BR8000181A - Conector eletrico e processo de sua fabricacao - Google Patents

Conector eletrico e processo de sua fabricacao

Info

Publication number
BR8000181A
BR8000181A BR8000181A BR8000181A BR8000181A BR 8000181 A BR8000181 A BR 8000181A BR 8000181 A BR8000181 A BR 8000181A BR 8000181 A BR8000181 A BR 8000181A BR 8000181 A BR8000181 A BR 8000181A
Authority
BR
Brazil
Prior art keywords
manufacturing process
electrical connector
connector
electrical
manufacturing
Prior art date
Application number
BR8000181A
Other languages
English (en)
Inventor
R Zimmerman
W Scheingold
G Cherian
Original Assignee
Amp Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US05/935,042 priority Critical patent/US4199209A/en
Priority to EP79302834A priority patent/EP0030574A1/en
Priority to AU53874/79A priority patent/AU5387479A/en
Priority to CA342,293A priority patent/CA1104683A/en
Application filed by Amp Inc filed Critical Amp Inc
Priority to BR8000181A priority patent/BR8000181A/pt
Publication of BR8000181A publication Critical patent/BR8000181A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2428—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using meander springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
BR8000181A 1978-08-18 1980-01-11 Conector eletrico e processo de sua fabricacao BR8000181A (pt)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US05/935,042 US4199209A (en) 1978-08-18 1978-08-18 Electrical interconnecting device
EP79302834A EP0030574A1 (en) 1978-08-18 1979-12-10 Electrical connector and method of manufacture
AU53874/79A AU5387479A (en) 1978-08-18 1979-12-14 Electrical connector for circuit boards
CA342,293A CA1104683A (en) 1978-08-18 1979-12-19 Electrical connector and method of manufacture
BR8000181A BR8000181A (pt) 1978-08-18 1980-01-11 Conector eletrico e processo de sua fabricacao

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US05/935,042 US4199209A (en) 1978-08-18 1978-08-18 Electrical interconnecting device
EP79302834A EP0030574A1 (en) 1978-08-18 1979-12-10 Electrical connector and method of manufacture
AU53874/79A AU5387479A (en) 1978-08-18 1979-12-14 Electrical connector for circuit boards
CA342,293A CA1104683A (en) 1978-08-18 1979-12-19 Electrical connector and method of manufacture
BR8000181A BR8000181A (pt) 1978-08-18 1980-01-11 Conector eletrico e processo de sua fabricacao

Publications (1)

Publication Number Publication Date
BR8000181A true BR8000181A (pt) 1981-07-14

Family

ID=27507038

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8000181A BR8000181A (pt) 1978-08-18 1980-01-11 Conector eletrico e processo de sua fabricacao

Country Status (5)

Country Link
US (1) US4199209A (pt)
EP (1) EP0030574A1 (pt)
AU (1) AU5387479A (pt)
BR (1) BR8000181A (pt)
CA (1) CA1104683A (pt)

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JP3440828B2 (ja) * 1998-06-15 2003-08-25 住友電装株式会社 端子金具の製造方法
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US6672875B1 (en) * 1998-12-02 2004-01-06 Formfactor, Inc. Spring interconnect structures
US6434817B1 (en) 1999-12-03 2002-08-20 Delphi Technologies, Inc. Method for joining an integrated circuit
DE10001117A1 (de) * 2000-01-13 2001-07-26 Infineon Technologies Ag Testvorrichtung für ein Halbleiterbauelement
US7254889B1 (en) * 2000-09-08 2007-08-14 Gabe Cherian Interconnection devices
DE20019641U1 (de) * 2000-11-18 2001-04-05 Amrhein, Herbert, 74321 Bietigheim-Bissingen Kontaktiereinrichtung zum Herstellen einer elektrischen leitfähigen Verbindung
JP3942823B2 (ja) * 2000-12-28 2007-07-11 山一電機株式会社 検査装置
JP2002231401A (ja) * 2001-01-31 2002-08-16 Molex Inc ソケットコネクタ
US6827586B2 (en) * 2002-01-30 2004-12-07 Molex Incorporated Low-profile connector for circuit boards
WO2004003575A2 (de) * 2002-07-01 2004-01-08 Infineon Technologies Ag Testvorrichtung für bauteile integrierter schaltungen
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JP4651965B2 (ja) * 2003-06-09 2011-03-16 株式会社リコー 電源収納室及び当該電源収納室を有する装置
US6994565B2 (en) * 2003-07-14 2006-02-07 Fci Americas Technology, Inc. Electrical contact assembly with insulative carrier, stapled contact attachment and fusible element
US7419407B1 (en) * 2006-04-17 2008-09-02 Seagate Technology Llc Electrical connector with stacked contacts
JP4522975B2 (ja) * 2006-06-19 2010-08-11 東京エレクトロン株式会社 プローブカード
US7527532B2 (en) * 2007-05-15 2009-05-05 Fci Americas Technology, Inc. Battery contact
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US7556503B2 (en) * 2007-10-29 2009-07-07 Ardent Concepts, Inc. Compliant electrical contact and assembly
JP4859820B2 (ja) * 2007-12-05 2012-01-25 東京エレクトロン株式会社 プローブ
US7775804B2 (en) 2008-04-15 2010-08-17 Amphenol Corporation Interposer assembly with flat contacts
JP5612566B2 (ja) * 2008-05-01 2014-10-22 スリーエム イノベイティブ プロパティズ カンパニー 医用センサシステム
CN102067385B (zh) * 2008-05-01 2014-03-26 3M创新有限公司 可拉伸传导连接器
US8324919B2 (en) * 2009-03-27 2012-12-04 Delaware Capital Formation, Inc. Scrub inducing compliant electrical contact
US8735734B2 (en) * 2009-07-23 2014-05-27 Lexmark International, Inc. Z-directed delay line components for printed circuit boards
US8198547B2 (en) 2009-07-23 2012-06-12 Lexmark International, Inc. Z-directed pass-through components for printed circuit boards
EP2646839B1 (en) 2010-12-03 2017-08-16 Ardent Concepts, Inc. Compliant electrical contact and assembly
JP2012186087A (ja) * 2011-03-07 2012-09-27 Fujitsu Component Ltd コネクタ
US9078374B2 (en) 2011-08-31 2015-07-07 Lexmark International, Inc. Screening process for manufacturing a Z-directed component for a printed circuit board
US8658245B2 (en) 2011-08-31 2014-02-25 Lexmark International, Inc. Spin coat process for manufacturing a Z-directed component for a printed circuit board
US9009954B2 (en) 2011-08-31 2015-04-21 Lexmark International, Inc. Process for manufacturing a Z-directed component for a printed circuit board using a sacrificial constraining material
US8752280B2 (en) 2011-09-30 2014-06-17 Lexmark International, Inc. Extrusion process for manufacturing a Z-directed component for a printed circuit board
US8790520B2 (en) 2011-08-31 2014-07-29 Lexmark International, Inc. Die press process for manufacturing a Z-directed component for a printed circuit board
US8943684B2 (en) * 2011-08-31 2015-02-03 Lexmark International, Inc. Continuous extrusion process for manufacturing a Z-directed component for a printed circuit board
US8830692B2 (en) 2012-03-29 2014-09-09 Lexmark International, Inc. Ball grid array systems for surface mounting an integrated circuit using a Z-directed printed circuit board component
US8822838B2 (en) 2012-03-29 2014-09-02 Lexmark International, Inc. Z-directed printed circuit board components having conductive channels for reducing radiated emissions
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CN108258485A (zh) * 2017-12-29 2018-07-06 番禺得意精密电子工业有限公司 电连接器
CN110098507B (zh) * 2019-04-12 2020-09-25 番禺得意精密电子工业有限公司 电连接器
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JPWO2021261285A1 (pt) * 2020-06-22 2021-12-30
CN113948897B (zh) * 2021-09-10 2023-07-21 番禺得意精密电子工业有限公司 电连接器

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Also Published As

Publication number Publication date
US4199209A (en) 1980-04-22
EP0030574A1 (en) 1981-06-24
AU5387479A (en) 1981-06-18
CA1104683A (en) 1981-07-07

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Legal Events

Date Code Title Description
B15K Others concerning applications: alteration of classification

Ipc: H01R 12/04 (2010.01), H01R 31/00 (2010.01)

B15K Others concerning applications: alteration of classification

Ipc: H01R 12/71 (2011.01), H01R 13/24 (2006.0