BR8102389A - Modulo de semicondutor de potencia - Google Patents
Modulo de semicondutor de potenciaInfo
- Publication number
- BR8102389A BR8102389A BR8102389A BR8102389A BR8102389A BR 8102389 A BR8102389 A BR 8102389A BR 8102389 A BR8102389 A BR 8102389A BR 8102389 A BR8102389 A BR 8102389A BR 8102389 A BR8102389 A BR 8102389A
- Authority
- BR
- Brazil
- Prior art keywords
- power semiconductor
- semiconductor module
- module
- power
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3028178A DE3028178C2 (de) | 1980-07-25 | 1980-07-25 | Leistungshalbleiter-Modul |
Publications (1)
Publication Number | Publication Date |
---|---|
BR8102389A true BR8102389A (pt) | 1982-08-17 |
Family
ID=6108061
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR8102389A BR8102389A (pt) | 1980-07-25 | 1981-04-20 | Modulo de semicondutor de potencia |
Country Status (3)
Country | Link |
---|---|
US (1) | US4436951A (pt) |
BR (1) | BR8102389A (pt) |
DE (1) | DE3028178C2 (pt) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3127457C2 (de) * | 1981-07-11 | 1985-09-12 | Brown, Boveri & Cie Ag, 6800 Mannheim | Stromrichtermodul |
JPS5893358A (ja) * | 1981-11-30 | 1983-06-03 | Mitsubishi Electric Corp | 半導体装置 |
DE3241508A1 (de) * | 1982-11-10 | 1984-05-10 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungstransistor-modul |
DE3241509A1 (de) * | 1982-11-10 | 1984-05-10 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungstransistor-modul |
US4630174A (en) * | 1983-10-31 | 1986-12-16 | Kaufman Lance R | Circuit package with external circuit board and connection |
DE3406538A1 (de) * | 1984-02-23 | 1985-08-29 | Bbc Brown Boveri & Cie | Leistungshalbleitermodul und verfahren zur herstellung |
DE3505086A1 (de) * | 1985-02-14 | 1986-08-28 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungshalbleitermodul mit einem kunststoffgehaeuse |
DE3508456A1 (de) * | 1985-03-09 | 1986-09-11 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungshalbleitermodul |
DE3521572A1 (de) * | 1985-06-15 | 1986-12-18 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungshalbleitermodul mit keramiksubstrat |
DE3610288A1 (de) * | 1986-03-26 | 1987-10-01 | Bbc Brown Boveri & Cie | Leistungshalbleitermodul |
EP0249766B1 (de) * | 1986-06-14 | 1991-12-04 | Peter Hofsäss | Isoliergehäuse für Thermoschalter |
DE3621994A1 (de) * | 1986-07-01 | 1988-01-14 | Bbc Brown Boveri & Cie | Leistungshalbleitermodul |
DE3717489A1 (de) * | 1987-05-23 | 1988-12-01 | Asea Brown Boveri | Leistungshalbleitermodul und verfahren zur herstellung des moduls |
US4739449A (en) * | 1987-06-30 | 1988-04-19 | Kaufman Lance R | Circuit package with thermal expansion relief chimney |
FR2620296B1 (fr) * | 1987-09-03 | 1990-01-19 | Bendix Electronics Sa | Boitier pour circuit electronique |
ES2011549A6 (es) * | 1989-04-05 | 1990-01-16 | Fagor Electrotecnica S Coop Lt | Mejoras en la estructuracion de puentes rectificadores. |
US5148264A (en) * | 1990-05-02 | 1992-09-15 | Harris Semiconductor Patents, Inc. | High current hermetic package |
DE4446527A1 (de) * | 1994-12-24 | 1996-06-27 | Ixys Semiconductor Gmbh | Leistungshalbleitermodul |
DE19522126C2 (de) * | 1995-06-19 | 1999-01-28 | Hella Kg Hueck & Co | Elektronischer Lastschalter für ein Kraftfahrzeug, beispielsweise Blinkgeber |
EP1661178B1 (de) * | 2003-09-05 | 2006-12-06 | Rohde & Schwarz GmbH & Co. KG | Elektronisches Bauelement mit Kühlfläche |
DE102004035746B4 (de) * | 2004-07-23 | 2009-04-16 | Infineon Technologies Ag | Leistungshalbleitermodul |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3638073A (en) * | 1970-02-19 | 1972-01-25 | Gen Instrument Corp | Semiconductor assembly with heat sink and connector bodies |
DE2617335A1 (de) * | 1976-04-21 | 1977-11-03 | Siemens Ag | Halbleiterbauelement |
DE2728564A1 (de) * | 1977-06-24 | 1979-01-11 | Siemens Ag | Halbleiterbauelement |
US4394530A (en) * | 1977-09-19 | 1983-07-19 | Kaufman Lance R | Power switching device having improved heat dissipation means |
-
1980
- 1980-07-25 DE DE3028178A patent/DE3028178C2/de not_active Expired
-
1981
- 1981-04-20 BR BR8102389A patent/BR8102389A/pt unknown
- 1981-07-17 US US06/284,335 patent/US4436951A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE3028178C2 (de) | 1985-05-09 |
DE3028178A1 (de) | 1982-02-25 |
US4436951A (en) | 1984-03-13 |
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