BRPI0519233A2 - precursor curÁvel de uma composiÇço de epàxi retardadora de chama com densidade baixa e essencialmente livre de halogÊnio, composiÇço de epàxi retardadora de chama com densidade baixa e essencialmente livre de halogÊnio, e, uso de um precursor - Google Patents

precursor curÁvel de uma composiÇço de epàxi retardadora de chama com densidade baixa e essencialmente livre de halogÊnio, composiÇço de epàxi retardadora de chama com densidade baixa e essencialmente livre de halogÊnio, e, uso de um precursor

Info

Publication number
BRPI0519233A2
BRPI0519233A2 BRPI0519233-1A BRPI0519233A BRPI0519233A2 BR PI0519233 A2 BRPI0519233 A2 BR PI0519233A2 BR PI0519233 A BRPI0519233 A BR PI0519233A BR PI0519233 A2 BRPI0519233 A2 BR PI0519233A2
Authority
BR
Brazil
Prior art keywords
density
precursor
epoxy composition
flame retardant
free low
Prior art date
Application number
BRPI0519233-1A
Other languages
English (en)
Inventor
Sohaib Elgimiabi
Alain Lamon
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of BRPI0519233A2 publication Critical patent/BRPI0519233A2/pt
Publication of BRPI0519233B1 publication Critical patent/BRPI0519233B1/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00—Fireproofing materials
    • C09K21/02—Inorganic materials
    • C09K21/04—Inorganic materials containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/32—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00—Fireproofing materials
    • C09K21/02—Inorganic materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PRECURSOR CURÁVEL DE UMA COMPOSIÇçO DE EPàXI RETARDADORA DE CHAMA COM DENSIDADE BAIXA E ESSENCIALMENTE LIVRE DE HALOGÊNIO, COMPOSIÇçO DE EPàXI RETARDADORA DE CHAMA COM DENSIDADE BAIXA E ESSENCIALMENTE LIVRE DE HALOGÊNIO, E, USO DE UM PRECURSOR. A presente invenção diz respeito a um precursor curável de uma composição de epóxi retardadora de chama com densidade baixa e essencialmente livre de halogênio que compreende (i) de 10 a 70 porcento em peso de pelo menos um composto de epóxido orgânico com uma funcionalidade de epóxido de pelo menos um, (ii) de 1 a 55 porcento em peso de pelo menos um endurecedor, (iii) de 5 a 50 porcento em peso de um sistema retardador de chama essencialmente livre de halogênio que inclui uma mistura de: (1) pelo menos um composto selecionado do grupo compreendendo hidróxidos de metal alcalino terroso e hidróxidos do grupo de alumínio, e (2) pelo menos um material contendo fósforo, (iv) de 10 a 60 porcento em peso de um sistema de cargas capaz de reduzir a densidade do precursor que inclui uma mistura de (1) pelo menos uma carga inorgânica de densidade baixa tendo uma densidade entre 0,1 a 0,5 g cm^ -3^, (2) pelo menos uma carga orgânica de densidade baixa tendo uma densidade entre 0,01 a 0,30 g/cm^ -3^ e sendo compressível.
BRPI0519233A 2004-12-23 2005-12-23 precursor curável de uma composição de epóxi retardadora de chama com densidade baixa e essencialmente livre de halogênio, composição de epóxi retardadora de chama com densidade baixa e essencialmente livre de halogênio, e, uso de um precursor BRPI0519233B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP04030580A EP1674518A1 (en) 2004-12-23 2004-12-23 Fire-retardant low-density epoxy composition
PCT/US2005/046940 WO2006071820A1 (en) 2004-12-23 2005-12-23 Fire-retardant low-density epoxy composition

Publications (2)

Publication Number Publication Date
BRPI0519233A2 true BRPI0519233A2 (pt) 2009-01-06
BRPI0519233B1 BRPI0519233B1 (pt) 2016-06-07

Family

ID=34927947

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0519233A BRPI0519233B1 (pt) 2004-12-23 2005-12-23 precursor curável de uma composição de epóxi retardadora de chama com densidade baixa e essencialmente livre de halogênio, composição de epóxi retardadora de chama com densidade baixa e essencialmente livre de halogênio, e, uso de um precursor

Country Status (11)

Country Link
US (1) US8188165B2 (pt)
EP (2) EP1674518A1 (pt)
JP (1) JP5384830B2 (pt)
KR (1) KR20070090032A (pt)
CN (1) CN101124275B (pt)
AT (1) ATE390459T1 (pt)
BR (1) BRPI0519233B1 (pt)
CA (1) CA2592305C (pt)
DE (1) DE602005005722T2 (pt)
ES (1) ES2302256T3 (pt)
WO (1) WO2006071820A1 (pt)

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WO2008059856A1 (en) 2006-11-15 2008-05-22 Hitachi Chemical Co., Ltd. Heat curable resin composition for light reflection, process for producing the resin composition, and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition
GB0905362D0 (en) 2009-03-30 2009-05-13 3M Innovative Properties Co Fire resistant epoxy resin based core filler material developing low exothermic heat
CN102181128B (zh) * 2011-03-30 2012-10-24 吴江固德电材系统股份有限公司 环氧树脂预混料及其配制工艺
US9169426B2 (en) * 2012-09-25 2015-10-27 United States Gypsum Company Joint compound, wall assembly, and methods and products related thereto
EP2818490B1 (en) 2013-06-28 2019-04-10 3M Innovative Properties Company Use of an epoxy resin-based composition as a filler honeycomb cells
RU2540648C1 (ru) * 2013-07-30 2015-02-10 Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Волгоградский государственный технический университет" (ВолгГТУ) Огнестойкая композиция
AR098696A1 (es) * 2013-12-10 2016-06-08 General Cable Tech Corp Composiciones térmicamente conductivas y cables de estas
TWI504734B (zh) * 2013-12-31 2015-10-21 Ind Tech Res Inst 防火耐燃複合材料、板材與塗層
KR20160018895A (ko) * 2014-08-07 2016-02-18 (주)이레화학상사 자동차용 접착제 조성물 및 그 제조방법
BR112017002766A2 (pt) 2014-08-12 2017-12-19 3M Innovative Properties Co adesivo para filme
WO2016044013A1 (en) 2014-09-16 2016-03-24 Henkel IP & Holding GmbH Use of hollow polymeric microspheres in composite materials requiring flame resistance
TWI591109B (zh) * 2015-06-11 2017-07-11 Mitsubishi Rayon Co Epoxy resin composition, molded article, prepreg, fiber reinforced Composites and structures
EP3239207B1 (en) 2016-04-27 2021-07-28 3M Innovative Properties Company Curable epoxy compositions
KR101708252B1 (ko) * 2016-05-13 2017-02-21 한국신발피혁연구원 난연성이 우수한 난연 보드
EP3489271B1 (en) * 2017-11-22 2020-05-27 3M Innovative Properties Company Thermal cycling resistant low density composition
EP3666812B1 (en) * 2018-12-13 2021-10-13 3M Innovative Properties Company Room temperature stable one-part void filler
BR112021011760A2 (pt) * 2018-12-18 2021-08-31 Cytec Industries Inc. Método para preencher espaços vazios em um painel sanduíche com configuração alveolar, e, composição epóxi
WO2021094292A1 (en) 2019-11-13 2021-05-20 Zephyros, Inc. Potting paste for honeycomb reinforcement
JP7388235B2 (ja) * 2020-02-20 2023-11-29 味の素株式会社 樹脂組成物
EP3875556A1 (en) * 2020-03-03 2021-09-08 Jotun A/S Coating
RU2768641C1 (ru) * 2021-03-12 2022-03-24 Федеральное государственное бюджетное учреждение науки "Федеральный исследовательский центр Южный научный центр Российской академии наук" Способ получения высокопрочных, термо- и огнестойких сферопластиков
EP4098704A1 (en) * 2021-06-04 2022-12-07 Jotun A/S Coating
CN115595091B (zh) * 2022-11-23 2023-04-18 江西天永诚高分子材料有限公司 一种超低密度超阻燃有机硅隔热灌封胶及其制备方法

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Also Published As

Publication number Publication date
KR20070090032A (ko) 2007-09-04
JP5384830B2 (ja) 2014-01-08
DE602005005722D1 (de) 2008-05-08
ES2302256T3 (es) 2008-07-01
JP2008525599A (ja) 2008-07-17
CA2592305A1 (en) 2006-07-06
BRPI0519233B1 (pt) 2016-06-07
EP1674518A1 (en) 2006-06-28
US20080167412A1 (en) 2008-07-10
US8188165B2 (en) 2012-05-29
DE602005005722T2 (de) 2009-04-16
EP1838776A1 (en) 2007-10-03
CN101124275A (zh) 2008-02-13
WO2006071820A1 (en) 2006-07-06
CA2592305C (en) 2013-05-14
ATE390459T1 (de) 2008-04-15
CN101124275B (zh) 2010-09-01
EP1838776B1 (en) 2008-03-26

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Legal Events

Date Code Title Description
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 07/06/2016, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 15A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2610 DE 12-01-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.