Corporation | Heat exchanger |
RU173002U1 (ru) * | 2016-11-10 | 2017-08-04 | Олег Николаевич Баранов | Модульный уличный светодиодный светильник |
US10190755B2 (en) * | 2016-11-15 | 2019-01-29 | Abl Ip Holding Llc | LED board retention |
RU2639055C1 (ru) * | 2017-04-19 | 2017-12-19 | Владимир Александрович Степанов | Устройство монтажа встроенного светильника |
JP2019053941A (ja) * | 2017-09-19 | 2019-04-04 | 株式会社小糸製作所 | 灯具ユニット及び車両用灯具 |
US10251279B1 (en) | 2018-01-04 | 2019-04-02 | Abl Ip Holding Llc | Printed circuit board mounting with tabs |
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BE558969A (pt) * | 1956-07-04 | |||
US3075030A (en) | 1959-12-22 | 1963-01-22 | Minnesota Mining & Mfg | Thermoelectric generator |
DE1151324B (de) * | 1960-04-11 | 1963-07-11 | Elektronik M B H | Verfahren zur Herstellung von Halbleiteranordnungen |
US4478588A (en) | 1978-03-06 | 1984-10-23 | Amp Incorporated | Light emitting diode assembly |
US4363087A (en) | 1981-01-22 | 1982-12-07 | Illinois Tool Works Inc. | Mounting post for holding a lighted electrical pushbutton switch |
DE8130102U1 (de) * | 1981-10-15 | 1982-03-25 | Hotset Heizpatronen und Zubehör GmbH, 5880 Lüdenscheid | Widerstands-heizelement zur anordnung einer bohrung eines zu beheizenden werkstueckes |
US4419722A (en) | 1982-05-07 | 1983-12-06 | Bury George J | Light emitting diode holder |
US4507718A (en) | 1984-03-16 | 1985-03-26 | Illinois Tool Works Inc. | LED Holder |
SU1302357A1 (ru) * | 1985-04-19 | 1987-04-07 | Львовский политехнический институт им.Ленинского комсомола | Патрон дл ламп накаливани с резьбовым цоколем |
US4727648A (en) | 1985-04-22 | 1988-03-01 | Savage John Jun | Circuit component mount and assembly |
US4897769A (en) | 1988-05-18 | 1990-01-30 | Xerox Corporation | Right angle light emitting diode assembly with snap-in feature |
US5121311A (en) | 1991-01-09 | 1992-06-09 | R & D Molded Products, Inc. | Hinged LED holder |
WO1994007040A1 (de) * | 1992-09-18 | 1994-03-31 | Kuehl Hans | Vorrichtung zum verbinden von wenigstens zwei elementen |
US5594433A (en) | 1995-08-09 | 1997-01-14 | Terlep; Stephen K. | Omni-directional LED lamps |
JPH09172241A (ja) | 1995-12-20 | 1997-06-30 | Uniden Corp | 部品ホルダー |
US5669703A (en) | 1995-12-28 | 1997-09-23 | Square D Company | Push-in bulb base for bayonet-type bulb sockets |
JP3018016B2 (ja) | 1996-10-01 | 2000-03-13 | エイテックス株式会社 | 表示装置の製造方法 |
EP1092099B1 (de) * | 1998-06-26 | 2002-05-15 | Siemens Aktiengesellschaft | Gewinde sowie schraubverbindung für eine hohe anwendungstemperatur |
JP2000114413A (ja) | 1998-09-29 | 2000-04-21 | Sony Corp | 半導体装置、その製造方法および部品の実装方法 |
JP2001044506A (ja) * | 1999-07-26 | 2001-02-16 | Ichikoh Ind Ltd | 発光ダイオードの固定構造 |
US6582100B1 (en) * | 2000-08-09 | 2003-06-24 | Relume Corporation | LED mounting system |
US6338647B1 (en) | 2000-12-21 | 2002-01-15 | Robert Fernandez | LED vehicular lights and connectors therefor |
US6682211B2 (en) | 2001-09-28 | 2004-01-27 | Osram Sylvania Inc. | Replaceable LED lamp capsule |
EP1348902A1 (en) * | 2002-03-26 | 2003-10-01 | Koninklijke Philips Electronics N.V. | Lamp and lamp holder with peripheral locking means |
US6729020B2 (en) | 2002-04-01 | 2004-05-04 | International Truck Intellectual Property Company, Llc | Method for replacing a board-mounted electric circuit component |
US6764347B1 (en) | 2003-01-06 | 2004-07-20 | Paul J. Plishner | Plug and socket holder for replaceably holding diode-based light sources and other radiation sources and receivers |
US6903380B2 (en) * | 2003-04-11 | 2005-06-07 | Weldon Technologies, Inc. | High power light emitting diode |
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DE102006002443A1 (de) * | 2005-01-18 | 2006-07-20 | Volkswagen Ag | Drehelement, Herstellungsverfahren dafür sowie Aggregat damit |
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CN201016463Y (zh) * | 2007-01-10 | 2008-02-06 | 诸建平 | 一种大功率led组合杯灯 |
DE102007014789B3 (de) * | 2007-03-28 | 2008-11-06 | Ixys Ch Gmbh | Anordnung mindestens eines Leistungshalbleitermoduls und einer Leiterplatte und Leistungshalbleitermodul |
JP3138403U (ja) * | 2007-10-19 | 2007-12-27 | 麗鴻科技股▲ふん▼有限公司 | Ledの構造及びその結合装置 |
US7625104B2 (en) * | 2007-12-13 | 2009-12-01 | Philips Lumileds Lighting Company, Llc | Light emitting diode for mounting to a heat sink |
RU75002U1 (ru) * | 2008-04-02 | 2008-07-20 | Трансрегиональное потребительское общество "ЕвроАзиатская сервисная корпорация" | Светодиодный источник света |
-
2009
- 2009-10-07 RU RU2011119452/07A patent/RU2524400C2/ru not_active IP Right Cessation
- 2009-10-07 CN CN200980140812.3A patent/CN102187149B/zh not_active Expired - Fee Related
- 2009-10-07 US US13/123,724 patent/US8536768B2/en not_active Expired - Fee Related
- 2009-10-07 KR KR1020117010970A patent/KR101633615B1/ko active IP Right Grant
- 2009-10-07 WO PCT/IB2009/054387 patent/WO2010044011A1/en active Application Filing
- 2009-10-07 JP JP2011530613A patent/JP5411938B2/ja not_active Expired - Fee Related
- 2009-10-07 BR BRPI0914048-4A patent/BRPI0914048B1/pt not_active IP Right Cessation
- 2009-10-07 EP EP09787372.3A patent/EP2337997B1/en not_active Not-in-force
- 2009-10-12 TW TW098134542A patent/TW201027025A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US20110187258A1 (en) | 2011-08-04 |
TW201027025A (en) | 2010-07-16 |
CN102187149B (zh) | 2014-11-05 |
RU2524400C2 (ru) | 2014-07-27 |
JP2012505508A (ja) | 2012-03-01 |
WO2010044011A1 (en) | 2010-04-22 |
BRPI0914048B1 (pt) | 2019-04-09 |
US8536768B2 (en) | 2013-09-17 |
EP2337997A1 (en) | 2011-06-29 |
EP2337997B1 (en) | 2013-12-11 |
JP5411938B2 (ja) | 2014-02-12 |
KR101633615B1 (ko) | 2016-06-27 |
RU2011119452A (ru) | 2012-11-27 |
KR20110080164A (ko) | 2011-07-12 |
CN102187149A (zh) | 2011-09-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B25D | Requested change of name of applicant approved |
Owner name: KONINKLIJKE PHILIPS N.V. (NL) |
|
B25G | Requested change of headquarter approved |
Owner name: KONINKLIJKE PHILIPS N.V. (NL) |
|
B25A | Requested transfer of rights approved |
Owner name: PHILIPS LIGHTING HOLDING B.V. (NL) |
|
B15K | Others concerning applications: alteration of classification |
Ipc: H01L 23/373 (2006.01), F21K 9/00 (2016.01), F21V 1 |
|
B15K | Others concerning applications: alteration of classification |
Ipc: F21V 29/00 (2015.01), F21V 19/00 (2006.01), F21V 2 |
|
B06T | Formal requirements before examination [chapter 6.20 patent gazette] | ||
B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 07/10/2009, OBSERVADAS AS CONDICOES LEGAIS. (CO) 20 (VINTE) ANOS CONTADOS A PARTIR DE 07/10/2009, OBSERVADAS AS CONDICOES LEGAIS |
|
B21F | Lapse acc. art. 78, item iv - on non-payment of the annual fees in time |
Free format text: REFERENTE A 12A ANUIDADE. |
|
B24J | Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12) |
Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2640 DE 10-08-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |