BRPI0907493B8 - Processo de fabricação de um elemento aquecedor por depósito de camadas finas sobre um substrato isolante e o elemento obtido - Google Patents

Processo de fabricação de um elemento aquecedor por depósito de camadas finas sobre um substrato isolante e o elemento obtido

Info

Publication number
BRPI0907493B8
BRPI0907493B8 BRPI0907493A BRPI0907493A BRPI0907493B8 BR PI0907493 B8 BRPI0907493 B8 BR PI0907493B8 BR PI0907493 A BRPI0907493 A BR PI0907493A BR PI0907493 A BRPI0907493 A BR PI0907493A BR PI0907493 B8 BRPI0907493 B8 BR PI0907493B8
Authority
BR
Brazil
Prior art keywords
deposition
manufacturing process
insulating substrate
heating element
fine layers
Prior art date
Application number
BRPI0907493A
Other languages
English (en)
Inventor
Terme Benoît
Maurin-Perrier Philippe
Heau Christophe
Original Assignee
Hydromecanique & Frottement
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hydromecanique & Frottement filed Critical Hydromecanique & Frottement
Publication of BRPI0907493A2 publication Critical patent/BRPI0907493A2/pt
Publication of BRPI0907493A8 publication Critical patent/BRPI0907493A8/pt
Publication of BRPI0907493B1 publication Critical patent/BRPI0907493B1/pt
Publication of BRPI0907493B8 publication Critical patent/BRPI0907493B8/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/006—Thin film resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Resistance Heating (AREA)
  • Surface Heating Bodies (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

PROCESSO DE FABRICAÇÃO DE UM ELEMENTO AQUECEDOR POR DEPÓSITO DE CAMADAS FINAS SOBRE UM SUBSTRATO ISOLANTE E O ELEMENTO OBTIDO. Segundo o processo, modifica-se o estado da superficie do substrato (1) para se obter pelo menos uma zona lisa ( 1a) - (1b) de pouca rugosidade Ra e pelo menos uma zona ( 1c) de rugosidade mais elevada Rax; aplica-se sobre as diferentes zonas (1a) , (1b), (1c), um material (2) muito condutor da eletricidade: ou liga-se a(s) zona (a) lisa (s) (2a) e (2b) do material (2) a uma fonte de alimentação elétrica (3).
BRPI0907493A 2008-02-06 2009-01-26 Processo de fabricação de um elemento aquecedor por depósito de camadas finas sobre um substrato isolante e o elemento obtido BRPI0907493B8 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0850747A FR2927218B1 (fr) 2008-02-06 2008-02-06 Procede de fabrication d'un element chauffant par depot de couches minces sur un substrat isolant et l'element obtenu
PCT/FR2009/050111 WO2009098421A1 (fr) 2008-02-06 2009-01-26 Procede de fabrication d'un element chauffant par depot de couches minces sur un substrat isolant et l'element obtenu

Publications (4)

Publication Number Publication Date
BRPI0907493A2 BRPI0907493A2 (pt) 2015-07-14
BRPI0907493A8 BRPI0907493A8 (pt) 2018-09-18
BRPI0907493B1 BRPI0907493B1 (pt) 2018-10-16
BRPI0907493B8 true BRPI0907493B8 (pt) 2023-01-10

Family

ID=39745133

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0907493A BRPI0907493B8 (pt) 2008-02-06 2009-01-26 Processo de fabricação de um elemento aquecedor por depósito de camadas finas sobre um substrato isolante e o elemento obtido

Country Status (14)

Country Link
US (1) US8395091B2 (pt)
EP (1) EP2240318B1 (pt)
JP (1) JP5449197B2 (pt)
KR (1) KR101496496B1 (pt)
CN (1) CN101939164B (pt)
AT (1) ATE515390T1 (pt)
BR (1) BRPI0907493B8 (pt)
CA (1) CA2712381C (pt)
ES (1) ES2367840T3 (pt)
FR (1) FR2927218B1 (pt)
MX (1) MX2010008519A (pt)
MY (1) MY161997A (pt)
TW (1) TWI500800B (pt)
WO (1) WO2009098421A1 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2914488B1 (fr) * 2007-03-30 2010-08-27 Soitec Silicon On Insulator Substrat chauffage dope
MX2010007138A (es) * 2007-12-29 2010-08-11 Saint Gobain Ceramics Elementos ceramicos de calentamiento con estructura abierta y metodos para la fabricacion de los mismos.
FR2927218B1 (fr) * 2008-02-06 2010-03-05 Hydromecanique & Frottement Procede de fabrication d'un element chauffant par depot de couches minces sur un substrat isolant et l'element obtenu
EP2955976A1 (fr) * 2014-06-12 2015-12-16 AGC Glass Europe Vitrage chauffant
EP2977202A1 (fr) * 2014-07-25 2016-01-27 AGC Glass Europe Vitrage chauffant
DE102015119763A1 (de) * 2015-11-16 2017-05-18 Heraeus Quarzglas Gmbh & Co. Kg Infrarotstrahler
JP7523555B2 (ja) * 2020-02-12 2024-07-26 サン－ゴバン グラス フランス 統合された温度センサを有する乗り物ペイン

Family Cites Families (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2111742A (en) * 1933-09-09 1938-03-22 Rca Corp Resistance compound
GB499816A (en) * 1937-07-26 1939-01-26 Allen West & Co Ltd Improvements in or relating to electric circuit interrupters
US2419537A (en) * 1944-09-09 1947-04-29 Bell Telephone Labor Inc Resistor
US2624823A (en) * 1949-06-23 1953-01-06 Pittsburgh Plate Glass Co Electroconductive article
US3095340A (en) * 1961-08-21 1963-06-25 David P Triller Precision resistor making by resistance value control for etching
US3458847A (en) * 1967-09-21 1969-07-29 Fairchild Camera Instr Co Thin-film resistors
US3594225A (en) * 1967-09-21 1971-07-20 Fairchild Camera Instr Co Thin-film resistors
US3772075A (en) * 1969-07-01 1973-11-13 Ppg Industries Inc Applying electroconductive heating circuits to glass
JPS5543751A (en) * 1978-09-21 1980-03-27 Tokyo Shibaura Electric Co Plane heating element
US4498071A (en) * 1982-09-30 1985-02-05 Dale Electronics, Inc. High resistance film resistor
US4725710A (en) * 1985-11-07 1988-02-16 Ford Motor Company Electrically heatable vision unit
US4911353A (en) * 1986-03-31 1990-03-27 David Deakin Solar collector having absorber plate formed by spraying molten metal
US5332888A (en) * 1986-08-20 1994-07-26 Libbey-Owens-Ford Co. Sputtered multi-layer color compatible solar control coating
DE3937346A1 (de) * 1989-11-09 1991-05-16 Ver Glaswerke Gmbh Elektrisch beheizbare autoglasscheibe aus verbundglas
JPH03292791A (ja) * 1990-04-11 1991-12-24 Toshiba Corp 配線基板
JPH07226301A (ja) 1994-02-10 1995-08-22 Tama Electric Co Ltd 抵抗器
JPH07280462A (ja) * 1994-04-11 1995-10-27 Shin Etsu Chem Co Ltd 均熱セラミックスヒーター
JPH08124707A (ja) 1994-10-24 1996-05-17 Tama Electric Co Ltd 薄膜チップ抵抗器
JPH10261478A (ja) * 1997-03-18 1998-09-29 Sun Tec Corp Kk 導電性加熱板
AU7291398A (en) * 1997-05-06 1998-11-27 Thermoceramix, L.L.C. Deposited resistive coatings
US6262401B1 (en) * 1998-12-30 2001-07-17 Aos Holding Company Gold-plated water heater element and method of making same
EP1187511A1 (en) * 1999-05-07 2002-03-13 Ibiden Co., Ltd. Hot plate and method of producing the same
US6222166B1 (en) * 1999-08-09 2001-04-24 Watlow Electric Manufacturing Co. Aluminum substrate thick film heater
US6835916B2 (en) * 1999-08-09 2004-12-28 Ibiden, Co., Ltd Ceramic heater
JP2001118664A (ja) * 1999-08-09 2001-04-27 Ibiden Co Ltd セラミックヒータ
EP1137321A1 (en) * 1999-11-30 2001-09-26 Ibiden Co., Ltd. Ceramic heater
US7081602B1 (en) * 2000-02-01 2006-07-25 Trebor International, Inc. Fail-safe, resistive-film, immersion heater
US6433319B1 (en) * 2000-12-15 2002-08-13 Brian A. Bullock Electrical, thin film termination
US6580061B2 (en) * 2000-02-01 2003-06-17 Trebor International Inc Durable, non-reactive, resistive-film heater
US6204480B1 (en) 2000-02-01 2001-03-20 Southwall Technologies, Inc. Vacuum deposition of bus bars onto conductive transparent films
US6663914B2 (en) * 2000-02-01 2003-12-16 Trebor International Method for adhering a resistive coating to a substrate
US6674053B2 (en) * 2001-06-14 2004-01-06 Trebor International Electrical, thin film termination
WO2001080601A1 (fr) * 2000-04-14 2001-10-25 Ibiden Co., Ltd. Dispositif de chauffage en ceramique
WO2002019400A1 (fr) * 2000-08-30 2002-03-07 Ibiden Co., Ltd. Dispositif ceramique chauffant permettant la production de semi-conducteurs et equipement d'inspection
JPWO2002043441A1 (ja) * 2000-11-24 2004-04-02 イビデン株式会社 セラミックヒータ、および、セラミックヒータの製造方法
JP2002299013A (ja) * 2001-01-29 2002-10-11 Murata Mfg Co Ltd 電極膜付き摺動物品、電極膜付き窓ガラスおよび導電性ペースト
JP2003057984A (ja) * 2001-08-09 2003-02-28 Minolta Co Ltd 加熱定着ローラ
US6870134B2 (en) 2002-02-01 2005-03-22 Centre Luxembourgeois De Recherches Pour Le Verre Et La Ceramique S.A. (C.R.V.C.) Heatable vehicle windshield with bus bars including braided and printed portions
JP2003272545A (ja) * 2002-03-18 2003-09-26 Canon Inc スペーサおよびこれを用いた画像形成装置
US6825681B2 (en) * 2002-07-19 2004-11-30 Delta Design, Inc. Thermal control of a DUT using a thermal control substrate
US6855647B2 (en) * 2003-04-02 2005-02-15 Hewlett-Packard Development Company, L.P. Custom electrodes for molecular memory and logic devices
BRPI0510332A (pt) 2004-04-29 2007-10-23 Siemens Ag processo para a produção de contatos transversais em estruturas de placas de circuitos impressos
US8071916B2 (en) * 2004-06-28 2011-12-06 Kyocera Corporation Wafer heating apparatus and semiconductor manufacturing apparatus
US20060163563A1 (en) * 2005-01-24 2006-07-27 Kurt Ulmer Method to form a thin film resistor
US20060250078A1 (en) * 2005-05-09 2006-11-09 City University Of Hong Kong Organic electroluminescent devices incorporating UV-illuminated fluorocarbon layers
US20070220754A1 (en) * 2006-03-01 2007-09-27 Jennifer Barbaro Counter apparatus and method for consumables
JP2007273182A (ja) * 2006-03-30 2007-10-18 Sony Corp 集電体、負極及び電池
FR2907470B1 (fr) * 2006-10-20 2009-04-17 Hef Soc Par Actions Simplifiee Piece en contact glissant, en regime lubrifie, revetue d'une couche mince.
FR2913429B1 (fr) * 2007-03-05 2009-04-17 H E F Soc Par Actions Simplifi Procede d'assemblage d'au moins deux plaques et utilisation du procede pour la realisation d'un ensemble de pulverisation ionique.
FR2927218B1 (fr) * 2008-02-06 2010-03-05 Hydromecanique & Frottement Procede de fabrication d'un element chauffant par depot de couches minces sur un substrat isolant et l'element obtenu

Also Published As

Publication number Publication date
CN101939164A (zh) 2011-01-05
ATE515390T1 (de) 2011-07-15
CA2712381C (fr) 2015-12-15
EP2240318A1 (fr) 2010-10-20
MY161997A (en) 2017-05-31
AU2009211229A1 (en) 2009-08-13
WO2009098421A1 (fr) 2009-08-13
US8395091B2 (en) 2013-03-12
KR20100111279A (ko) 2010-10-14
CA2712381A1 (fr) 2009-08-13
CN101939164B (zh) 2013-09-11
FR2927218A1 (fr) 2009-08-07
BRPI0907493A8 (pt) 2018-09-18
JP2011512008A (ja) 2011-04-14
US20100308030A1 (en) 2010-12-09
BRPI0907493A2 (pt) 2015-07-14
MX2010008519A (es) 2011-05-25
ES2367840T3 (es) 2011-11-10
TWI500800B (zh) 2015-09-21
EP2240318B1 (fr) 2011-07-06
FR2927218B1 (fr) 2010-03-05
KR101496496B1 (ko) 2015-02-26
BRPI0907493B1 (pt) 2018-10-16
JP5449197B2 (ja) 2014-03-19
TW200936796A (en) 2009-09-01

Similar Documents

Publication Publication Date Title
BRPI0907493B8 (pt) Processo de fabricação de um elemento aquecedor por depósito de camadas finas sobre um substrato isolante e o elemento obtido
ATE439683T1 (de) Schaltungsanordnung mit verbindungseinrichtung sowie herstellungsverfahren hierzu
AR069169A1 (es) Metodo para fabricar un recubrimiento transparente de un oxido conductor para aplicaciones fotovoltaicas en peliculas finas
WO2012027616A3 (en) Solid state light sheet or strip for general illumination
TW201130057A (en) Semiconductor device and manufacturing method thereof
JP2012084865A5 (ja) 半導体装置の作製方法
RU2009138474A (ru) Сенсорная панель и способ ее производства
BRPI0918013A2 (pt) cobertura superficial condutora sem substrato e seu processo de fabricação
MY166609A (en) Connector assembly and method of manufacture
WO2012091410A3 (ko) 금속박막을 이용한 터치패널 및 그 제조방법
SG135106A1 (en) Method and process for embedding electrically conductive elements in a dielectric layer
JP2015513691A5 (pt)
WO2008139934A1 (ja) 多層基板およびその製造方法
TW200944072A (en) Method for manufacturing a substrate having embedded component therein
WO2013156162A3 (de) Elektrische heizvorrichtung, bauelement sowie verfahren zu deren herstellung
JP2010021534A5 (pt)
JP2008172266A5 (pt)
BRPI0412258A (pt) elemento de segurança para identificação por rf
WO2013068169A3 (de) Träger für eine elektrische schaltung mit einem integrierten energiespeicher
JP2008103653A5 (pt)
WO2011157883A8 (en) Method for manufacturing an autocompensating antenna structure by etching
GB2466163A (en) Semiconductor structure comprising an electrically conductive feature and method of forming a semiconductor structure
TW200730041A (en) Circuit board with embeded passive component and fabricating process thereof
JP2010097599A5 (pt)
WO2008136316A1 (ja) 積層基板構造体及びその製造方法

Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 26/01/2009, OBSERVADAS AS CONDICOES LEGAIS.

B25D Requested change of name of applicant approved

Owner name: HYDROMECANIQUE ET FROTTEMENT (FR)

B25G Requested change of headquarter approved

Owner name: HYDROMECANIQUE ET FROTTEMENT (FR)