BR9714383A - Processo e dispositivo para formação de um revestimento sobre um substrato por meio de bombardeamento catódico - Google Patents

Processo e dispositivo para formação de um revestimento sobre um substrato por meio de bombardeamento catódico

Info

Publication number
BR9714383A
BR9714383A BR9714383-9A BR9714383A BR9714383A BR 9714383 A BR9714383 A BR 9714383A BR 9714383 A BR9714383 A BR 9714383A BR 9714383 A BR9714383 A BR 9714383A
Authority
BR
Brazil
Prior art keywords
substrate
pct
width
coating
coated
Prior art date
Application number
BR9714383-9A
Other languages
English (en)
Inventor
Pierre Vanden Brande
Alain Weymeersch
Original Assignee
Cockerill Rech & Dev
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cockerill Rech & Dev filed Critical Cockerill Rech & Dev
Publication of BR9714383A publication Critical patent/BR9714383A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761—Continuous moving
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

Patente de Invenção:<B>"PROCESSO E DISPOSITIVO PARA FORMAçãO DE UM REVESTIMENTO SOBRE UM SUBSTRATO POR MEIO DE BOMBARDEAMENTO CATóDICO"<D>. é divulgado um processo para formação de um revestimento sobre um substrato (2, 2') por meio de bombardeamento catódico, compreendendo o revestimento das superfícies do substrato (2, 2') os quais tenham sido transferidos para uma câmara de bombardeamento catódico (1). Os substratos variam em largura e possuem uma largura máxima predeterminada. O processo envolve o uso de uma tela de tubo de raios catódicos (3) cuja superfície (4) possuem um comprimento invariável correspondendo aproximadamente à largura máxima o referido substrato. Um desvio ocorre, de acordo com a largura do substrato a ser revestido, entre a superfície (4) da tela de tubo de raios catódicos e a superfície do substrato a ser revestido, de modo que a superfície toda da tela de tubo de raios catódicos permanece mais ou menos constante em comparação à superfície a ser revestida durante o processo de bombardeamento catódico.
BR9714383-9A 1996-12-10 1997-12-09 Processo e dispositivo para formação de um revestimento sobre um substrato por meio de bombardeamento catódico BR9714383A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
BE9601030A BE1010797A3 (fr) 1996-12-10 1996-12-10 Procede et dispositif pour la formation d'un revetement sur un substrat, par pulverisation cathodique.
PCT/BE1997/000133 WO1998026108A1 (fr) 1996-12-10 1997-12-09 Procede et dispositif pour la formation d'un revetement sur un substrat, par pulverisation cathodique

Publications (1)

Publication Number Publication Date
BR9714383A true BR9714383A (pt) 2000-05-16

Family

ID=3890138

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9714383-9A BR9714383A (pt) 1996-12-10 1997-12-09 Processo e dispositivo para formação de um revestimento sobre um substrato por meio de bombardeamento catódico

Country Status (13)

Country Link
US (1) US6083359A (pt)
EP (1) EP0944745B1 (pt)
JP (1) JP3971458B2 (pt)
AT (1) ATE242819T1 (pt)
AU (1) AU5304898A (pt)
BE (1) BE1010797A3 (pt)
BR (1) BR9714383A (pt)
CA (1) CA2271990C (pt)
DE (1) DE69722812T2 (pt)
DK (1) DK0944745T3 (pt)
ES (1) ES2200203T3 (pt)
PT (1) PT944745E (pt)
WO (1) WO1998026108A1 (pt)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1783814A1 (fr) 2005-11-07 2007-05-09 ARCELOR France Procédé et installation d'avivage sous vide par pulvérisation magnétron d'une bande métallique
WO2012066080A1 (en) 2010-11-17 2012-05-24 Bekaert Advanced Coatings Sputtering apparatus and method
JP5950866B2 (ja) * 2013-05-15 2016-07-13 株式会社神戸製鋼所 成膜装置及び成膜方法
DE102022110019A1 (de) 2022-04-26 2023-10-26 VON ARDENNE Asset GmbH & Co. KG Verfahren und Beschichtungsanordnung

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5974277A (ja) * 1982-10-21 1984-04-26 Mitsubishi Heavy Ind Ltd 真空蒸着装置
DE3400843A1 (de) * 1983-10-29 1985-07-18 VEGLA Vereinigte Glaswerke GmbH, 5100 Aachen Verfahren zum herstellen von autoglasscheiben mit streifenfoermigen blendschutzfiltern durch bedampfen oder sputtern, und vorrichtung zur durchfuehrung des verfahrens
JPH0772349B2 (ja) * 1987-05-12 1995-08-02 住友電気工業株式会社 大面積化合物薄膜の作製方法および装置
DE3926877A1 (de) * 1989-08-16 1991-02-21 Leybold Ag Verfahren zum beschichten eines dielektrischen substrats mit kupfer
JPH04371577A (ja) * 1991-06-19 1992-12-24 Sony Corp マグネトロン型スパッタリング装置
US5228963A (en) * 1991-07-01 1993-07-20 Himont Incorporated Hollow-cathode magnetron and method of making thin films
JP3463693B2 (ja) * 1992-10-29 2003-11-05 石川島播磨重工業株式会社 連続帯状物用真空蒸着装置
BE1008303A3 (fr) * 1994-06-02 1996-04-02 Cockerill Rech & Dev Procede et dispositif pour la formation d'un revetement sur un substrat par pulverisation cathodique.

Also Published As

Publication number Publication date
DK0944745T3 (da) 2003-09-29
DE69722812D1 (de) 2003-07-17
EP0944745A1 (fr) 1999-09-29
ATE242819T1 (de) 2003-06-15
EP0944745B1 (fr) 2003-06-11
CA2271990C (fr) 2005-06-14
PT944745E (pt) 2003-10-31
AU5304898A (en) 1998-07-03
BE1010797A3 (fr) 1999-02-02
DE69722812T2 (de) 2003-12-04
JP3971458B2 (ja) 2007-09-05
US6083359A (en) 2000-07-04
WO1998026108A1 (fr) 1998-06-18
JP2001509209A (ja) 2001-07-10
CA2271990A1 (fr) 1998-06-18
ES2200203T3 (es) 2004-03-01

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Legal Events

Date Code Title Description
FB36 Technical and formal requirements: requirement - article 36 of industrial property law
B06I Publication of requirement cancelled [chapter 6.9 patent gazette]
B09Y Publication of grant cancelled [chapter 9.1.2 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]
B21A Patent or certificate of addition expired [chapter 21.1 patent gazette]