MX152005A - Modulo mejorado de dispositivo de potencia - Google Patents
Modulo mejorado de dispositivo de potenciaInfo
- Publication number
- MX152005A MX152005A MX19279682A MX19279682A MX152005A MX 152005 A MX152005 A MX 152005A MX 19279682 A MX19279682 A MX 19279682A MX 19279682 A MX19279682 A MX 19279682A MX 152005 A MX152005 A MX 152005A
- Authority
- MX
- Mexico
- Prior art keywords
- power device
- device module
- improved power
- improved
- module
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US26586881A | 1981-05-21 | 1981-05-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
MX152005A true MX152005A (es) | 1985-05-23 |
Family
ID=23012192
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX19279682A MX152005A (es) | 1981-05-21 | 1982-05-20 | Modulo mejorado de dispositivo de potencia |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0065686A3 (es) |
JP (1) | JPS57202765A (es) |
MX (1) | MX152005A (es) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3444699A1 (de) * | 1984-12-07 | 1986-06-19 | Telefunken electronic GmbH, 7100 Heilbronn | Elektrisches leistungsbauteil |
JPS629649A (ja) * | 1985-07-08 | 1987-01-17 | Nec Corp | 半導体用パツケ−ジ |
CN87107692A (zh) * | 1986-11-13 | 1988-05-25 | Mt化学公司 | 半导体器件的制造方法 |
CA1307355C (en) * | 1988-05-26 | 1992-09-08 | David C. Degree | Soft-faced semiconductor component backing |
EP0376365B1 (en) * | 1988-12-01 | 1995-08-09 | Akzo Nobel N.V. | Semiconductor module |
US5212625A (en) * | 1988-12-01 | 1993-05-18 | Akzo Nv | Semiconductor module having projecting cooling fin groups |
GB2229041A (en) * | 1989-01-31 | 1990-09-12 | Electrolube Limited | Electrical circuit heat sink |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS476832U (es) * | 1971-02-17 | 1972-09-25 | ||
JPS4727891U (es) * | 1971-04-14 | 1972-11-29 | ||
US4029628A (en) * | 1974-05-22 | 1977-06-14 | The United States Of America As Represented By The Secretary Of The Navy | Bonding material for planar electronic device |
US4117508A (en) * | 1977-03-21 | 1978-09-26 | General Electric Company | Pressurizable semiconductor pellet assembly |
DE2827523A1 (de) * | 1978-06-23 | 1980-01-03 | Schroff & Co Messtechnik | Kuehleinrichtung fuer halbleiter |
EP0015053A1 (en) * | 1979-01-27 | 1980-09-03 | LUCAS INDUSTRIES public limited company | A method of manufacturing a semi-conductor power device assembly and an assembly thereby produced |
-
1982
- 1982-05-08 EP EP82104013A patent/EP0065686A3/en not_active Withdrawn
- 1982-05-20 MX MX19279682A patent/MX152005A/es unknown
- 1982-05-20 JP JP8413982A patent/JPS57202765A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0065686A3 (en) | 1984-10-10 |
JPS57202765A (en) | 1982-12-11 |
EP0065686A2 (en) | 1982-12-01 |
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