WO2020063195A1 - 电路板结构及电子设备 - Google Patents
电路板结构及电子设备 Download PDFInfo
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- WO2020063195A1 WO2020063195A1 PCT/CN2019/101511 CN2019101511W WO2020063195A1 WO 2020063195 A1 WO2020063195 A1 WO 2020063195A1 CN 2019101511 W CN2019101511 W CN 2019101511W WO 2020063195 A1 WO2020063195 A1 WO 2020063195A1
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- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
Definitions
- the present disclosure relates to the field of circuit design, and in particular, to a circuit board structure and electronic equipment.
- a printed circuit board (Printed Circuit Board, PCB), as a main component in an electronic device, is used to carry components and implement circuit connectivity.
- PCB printed Circuit Board
- components in electronic equipment need to occupy more and more load-bearing area on the PCB.
- the volume of the electronic device including the limitation of the length and width dimensions and the thickness dimension, it is difficult to increase the load-bearing area of the PCB provided in the electronic device, which makes the load-bearing area of the PCB in the electronic device limited, further leading to The number of components that can be carried in the device is small.
- Some embodiments of the present disclosure provide a circuit board structure and an electronic device, so as to solve the problem that the number of components that can be carried in an electronic device is currently limited due to the limitation of the load area of the PCB due to the volume of the electronic device.
- some embodiments of the present disclosure provide a circuit board structure including two circuit boards and a connection shelf board, the two circuit boards are oppositely disposed and spaced apart, and components can be disposed on the two circuit boards.
- the connecting frame board is sandwiched between the two circuit boards, and the two circuit boards are electrically connected through the connecting frame board; at least one of the two circuit boards is provided with an opening on one side thereof And a component on another circuit board opposite to the side surface passes through the side surface through the opening.
- some embodiments of the present disclosure further provide an electronic device including the circuit board structure described above.
- the circuit board structure includes two circuit boards and a connection rack board, the two circuit boards are opposite and spaced apart, and components can be provided on the two circuit boards; the connection rack board It is sandwiched between the two circuit boards, and the two circuit boards are electrically connected through the connecting frame board; at least one of the two circuit boards is provided with an opening on one side of the circuit board and is connected to the side. Components on another circuit board disposed oppositely pass through the sides through the openings, so that when the volume of the electronic device is limited, the bearing area in the circuit board structure is increased, and the components that can be carried in the electronic device are increased. The number of devices has increased.
- FIG. 1 is one of the structural schematic diagrams of a circuit board structure provided by some embodiments of the present disclosure
- FIG. 2 is a second structural schematic diagram of a circuit board structure provided by some embodiments of the present disclosure.
- FIG. 3 is a third structural schematic diagram of a circuit board structure provided by some embodiments of the present disclosure.
- FIG. 4 is a fourth structural schematic diagram of a circuit board structure provided by some embodiments of the present disclosure.
- FIG. 1 is a schematic structural diagram of a circuit board structure provided by some embodiments of the present disclosure.
- the circuit board structure includes two circuit boards 10 and a connecting frame board 20 and two circuit boards 10. Opposite and spaced apart, and components 30 can be arranged on two circuit boards 10; the connection board 20 is sandwiched between the two circuit boards 10, and the two circuit boards 10 are electrically connected through the connection board 20; the two circuit boards One side 101 of at least one circuit board 10 in 10 is provided with an opening 102, and a component 30 on another circuit board 10 disposed opposite to the side 10 is passed through the side 101 through the opening 102.
- the side surface 101 refers to the opposite surfaces of the two circuit boards 10.
- the x-axis and y-axis directions of the circuit board structure (perpendicular to the x-axis and z)
- the bearing area of the circuit board structure for supporting components can be increased, so that the circuit board structure can carry a larger number of components;
- the component 30 on the other circuit board 10 passes through the opening 102 through the side 101, thereby reducing the z-axis structure of the circuit board structure.
- the circuit board structure can carry more components.
- each of the two circuit boards 10 described above may be any circuit board capable of carrying components 30, which may be a single-layer circuit board, a double-layer circuit board, or three or three layers.
- the above two circuit boards 10 may be single-layer circuit boards, or one of the two circuit boards 10 is a single-layer circuit board and the other circuit board 10 is a double-layer circuit board, etc. It is not limited here.
- the two circuit boards 10 is provided with an opening 102 on one side.
- the opening 102 may be provided on the side of one circuit board 10 opposite to the other circuit board 10, for example: optional, as shown in FIG.
- the two circuit boards 10 are a first circuit board 11 and a second circuit board 12.
- the first side 111 of the first circuit board 11 is opposite to the second side 121 of the second circuit board 12, and the first side 111 A first opening 112 is provided, and at least one first component 31 on the second side surface 121 passes through the first opening 112 through the first side surface 111, so that components on one of the two circuit boards 10 can be Through the side of another circuit board 10, the thickness of the circuit board structure in the z-axis direction is reduced.
- one side of at least one of the two circuit boards 10 is provided with an opening 102, or both of the two circuit boards 10 may be provided with an opening 102.
- the two The circuit board 10 is a first circuit board 11 and a second circuit board 12.
- the second side surface 121 is provided with a second opening 122, and at least one second component 32 on the first side surface 111 passes through the second opening 122.
- the two sides 121 allow the components 30 on the two circuit boards 10 to pass through the sides of the other circuit board 10 opposite to each other, thereby further reducing the thickness of the circuit board structure in the z-axis direction.
- the first side surface 111 and the second side surface 121 are two opposite side surfaces.
- the size and shape of the opening 102 may be set according to actual conditions, and the opening 102 may be provided with only one component 30 or two or more components can be provided. 30, as shown in FIG. 2, is not limited herein.
- the opening 102 on one circuit board 10 is opposed to two or more components 30 on the other circuit board 10, some or all of the two or more components 30 may be formed by The opening 102 projects through the above-mentioned side 101.
- the component 30 on the other circuit board 10 disposed opposite to the side surface 101 passes through the side surface 101 through the opening 102, and the component 30 on the other circuit board 10 may pass through the side surface 101.
- the circuit board 10 of the other circuit board 10 may also partially extend into the circuit board 10 where the side surface 101 is located, and does not penetrate the circuit board 10 where the side surface 101 is located.
- the opening 102 may be an opening in a recessed area of at least one circuit board 10.
- the first circuit board 11 is provided with a first opening 112 and a second circuit board 12 in the recessed area.
- a recessed area, namely, a second opening 122 is provided thereon, and the second component 32 on the first circuit board 11 may partially extend into the second circuit board 12, that is, the second circuit board 12 does not pass through, and the second circuit board 12
- the first component 31 may partially extend into the first circuit board 11, that is, the first circuit board 11 does not penetrate the first circuit board 11, thereby reducing the thickness of the circuit board structure in the z-axis direction.
- the opening 102 may also be an opening in a hollowed-out area of at least one circuit board 10, for example, as shown in FIG. 4, the two circuit boards 10 are the first circuit board 11 and the second circuit board 12.
- a circuit board 11 has a first opening 112 with a hollowed-out area
- a second circuit board 12 has a second opening 122 with a hollowed-out area
- the first component 31 can pass through the first circuit board 11 or partially extend into the first
- the circuit board 11 and the second component 32 can penetrate the second circuit board 12 or partially extend into the second circuit board 12, which can further reduce the thickness of the circuit board structure in the z-axis direction, especially when the two circuit boards 10 When the components 30 are longer.
- FIG. 3 and FIG. 4 only show the case where two recesses or hollowed-out openings 11 are opened on two circuit boards 10 at the same time, that is, blind holes and through holes for accommodating components, and in practical applications Of the above two circuit boards 10, only one of the circuit boards 10 may be provided with an opening 11 in a recessed area or a hollowed out area; or, one circuit board 10 may be provided with an opening 11 in a recessed area, and another circuit board 10 is provided with a hollowed out area.
- the openings 11 are not shown here one by one.
- openings 11 formed in at least one of the two circuit boards 10, and the specific number may be set according to actual needs, which is not limited herein.
- connection frame board 20 may be any structure capable of supporting the two circuit boards 10 and achieving electrical connection between the two circuit boards 10, for example, it may surround the two circuit boards. At least one circuit board provided with all components between the boards 10, and the at least one circuit board is welded to the two circuit boards 10 described above; or, at least two circuit boards provided around all the components between the two circuit boards 10 may be provided A chip component (such as a chip capacitor), and the two circuit boards 10 are electrically connected through one pin or two pins of each chip component, and so on, which are not limited herein.
- a chip component such as a chip capacitor
- the components carried in the circuit board structure may generate electromagnetic fields during the working process, which affects the normal operation of other components on the circuit board structure or components other than the circuit board structure, especially on a circuit board 10 in the circuit board structure.
- the component 30 partially penetrates or penetrates another circuit board 10.
- the opening 102 is an opening opened in a recessed area of at least one circuit board.
- a metal layer (not shown) may be provided on the inner wall of the recessed area, and the component 30 protruding into the recessed area may be shielded by the metal layer.
- the circuit board structure may further include a shield, and the shield is provided in the hollowed-out area located on the other side of the at least one circuit board 10.
- the shielding member shields the component 30, wherein the other side of the at least one circuit board 10 faces away from the side 101, so that the component passing through the side 101 is shielded by the shield.
- the first side of the third side surface 113 of the first circuit board 11 is provided with first shields 41 at intervals.
- the first shield 41 is located in the first opening 112 and shields the first shield 41 provided through the first side 111.
- the first component is shielded by the first shielding member 41.
- the second circuit board 12 may be provided with a second shielding member 42, and the second shielding member 42 may be shielded and disposed through the second side surface 121.
- the second component 32 On the second component 32.
- the above-mentioned shielding member may be any component that plays an electromagnetic shielding role on the component 30 it is shielding, for example, it may be a shielding member made of a metal material, and the shielding member made of the metal is soldered to the circuit board. 10; or a structure such as a shielding cloth, which is not limited herein.
- the above-mentioned shielding member can be in contact with its shielded component 30, so that the heat generated by the shielded component 30 can be conducted to the circuit board 10 where the shield is located through the shield, and through the circuit The board 10 timely dissipates heat generated by the components 30 shielded by the shield.
- the above-mentioned shielding member can also be spaced a certain distance from the component 30 it shields.
- the circuit board structure further includes an insulating and thermally conductive member.
- the device 30 is connected to the shield through an insulating and thermally conductive member, so that the heat of the component 30 can be conducted to the shield through the insulating and thermally conductive member, and then the shield can conduct the heat to the circuit board 10 where it is located.
- a first insulating and thermally conductive member 51 is provided between the first component 31 and the first shielding member 41, and the heat of the first component 31 is conducted to the first through the first insulating and thermally conductive member 51.
- the shield 41 is the same; similarly, a second insulation and heat-conducting member 52 may be provided between the second component 32 and the second shield 42, which is not repeated here.
- the insulating and thermally conductive member may be any structure made of an insulating and thermally conductive material.
- the insulating and thermally conductive member may be a thermally conductive grease layer disposed between the component and the shield, and so on.
- the circuit board structure in order to further improve the heat dissipation capability of the circuit board structure, optionally, the circuit board structure further includes a heat dissipation layer, and the heat dissipation layer is spaced apart from and opposite to the other side of the at least one circuit board 10 through the heat dissipation layer.
- the heat generated by the components in the circuit board structure can be conducted to the external structure in time, such as a housing of an electronic device provided with the circuit board structure.
- the shape, size, and position of the heat dissipation layer may be set according to actual needs.
- the heat dissipation layer may be a projection covering shield on the other side of at least one circuit board 10; or as shown in FIG. 4
- the third side surface 113 of the first circuit board 11 is provided with first heat dissipation layers 61 spaced apart from each other, and the first heat dissipation layer 61 covers the first circuit board 11 in a projection on the plane where the first circuit board 11 is located;
- the second heat dissipation layer 62 is disposed at intervals on the four sides 123, and the projection of the second heat dissipation layer 62 on the plane where the second circuit board 12 is located covers the second circuit board 12, and so on, which is not limited herein.
- the heat dissipation layer may be any structure having heat dissipation capability.
- the heat dissipation layer may be a graphite heat conductive layer, thereby having good heat dissipation performance.
- the circuit board structure includes two circuit boards and a connection board.
- the two circuit boards are arranged opposite to each other and components can be arranged on the two circuit boards.
- the connection board is sandwiched between the two circuits. Between the two boards, the two circuit boards are electrically connected through a connecting frame board; at least one of the two circuit boards is provided with an opening on one side, and components on the other circuit board opposite to the side pass through the side through the opening. Therefore, under the condition that the volume of the electronic device is limited, the bearing area in the circuit board structure is increased, and the number of components that can be carried in the electronic device is increased.
- some embodiments of the present disclosure further provide an electronic device including the above circuit board structure.
- the above-mentioned electronic device may be a mobile terminal, such as: a mobile phone, a tablet computer, a laptop computer, a personal digital assistant (PDA), and mobile Internet access.
- the device Mobile Internet Device, MID
- wearable device can also be other electronic devices, such as digital cameras, e-books, navigators, etc.
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Abstract
一种电路板结构及电子设备，电路板结构包括两块电路板(10)以及连接架板(20)，两块电路板(10)相对且间隔设置，且两块电路板(10)上可设置元器件(30)；连接架板(20)夹设于两块电路板(10)之间，两块电路板(10)通过连接架板(20)电连接；两块电路板(10)中至少一块电路板(10)的一侧面(101)设置有开口(102)，且与侧面(101)相对设置的另一块电路板(10)上的元器件(30)由开口(102)穿过侧面(101)。
Description
相关申请的交叉引用
本申请主张在2018年9月29日在中国提交的中国专利申请号No.201811148871.2的优先权，其全部内容通过引用包含于此。
本公开涉及电路设计领域，尤其涉及一种电路板结构及电子设备。
随着电子技术的飞速发展，智能手机和平板电脑等电子设备越来越普及，并已成为人们日常生活中不可或缺的工具。为了满足人们对于电子设备的需求，电子设备通过元器件性能的改进以及新增元器件来实现越来越多的功能。
其中，印刷电路板(Printed Circuit Board，PCB)作为电子设备中的主要组件，用于承载元器件以及实现电路的连通。而随着电子设备中元器件的不断增加，电子设备中元器件需要占用PCB上越来越多的承载面积。但是，由于受电子设备的体积的限制，包括长宽尺寸的限制以及厚度尺寸的限制，设置于电子设备中的PCB的承载面积难以增加，使得电子设备中PCB的承载面积有限，进一步导致在电子设备中可承载的元器件数量较少。
可见，目前存在因电子设备的体积限制了PCB的承载面积，而导致电子设备中可承载的元器件数量较少的问题。
发明内容
本公开的一些实施例提供一种电路板结构及电子设备，以解决目前存在因电子设备的体积限制了PCB的承载面积，而导致电子设备中可承载的元器件数量较少的问题。
为解决上述技术问题，本公开是这样实现的：
第一方面，本公开的一些实施例提供一种电路板结构，包括两块电路板以及连接架板，所述两块电路板相对且间隔设置，且所述两块电路板上可设 置元器件；所述连接架板夹设于所述两块电路板之间，两块所述电路板通过所述连接架板电连接；两块所述电路板中至少一块电路板的一侧面设置有开口，且与所述侧面相对设置的另一块电路板上的元器件由所述开口穿过所述侧面。
第二方面，本公开的一些实施例还提供一种电子设备，包括上述电路板结构。
本公开的一些实施例中，电路板结构包括两块电路板以及连接架板，所述两块电路板相对且间隔设置，且所述两块电路板上可设置元器件；所述连接架板夹设于所述两块电路板之间，两块所述电路板通过所述连接架板电连接；两块所述电路板中至少一块电路板的一侧面设置有开口，且与所述侧面相对设置的另一块电路板上的元器件由所述开口穿过所述侧面，从而在电子设备的体积有限的情况下，实现电路板结构中承载面积的增加，使电子设备中可承载的元器件数量增加。
图1是本公开的一些实施例提供的电路板结构的结构示意图之一；
图2是本公开的一些实施例提供的电路板结构的结构示意图之二；
图3是本公开的一些实施例提供的电路板结构的结构示意图之三；
图4是本公开的一些实施例提供的电路板结构的结构示意图之四。
下面将结合本公开的一些实施例中的附图，对本公开的一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本公开一部分实施例，而不是全部的实施例。基于本公开中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本公开保护的范围。
参见图1，图1是本公开的一些实施例提供的一种电路板结构的结构示意图，如图1所示，电路板结构包括两块电路板10以及连接架板20，两块电路板10相对且间隔设置，且两块电路板10上可设置元器件30；连接架板 20夹设于两块电路板10之间，两块电路板10通过连接架板20电连接；两块电路板10中至少一块电路板10的一侧面101设置有开口102，且与侧面10相对设置的另一块电路板10上的元器件30由开口102穿过侧面101。其中，侧面101指两块电路板10相对的表面。
这里，由于电路板结构中两块电路板10相对设置，且两块电路板10的相对侧面可设置元器件30，从而在电路板结构的x轴向和y轴向(垂直于x轴和z轴所在平面的方向)上尺寸受限时，可以增加电路板结构中用于承载元器件的承载面积，使电路板结构可承载的元器件数量较多；而在电路板结构的z轴向上的尺寸受限时，通过在一块电路板10的侧面101开设开口102，使另一块电路板10上的元器件30由开口102穿过侧面101，从而可以降低电路板结构在z轴向上的厚度，实现电路板结构中两块电路板101的相对且间隔设置，甚至于可以使电路板结构中相对且间隔设置两块以上的电路板101，进一步使电路板结构的承载面积增加，从而使电路板结构中可以承载更多元器件。
本公开的一些实施例中，上述两块电路板10中每一电路板10可以是任何能够承载元器件30的电路板，其可以是单层电路板、双层电路板或者三层或三层以上的电路板，例如：上述两块电路板10均可以为单层电路板，或者两块电路板10中一块电路板10为单层电路板且另一块电路板10为双层电路板，等等，在此并不进行限定。
其中，上述两块电路板10中至少一块电路板的一侧面开设有开口102，可以是一块电路板10与另一块电路板10相对的一侧面开设有开口102，例如：可选的，如图2所示，两块电路板10为第一电路板11和第二电路板12，第一电路板11的第一侧面111与第二电路板12的第二侧面121相对设置，第一侧面111设置有第一开口112，且第二侧面121上的至少一个第一元器件31由第一开口112穿过第一侧面111，从而使两块电路板10中一块电路板10上的元器件可以穿过另一块电路板10的侧面，实现电路板结构在z轴向上厚度的减小。
当然，上述两块电路板10中至少一块电路板的一侧面开设有开口102，也可以是两块电路板10上均设置有开口102，例如：可选的，如图3所示， 上述两块电路板10为第一电路板11和第二电路板12，第二侧面121设置有第二开口122，且第一侧面111上的至少一个第二元器件32由第二开口122穿过第二侧面121，从而使两块电路板10上的元器件30可以穿过与其相对的另一块电路板10的侧面，能够进一步减小电路板结构在z轴向上的厚度。其中，第一侧面111和第二侧面121为相对的两个侧面。
需要说明的是，上述开口102的大小以及形状等可以根据实际情况进行设定，且上述开口102中可以是仅设置有一个元器件30，也可以是能够设置两个或者两个以上的元器件30，即如图2所示，在此并不进行限定。
另外，当一电路板10上的开口102与另一电路板10上的两个或者两个以上的元器件30相对时，可以是两个或者两个以上的元器件30中的部分或者全部由开口102伸入穿过上述侧面101。
本公开的一些实施例中，上述与侧面101相对设置的另一块电路板10上的元器件30由开口102穿过侧面101，可以是上述另一块电路板10上的元器件30贯穿侧面101所在的电路板10；也可以是上述另一块电路板10上的元器件30部分伸入侧面101所在的电路板10，且未贯穿侧面101所在的电路板10。
其中，上述开口102可以为开设于至少一块电路板10上的凹陷区域的开口，例如：如图3所示，第一电路板11上开设有凹陷区域的第一开口112，第二电路板12上开设有凹陷区域即第二开口122，且第一电路板11上的第二元器件32可以部分伸入第二电路板12即未贯穿第二电路板12，以及第二电路板12上的第一元器件31可以部分伸入第一电路板11即未贯穿第一电路板11，从而实现电路板结构在z轴向上厚度的减小。
当然，上述开口102也可以为开设于至少一块电路板10上的镂空区域的开口，例如：如图4所示，上述两块电路板10为第一电路板11和第二电路板12，第一电路板11上开设有镂空区域的第一开口112，第二电路板12上开设有镂空区域的第二开口122，且第一元器件31可以贯穿第一电路板11或者部分伸入第一电路板11，以及第二元器件32可以贯穿第二电路板12或者部分伸入第二电路板12，能够进一步减小电路板结构在z轴向上的厚度，尤其是当两块电路板10之间的元器件30较长时。
应当说明的是，图3和图4中仅示出两块电路板10上同时开设有凹陷区域或者镂空区域的开口11的情况，即容纳元器件的盲孔和通孔，而在实际应用中，上述两块电路板10中可以仅一块电路板10开设有凹陷区域或者镂空区域的开口11；或者，也可以是一块电路板10开设凹陷区域的开口11，而另一块电路板10开设镂空区域的开口11，在此并不一一示出。
另外，上述两块电路板10中至少一块电路板10上开设的开口11可以是一个或者多个，其具体数量可以是根据实际需要进行设定，在此并不进行限定。
本公开的一些实施例中，上述连接架板20可以是任何能够支撑上述两块电路板10，且实现两块电路板10之间的电连接的结构，例如：其可以是围绕上述两块电路板10之间所有元器件设置的至少一块电路板，且该至少一块电路板与上述两块电路板10焊接；或者，也可以是围绕上述两块电路板10之间所有元器件设置的至少两个贴片元件(如贴片电容)，且上述两块电路板10通过每一贴片元件的一个引脚或者两个引脚电连接，等等，在此并不进行限定。
由于电路板结构中承载的元器件在工作过程中可能产生电磁场，从而影响到电路板结构上的其他元器件或者电路板结构以外部件的正常工作，尤其是电路板结构中一电路板10上的元器件30部分伸入或者贯穿另一电路板10时。
本公开的一些实施例中，为降低因电路板结构中伸入或者贯穿一电路板10的元器件30的电磁产生的影响，在上述开口102为开设于至少一块电路板上的凹陷区域的开口的情况下，可以在凹陷区域的内壁设置有金属层(图未示)，通过金属层对伸入凹陷区域的元器件30进行屏蔽。
或者，在上述开口102为开设于至少一块电路板上的镂空区域的开口的情况下，电路板结构还可以包括屏蔽件，屏蔽件设置于镂空区域位于上述至少一块电路板10的另一侧面所处的位置，且屏蔽件遮蔽上述元器件30，其中，上述至少一块电路板10的另一侧面与侧面101背对，从而通过屏蔽件对穿过侧面101的元器件进行屏蔽。
例如：如图4所示，第一电路板11的第三侧面113间隔设置有第一屏蔽 件41，第一屏蔽件41位于第一开口112且遮蔽设于穿过第一侧面111的第一元器件31上，通过第一屏蔽件41屏蔽第一元器件；同理，第二电路板12上可以设置有第二屏蔽件42，第二屏蔽件42可以屏蔽设于穿过第二侧面121的第二元器件32上。
另外，上述屏蔽件可以是任何对其所遮蔽的元器件30起到电磁屏蔽作用的部件，例如：其可以是由金属材料制成的屏蔽件，且该金属制成的屏蔽件焊接于电路板10上；或者，也可以是屏蔽布等结构，在此并不进行限定。
应当说明的是，上述屏蔽件可以与其屏蔽的元器件30相抵接，从而通过屏蔽件，可以将其所屏蔽的元器件30产生的热量传导到该屏蔽件所在的电路板10上，通过该电路板10及时将屏蔽件所屏蔽的元器件30产生的热量散发。
当然，上述屏蔽件也可以与其屏蔽的元器件30之间间隔一定距离，而为保证屏蔽件所屏蔽的元器件30产生的热量及时散发，可选的，电路板结构还包括绝缘导热件，元器件30通过绝缘导热件与屏蔽件连接，从而通过绝缘导热件可以将该元器件30的热量传导至屏蔽件，再由屏蔽件将热量传导至其所在的电路板10上。
例如：如图4中所示，第一元器件31与第一屏蔽件41之间设置有第一绝缘导热件51，通过第一绝缘导热件51将第一元器件31的热量传导至第一屏蔽件41上；同理，第二元器件32与第二屏蔽件42之间也可以设置有第二绝缘导热件52，在此不赘述。
其中，该绝缘导热件可以是任何有绝缘导热材料制成的结构，例如：可以是设置于元器件与屏蔽件之间的导热凝脂层，等等。
本公开的一些实施例中，为进一步提升电路板结构的散热能力，可选的，电路板结构还包括散热层，散热层与至少一块电路板10的另一侧面间隔且相对设置，通过散热层可以将电路板结构中元器件产生的热量及时传导至外部结构，如设置有电路板结构的电子设备的外壳等。
其中，上述散热层的形状、大小以及位置等可以根据实际需要进行设定，例如：可以是散热层在至少一块电路板10的另一侧面上的投影覆盖屏蔽件；或者，如图4所示，第一电路板11的第三侧面113间隔设置有第一散热层61，且第一散热层61在第一电路板11所在平面的投影覆盖第一电路板11；第二 电路板12的第四侧面123间隔设置有第二散热层62，且第二散热层62在第二电路板12所在平面的投影覆盖第二电路板12，等等，在此并不进行限定。
应当说明的是，上述散热层可以是任何具备散热能力的结构，例如：上述散热层可以是石墨导热层，从而具备良好的散热性能。
本公开的一些实施例中，电路板结构包括两块电路板以及连接架板，两块电路板相对且间隔设置，且两块电路板上可设置元器件；连接架板夹设于两块电路板之间，两块电路板通过连接架板电连接；两块电路板中至少一块电路板的一侧面设置有开口，且与侧面相对设置的另一块电路板上的元器件由开口穿过侧面，从而在电子设备的体积有限的情况下，实现电路板结构中承载面积的增加，使电子设备中可承载的元器件数量增加。
基于上述电路板结构，本公开的一些实施例还提供一种电子设备，包括上述电路板结构。
由于电子设备本体的结构是相关技术，电路板结构在上述实施例中已进行详细说明，因此，本实施例中对于具体的电子设备的结构不再赘述。
本公开的一些实施例中，上述电子设备可以是移动终端，例如：手机、平板电脑(Tablet Personal Computer)、膝上型电脑(Laptop Computer)、个人数字助理(personal digital assistant，PDA)、移动上网装置(Mobile Internet Device，MID)或可穿戴式设备(Wearable Device)等，还可以是其它电子设备，如数码相机、电子书、导航仪等。
上面结合附图对本公开的实施例进行了描述，但是本公开并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本公开的启示下，在不脱离本公开宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本公开的保护之内。
Claims (10)
- 一种电路板结构，包括两块电路板以及连接架板，所述两块电路板相对且间隔设置，且所述两块电路板上可设置元器件；所述连接架板夹设于所述两块电路板之间，两块所述电路板通过所述连接架板电连接；两块所述电路板中至少一块电路板的一侧面设置有开口，且与所述侧面相对设置的另一块电路板上的元器件由所述开口穿过所述侧面。
- 根据权利要求1所述的电路板结构，其中，所述两块电路板为第一电路板和第二电路板，所述第一电路板的第一侧面与所述第二电路板的第二侧面相对设置，所述第一侧面设置有第一开口，且所述第二侧面上的至少一个第一元器件由所述第一开口穿过所述第一侧面。
- 根据权利要求2所述的电路板结构，其中，所述第二侧面设置有第二开口，且所述第一侧面上的至少一个第二元器件由所述第二开口穿过所述第二侧面。
- 根据权利要求1至3中任一项所述的电路板结构，其中，所述开口为开设于所述至少一块电路板上的凹陷区域的开口。
- 根据权利要求1至3中任一项所述的电路板结构，其中，所述开口为开设于所述至少一块电路板上的镂空区域的开口。
- 根据权利要求5所述的电路板结构，其中，所述元器件未贯穿所述至少一块电路板，或者所述元器件贯穿所述至少一块电路板。
- 根据权利要求5所述的电路板结构，其中，所述电路板结构还包括屏蔽件，所述屏蔽件设置于所述镂空区域位于所述至少一块电路板的另一侧面所处的位置，且所述屏蔽件遮蔽所述元器件，其中，所述至少一块电路板的另一侧面与所述侧面背对。
- 根据权利要求7所述的电路板结构，其中，所述电路板结构还包括绝缘导热件，所述元器件通过所述绝缘导热件与所述屏蔽件连接。
- 根据权利要求7所述的电路板结构，其中，所述电路板结构还包括散热层，所述散热层与所述至少一块电路板的另一侧面间隔且相对设置。
- 一种电子设备，包括如权利要求1至9中任一项所述的电路板结构。
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