BRPI0807753A2 - Revestimentos de barreira à umidade para dispositivos de diodo orgânico emissor de luz - Google Patents

Revestimentos de barreira à umidade para dispositivos de diodo orgânico emissor de luz

Info

Publication number
BRPI0807753A2
BRPI0807753A2 BRPI0807753-3A2A BRPI0807753A BRPI0807753A2 BR PI0807753 A2 BRPI0807753 A2 BR PI0807753A2 BR PI0807753 A BRPI0807753 A BR PI0807753A BR PI0807753 A2 BRPI0807753 A2 BR PI0807753A2
Authority
BR
Brazil
Prior art keywords
moisture barrier
barrier coatings
organic devices
led organic
led
Prior art date
Application number
BRPI0807753-3A2A
Other languages
English (en)
Portuguese (pt)
Inventor
Moses M David
Fred B Mccormick
Mark A Roehrig
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of BRPI0807753A2 publication Critical patent/BRPI0807753A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Chemical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
BRPI0807753-3A2A 2007-02-21 2008-02-07 Revestimentos de barreira à umidade para dispositivos de diodo orgânico emissor de luz BRPI0807753A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/677,327 US8241713B2 (en) 2007-02-21 2007-02-21 Moisture barrier coatings for organic light emitting diode devices
PCT/US2008/053265 WO2008103558A1 (en) 2007-02-21 2008-02-07 Moisture barrier coatings for organic light emitting diode devices

Publications (1)

Publication Number Publication Date
BRPI0807753A2 true BRPI0807753A2 (pt) 2014-06-17

Family

ID=39493283

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0807753-3A2A BRPI0807753A2 (pt) 2007-02-21 2008-02-07 Revestimentos de barreira à umidade para dispositivos de diodo orgânico emissor de luz

Country Status (7)

Country Link
US (2) US8241713B2 (cg-RX-API-DMAC7.html)
EP (1) EP2115798B1 (cg-RX-API-DMAC7.html)
JP (1) JP5431967B2 (cg-RX-API-DMAC7.html)
KR (1) KR101481191B1 (cg-RX-API-DMAC7.html)
CN (2) CN104332564B (cg-RX-API-DMAC7.html)
BR (1) BRPI0807753A2 (cg-RX-API-DMAC7.html)
WO (1) WO2008103558A1 (cg-RX-API-DMAC7.html)

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CN104327758A (zh) * 2007-12-28 2015-02-04 3M创新有限公司 柔性封装膜系统
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Also Published As

Publication number Publication date
KR20090113323A (ko) 2009-10-29
EP2115798A1 (en) 2009-11-11
JP5431967B2 (ja) 2014-03-05
CN104332564B (zh) 2017-12-01
CN104332564A (zh) 2015-02-04
US8241713B2 (en) 2012-08-14
KR101481191B1 (ko) 2015-01-09
JP2010519705A (ja) 2010-06-03
US20120273976A1 (en) 2012-11-01
US20080196664A1 (en) 2008-08-21
EP2115798B1 (en) 2016-05-18
CN101632184A (zh) 2010-01-20
WO2008103558A1 (en) 2008-08-28

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B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements