MX152005A - Modulo mejorado de dispositivo de potencia - Google Patents

Modulo mejorado de dispositivo de potencia

Info

Publication number
MX152005A
MX152005A MX192796A MX19279682A MX152005A MX 152005 A MX152005 A MX 152005A MX 192796 A MX192796 A MX 192796A MX 19279682 A MX19279682 A MX 19279682A MX 152005 A MX152005 A MX 152005A
Authority
MX
Mexico
Prior art keywords
power device
device module
improved power
improved
module
Prior art date
Application number
MX192796A
Other languages
English (en)
Inventor
Alexander John Yemman
James Anthony Loughran
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of MX152005A publication Critical patent/MX152005A/es

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
MX192796A 1981-05-21 1982-05-20 Modulo mejorado de dispositivo de potencia MX152005A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US26586881A 1981-05-21 1981-05-21

Publications (1)

Publication Number Publication Date
MX152005A true MX152005A (es) 1985-05-23

Family

ID=23012192

Family Applications (1)

Application Number Title Priority Date Filing Date
MX192796A MX152005A (es) 1981-05-21 1982-05-20 Modulo mejorado de dispositivo de potencia

Country Status (3)

Country Link
EP (1) EP0065686A3 (es)
JP (1) JPS57202765A (es)
MX (1) MX152005A (es)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3444699A1 (de) * 1984-12-07 1986-06-19 Telefunken electronic GmbH, 7100 Heilbronn Elektrisches leistungsbauteil
JPS629649A (ja) * 1985-07-08 1987-01-17 Nec Corp 半導体用パツケ−ジ
CN87107692A (zh) * 1986-11-13 1988-05-25 Mt化学公司 半导体器件的制造方法
CA1307355C (en) * 1988-05-26 1992-09-08 David C. Degree Soft-faced semiconductor component backing
US5212625A (en) * 1988-12-01 1993-05-18 Akzo Nv Semiconductor module having projecting cooling fin groups
EP0376365B1 (en) * 1988-12-01 1995-08-09 Akzo Nobel N.V. Semiconductor module
GB2229041A (en) * 1989-01-31 1990-09-12 Electrolube Limited Electrical circuit heat sink
WO2019169501A1 (en) * 2018-03-07 2019-09-12 Dana Canada Corporation Heat exchangers with integrated electrical heating elements and with multiple fluid flow passages

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS476832U (es) * 1971-02-17 1972-09-25
JPS4727891U (es) * 1971-04-14 1972-11-29
US4029628A (en) * 1974-05-22 1977-06-14 The United States Of America As Represented By The Secretary Of The Navy Bonding material for planar electronic device
US4117508A (en) * 1977-03-21 1978-09-26 General Electric Company Pressurizable semiconductor pellet assembly
DE2827523A1 (de) * 1978-06-23 1980-01-03 Schroff & Co Messtechnik Kuehleinrichtung fuer halbleiter
EP0015053A1 (en) * 1979-01-27 1980-09-03 LUCAS INDUSTRIES public limited company A method of manufacturing a semi-conductor power device assembly and an assembly thereby produced

Also Published As

Publication number Publication date
EP0065686A3 (en) 1984-10-10
JPS57202765A (en) 1982-12-11
EP0065686A2 (en) 1982-12-01

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