BRPI0406401A - Blindagem para componentes eletrônicos e/ou circuitos de aparelhos eletrônicos sob riscos de emi - Google Patents
Blindagem para componentes eletrônicos e/ou circuitos de aparelhos eletrônicos sob riscos de emiInfo
- Publication number
- BRPI0406401A BRPI0406401A BR0406401-1A BRPI0406401A BRPI0406401A BR PI0406401 A BRPI0406401 A BR PI0406401A BR PI0406401 A BRPI0406401 A BR PI0406401A BR PI0406401 A BRPI0406401 A BR PI0406401A
- Authority
- BR
- Brazil
- Prior art keywords
- emi
- circuits
- risk
- electronic
- electronic components
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09618—Via fence, i.e. one-dimensional array of vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10477—Inverted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
"BLINDAGEM PARA COMPONENTES ELETRôNICOS E/OU CIRCUITOS DE APARELHOS ELETRôNICOS SOB RISCO DE EMI". A presente invenção refere-se à disponibilidade de uma blindagem para componentes e/ou circuitos eletrônicos sob risco de EMI (20) de aparelhos eletrônicos, especialmente para equipamentos de emissão de rádio e/ou de recepção de rádio de terminais de telecomunicação para a telecomunicação sem cabos, como telefones sem fios e telefones de rádio móvel, a qual possa ser produzida sem trabalhos dispendiosos de fabricação e de montagem sem necessidade adicional de espaço, no qual instalam-se os componentes e/ou circuitos eletrônicos sob risco de EMI (20) sobre uma placa condutora (2) à parte, com pelo menos duas camadas, projetada como módulo de placa condutora. Essa placa condutora e uma outra placa condutora à parte (1), projetada como placa condutora básica, com pelo menos duas camadas, apresentando componentes e/ou circuitos eletrônicos sem risco de EMI (10) e um rebaixo (11) para os componentes e/ou circuitos eletrônicos sob risco de EMI (20), acham-se juntadas por técnica de ligação, de preferência por soldagem, de preferência na região de zonas de contato (12, 14, 22, 23), para formar uma unidade de um modo tal que através do rebaixo (11) disposto entre duas camadas metálicas projetadas como superfícies de massa (13, 21), sendo que as superfícies de massa (13, 21) estão ligadas respectivamente com as superfícies de blindagem (12, 22) através de passagens de contato (14, 23) dispostas bastante perto uma da outra, forma-se uma gaiola (3) que blinda os componentes e/ou circuitos eletrônicos sob risco de EMI (20) por todos os lados.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10329879 | 2003-07-02 | ||
PCT/EP2004/051332 WO2005004572A1 (de) | 2003-07-02 | 2004-07-02 | Abschirmung für emi-gefährdete elektronische bauelemente und/oder schaltungen von elektronischen geräten |
Publications (1)
Publication Number | Publication Date |
---|---|
BRPI0406401A true BRPI0406401A (pt) | 2005-08-09 |
Family
ID=33559826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR0406401-1A BRPI0406401A (pt) | 2003-07-02 | 2004-07-02 | Blindagem para componentes eletrônicos e/ou circuitos de aparelhos eletrônicos sob riscos de emi |
Country Status (8)
Country | Link |
---|---|
US (1) | US7269032B2 (pt) |
EP (1) | EP1537767B1 (pt) |
KR (1) | KR100851683B1 (pt) |
CN (1) | CN100386010C (pt) |
BR (1) | BRPI0406401A (pt) |
DE (1) | DE502004008576D1 (pt) |
ES (1) | ES2314409T3 (pt) |
WO (1) | WO2005004572A1 (pt) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101297351B (zh) | 2005-10-27 | 2013-01-02 | 纽昂斯奥地利通讯有限公司 | 用于处理口述信息的方法和系统 |
DE102006058000B4 (de) * | 2006-12-08 | 2011-12-15 | Rohde & Schwarz Gmbh & Co. Kg | Platinenanordnung |
US7965520B2 (en) | 2007-01-22 | 2011-06-21 | Sony Ericsson Mobile Communications Ab | Electronic device with flip module having low height |
DE102007006462A1 (de) * | 2007-02-05 | 2008-08-14 | Siemens Ag | Elektronische Schaltungsanordnung mit einer ersten und zweiten Leiterplatte |
CN100556248C (zh) * | 2007-04-27 | 2009-10-28 | 富葵精密组件(深圳)有限公司 | 柔性电路板激光加工承载装置 |
US7939766B2 (en) * | 2009-01-06 | 2011-05-10 | Honeywell International Inc. | Apparatus for electromagentically shielding a portion of a circuit board |
US8461855B2 (en) * | 2009-10-02 | 2013-06-11 | Teradyne, Inc. | Device interface board with cavity back for very high frequency applications |
US20120170230A1 (en) * | 2010-12-30 | 2012-07-05 | Research In Motion Limited | Combining printed circuit boards |
TWI433618B (zh) | 2012-02-08 | 2014-04-01 | Universal Scient Ind Shanghai | 堆疊式基板結構 |
DE102012212574B4 (de) * | 2012-07-18 | 2017-01-12 | Siemens Healthcare Gmbh | Verfahren zur elektromagnetischen Abschirmung für eine Magnetresonanzanlage sowie entsprechend abgeschirmte Vorrichtung |
CN202795296U (zh) * | 2012-08-31 | 2013-03-13 | 华为终端有限公司 | 触控显示屏和移动通讯设备 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR940006427Y1 (ko) * | 1991-04-12 | 1994-09-24 | 윤광렬 | 독서용 확대경 |
US5198963A (en) * | 1991-11-21 | 1993-03-30 | Motorola, Inc. | Multiple integrated circuit module which simplifies handling and testing |
US5376759A (en) * | 1993-06-24 | 1994-12-27 | Northern Telecom Limited | Multiple layer printed circuit board |
GB2297868B (en) | 1995-02-07 | 1999-04-28 | Nokia Mobile Phones Ltd | A shielding device |
DE29505327U1 (de) | 1995-03-29 | 1995-08-03 | Siemens Ag | Abschirmung für Logik- und Hochfrequenzschaltkreise |
JPH0936512A (ja) * | 1995-07-20 | 1997-02-07 | Japan Aviation Electron Ind Ltd | プリント回路装置 |
JPH10112517A (ja) * | 1996-10-03 | 1998-04-28 | Ngk Spark Plug Co Ltd | 電子部品収納用パッケージ |
DE29710640U1 (de) | 1997-06-18 | 1997-08-21 | Siemens Ag | Schirmung |
KR100266637B1 (ko) * | 1997-11-15 | 2000-09-15 | 김영환 | 적층형볼그리드어레이반도체패키지및그의제조방법 |
US6483406B1 (en) | 1998-07-31 | 2002-11-19 | Kyocera Corporation | High-frequency module using slot coupling |
DE19945427C1 (de) | 1999-09-22 | 2000-11-02 | Siemens Ag | Abschirmvorrichtung und Verfahren zu deren Herstellung |
US6243265B1 (en) * | 1999-10-06 | 2001-06-05 | Intel Corporation | Processor EMI shielding |
GB2358957B (en) * | 1999-10-27 | 2004-06-23 | Ibm | Ball grid array module |
JP2001237586A (ja) | 2000-02-25 | 2001-08-31 | Matsushita Electric Ind Co Ltd | 回路基板、回路部品内蔵モジュールおよびそれらの製造方法 |
US6486534B1 (en) | 2001-02-16 | 2002-11-26 | Ashvattha Semiconductor, Inc. | Integrated circuit die having an interference shield |
JP3734807B2 (ja) * | 2003-05-19 | 2006-01-11 | Tdk株式会社 | 電子部品モジュール |
-
2004
- 2004-07-02 BR BR0406401-1A patent/BRPI0406401A/pt not_active IP Right Cessation
- 2004-07-02 US US10/535,212 patent/US7269032B2/en active Active
- 2004-07-02 DE DE502004008576T patent/DE502004008576D1/de active Active
- 2004-07-02 WO PCT/EP2004/051332 patent/WO2005004572A1/de active Application Filing
- 2004-07-02 ES ES04741946T patent/ES2314409T3/es active Active
- 2004-07-02 CN CNB2004800012643A patent/CN100386010C/zh active Active
- 2004-07-02 EP EP04741946A patent/EP1537767B1/de active Active
- 2004-07-02 KR KR1020057008729A patent/KR100851683B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE502004008576D1 (de) | 2009-01-15 |
EP1537767B1 (de) | 2008-12-03 |
KR100851683B1 (ko) | 2008-08-11 |
CN100386010C (zh) | 2008-04-30 |
KR20060025516A (ko) | 2006-03-21 |
ES2314409T3 (es) | 2009-03-16 |
EP1537767A1 (de) | 2005-06-08 |
US20060027913A1 (en) | 2006-02-09 |
CN1706233A (zh) | 2005-12-07 |
US7269032B2 (en) | 2007-09-11 |
WO2005004572A1 (de) | 2005-01-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 8A ANUIDADE. |
|
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2159 DE 22/05/2012. |