BR112018068846A2 - sistema de distribuição de energia elétrica, cartão de distribuição de energia associado a um sistema de distribuição de energia e sistema elétrico associado a uma aeronave - Google Patents

sistema de distribuição de energia elétrica, cartão de distribuição de energia associado a um sistema de distribuição de energia e sistema elétrico associado a uma aeronave

Info

Publication number
BR112018068846A2
BR112018068846A2 BR112018068846A BR112018068846A BR112018068846A2 BR 112018068846 A2 BR112018068846 A2 BR 112018068846A2 BR 112018068846 A BR112018068846 A BR 112018068846A BR 112018068846 A BR112018068846 A BR 112018068846A BR 112018068846 A2 BR112018068846 A2 BR 112018068846A2
Authority
BR
Brazil
Prior art keywords
electrical distribution
electrical
distribution system
power distribution
aircraft
Prior art date
Application number
BR112018068846A
Other languages
English (en)
Inventor
Alan Elliott David
Original Assignee
Ge Aviat Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ge Aviat Systems Ltd filed Critical Ge Aviat Systems Ltd
Publication of BR112018068846A2 publication Critical patent/BR112018068846A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/56—Cooling; Ventilation
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/015—Boards, panels, desks; Parts thereof or accessories therefor
    • H02B1/04—Mounting thereon of switches or of other devices in general, the switch or device having, or being without, casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1432—Housings specially adapted for power drive units or power converters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1457—Power distribution arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
    • B64D2221/00—Electric power distribution systems onboard aircraft
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/064—Fluid cooling, e.g. by integral pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Inverter Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Power Conversion In General (AREA)
  • Supply And Distribution Of Alternating Current (AREA)

Abstract

trata-se de um sistema de distribuição de energia elétrica. o sistema de distribuição de energia elétrica inclui um ou mais cartões de distribuição de energia (200) que compreendem uma primeira porção (202) e uma segunda porção (204). o sistema de distribuição de energia elétrica inclui adicionalmente um ou mais componentes de comutação de energia acoplados à primeira porção de um dentre os um ou mais cartões de distribuição de energia. o sistema de distribuição de energia elétrica inclui adicionalmente um ou mais dispositivos de controle (206) configurados para controlar a operação de pelo menos um dentre os um ou mais componentes de comutação de energia. cada dispositivo de controle é acoplado à segunda porção de um dentre os um ou mais cartões de distribuição de energia. a primeira porção de cada cartão de distribuição de energia é separada da segunda porção, de modo que, durante a operação do cartão de distribuição de energia, os dispositivos de controle operem em uma temperatura média menor que os componentes de comutação de energia.
BR112018068846A 2016-04-06 2017-04-04 sistema de distribuição de energia elétrica, cartão de distribuição de energia associado a um sistema de distribuição de energia e sistema elétrico associado a uma aeronave BR112018068846A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1605876.0A GB2549128B (en) 2016-04-06 2016-04-06 Power control system with improved thermal performance
PCT/EP2017/058014 WO2017174594A1 (en) 2016-04-06 2017-04-04 Power control system with improved thermal performance

Publications (1)

Publication Number Publication Date
BR112018068846A2 true BR112018068846A2 (pt) 2019-01-22

Family

ID=58489017

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112018068846A BR112018068846A2 (pt) 2016-04-06 2017-04-04 sistema de distribuição de energia elétrica, cartão de distribuição de energia associado a um sistema de distribuição de energia e sistema elétrico associado a uma aeronave

Country Status (8)

Country Link
US (1) US10637216B2 (pt)
EP (1) EP3440900A1 (pt)
JP (1) JP2019514320A (pt)
CN (1) CN108886867A (pt)
BR (1) BR112018068846A2 (pt)
CA (1) CA3019247A1 (pt)
GB (1) GB2549128B (pt)
WO (1) WO2017174594A1 (pt)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10873544B2 (en) * 2017-09-14 2020-12-22 Facebook, Inc. Switching using a power bar pass-through card

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3952231A (en) * 1974-09-06 1976-04-20 International Business Machines Corporation Functional package for complex electronic systems with polymer-metal laminates and thermal transposer
US4626954A (en) 1984-09-06 1986-12-02 Eaton Corporation Solid state power controller with overload protection
DE8803371U1 (de) * 1988-03-12 1988-05-19 Frankl & Kirchner GmbH & Co KG Fabrik für Elektromotoren u. elektrische Apparate, 68723 Schwetzingen Steuerungsvorrichtung für eine Industrienähmaschine
JPH04109588U (ja) * 1991-03-08 1992-09-22 富士重工業株式会社 車輌用電子制御ユニツト
US5339217A (en) * 1993-04-20 1994-08-16 Lambda Electronics, Inc. Composite printed circuit board and manufacturing method thereof
JP2912526B2 (ja) * 1993-07-05 1999-06-28 三菱電機株式会社 半導体パワーモジュールおよび複合基板
JP3157362B2 (ja) * 1993-09-03 2001-04-16 株式会社東芝 半導体装置
US5610493A (en) * 1995-04-12 1997-03-11 Allen-Bradley Company, Inc. Terminal configuration for a motor controller
US5748451A (en) * 1996-08-14 1998-05-05 International Business Machines Corporation Power distribution/stiffener for active back plane technologies
JP2003501812A (ja) * 1999-05-31 2003-01-14 ティーワイシーオー エレクトロニクス ロジスティック エイジー インテリジェント型のパワーモジュール
JP2001111266A (ja) * 1999-10-05 2001-04-20 Denso Corp 電子制御装置
ES2169687B2 (es) * 1999-09-30 2004-10-16 Denso Corporation Unidad electronica de control con elemento de activacion y elemento de tratamiento de control.
US7007179B2 (en) * 2001-02-08 2006-02-28 Honeywell International Inc. Electric load management center
JP2002330526A (ja) * 2001-04-27 2002-11-15 Yazaki Corp 電気接続箱
DE10214953A1 (de) * 2002-04-04 2003-10-30 Infineon Technologies Ag Leistungsmodul mit mindestens zwei Substraten und Verfahren zu seiner Herstellung
DE10239512A1 (de) * 2002-08-28 2004-03-11 Minebea Co. Ltd., A Japanese Corporation Anordnung zur Unterbringung der Leistungs- und Steuerelektronik eines Elektromotors
JP2004342325A (ja) * 2003-05-12 2004-12-02 Matsushita Electric Works Ltd 放電灯点灯装置
US6849943B2 (en) * 2003-06-06 2005-02-01 Electronic Theatre Controls, Inc. Power module package for high frequency switching system
US8068346B2 (en) * 2004-05-04 2011-11-29 Hamilton Sundstrand Corporation Circuit board with high density power semiconductors
US7710697B2 (en) * 2004-10-22 2010-05-04 Honeywell International Inc. Hybrid system for electronically resetable circuit protection
US7336490B2 (en) * 2004-11-24 2008-02-26 Hewlett-Packard Development Company, L.P. Multi-chip module with power system
DE102005039165B4 (de) * 2005-08-17 2010-12-02 Infineon Technologies Ag Draht- und streifengebondetes Halbleiterleistungsbauteil und Verfahren zu dessen Herstellung
US8154874B2 (en) * 2006-06-21 2012-04-10 International Rectifier Corporation Use of flexible circuits in a power module for forming connections to power devices
US20080112133A1 (en) * 2006-11-10 2008-05-15 Sun Microsystems, Inc. Switch chassis
TWI339480B (en) * 2006-11-14 2011-03-21 Delta Electronics Inc Separate type converter having relatively better effectiveness
JP4885693B2 (ja) * 2006-12-05 2012-02-29 株式会社オートネットワーク技術研究所 電気接続箱
US7561430B2 (en) * 2007-04-30 2009-07-14 Watlow Electric Manufacturing Company Heat management system for a power switching device
JP2009130991A (ja) * 2007-11-21 2009-06-11 Sumitomo Wiring Syst Ltd 車両用電気接続箱
GB0723213D0 (en) * 2007-11-27 2008-01-09 Yazaki Europe Ltd Junction box
FR2940589B1 (fr) * 2008-12-24 2011-01-14 Sagem Defense Securite Carte electrique modulaire pour composants de puissance.
AT12319U1 (de) * 2009-07-10 2012-03-15 Austria Tech & System Tech Verfahren zum herstellen einer aus wenigstens zwei leiterplattenbereichen bestehenden leiterplatte sowie leiterplatte
WO2012032656A1 (ja) * 2010-09-10 2012-03-15 三菱電機株式会社 電力変換装置
AT12738U1 (de) * 2010-10-13 2012-10-15 Austria Tech & System Tech Verfahren und system zum bereitstellen eines insbesondere eine mehrzahl von leiterplattenelementen enthaltenden plattenförmigen gegenstands
DE102011111488A1 (de) * 2011-08-30 2013-02-28 Schoeller-Electronics Gmbh Leiterplattensystem
US9136624B1 (en) * 2013-03-28 2015-09-15 Juniper Networks, Inc. Orthogonal cross-connecting of printed circuit boards without a midplane board
CN104753338B (zh) * 2013-12-25 2018-03-23 台达电子企业管理（上海）有限公司 电力电子电路与功率模块
US20160149380A1 (en) * 2014-11-20 2016-05-26 Hamilton Sundstrand Corporation Power control assembly with vertically mounted power devices

Also Published As

Publication number Publication date
US20190058311A1 (en) 2019-02-21
GB2549128A (en) 2017-10-11
JP2019514320A (ja) 2019-05-30
GB2549128B (en) 2019-06-12
EP3440900A1 (en) 2019-02-13
US10637216B2 (en) 2020-04-28
CA3019247A1 (en) 2017-10-12
CN108886867A (zh) 2018-11-23
WO2017174594A1 (en) 2017-10-12

Similar Documents

Publication Publication Date Title
BR112017018626A2 (pt) aquecedor estendido e conjunto de aquecimento para sistema gerador de aerossol
BR112019001744A2 (pt) método para gerar aerossol e dispositivo
BR112016008559A8 (pt) aparelho, material fumável, sistema e método de uso do aparelho
BR112018002040A2 (pt) controle de uma nuvem de dispositivo
BR112016004452A8 (pt) método e dispositivo de computação hospedeiro para gerenciamento de energia de dispositivo acessório
BR112018001050A2 (pt) dispositivo eletrônico portátil, sistema, método, módulo de ativação-detecção, meio não transitório e armadilhas para monitoramento de controle de pragas e roedores
BR112016019211A2 (pt) método de diagnóstico de uma falha em uma unidade de ar-condicionado de uma aeronave
BR112018010601A2 (pt) operação de veículo hospedeiro usando predição de intenção de veículos remotos
BR112017011763A2 (pt) dispositivos de controle e de comunicação por rádio, e, método de controle de comunicação.
BR112016025936A8 (pt) método implementado por um dispositivo de computação hospedeiro, dispositivo de computação hospedeiro e dispositivo acessório
BR112017010916A2 (pt) célula de combustível autônoma para aviões
BR112016023619A8 (pt) técnicas para otimização de potência com base em parâmetros de rede
BR112017028567A2 (pt) métodos e sistemas para a instalação de uma versão de aplicativo através de comunicações de curto alcance
BR112017004100A2 (pt) apresentação de ambiente de computação em múltiplos dispositivos
BR112016002181A2 (pt) controle de um modo de acesso atual de um dispositivo de computação com base em um estado de um mecanismo de fixação
BR102016014797A8 (pt) dispositivo de iluminação de guinchos de aeronaves de asa rotativa, guincho de aeronave de asas rotativas, aeronaves de asas rotativas, e, método de operação de um dispositivo de iluminação de guincho de aeronave de asas rotativas
BR112017000731A2 (pt) representações de aplicativo de acesso direto
BR112016028400A2 (pt) potência programável para uma interface de memória
BR112017024998A2 (pt) dispositivo de conversão de potência
BR112015011989A2 (pt) dispositivo de controle de processo configurável com montagem de visor eletrônico
BR112015026650A2 (pt) método para facilitar uma interface e aparelho
BR112016024000A2 (pt) fonte de alimentação de baixa tensão para um sistema de exibição de mercadoria
BR112018068846A2 (pt) sistema de distribuição de energia elétrica, cartão de distribuição de energia associado a um sistema de distribuição de energia e sistema elétrico associado a uma aeronave
BR112016006548A2 (pt) estrutura de apoio para uma eletronica de potência
BR112015029221A2 (pt) suporte aperfeiçoado para diversos tipos de artigos

Legal Events

Date Code Title Description
B350 Update of information on the portal [chapter 15.35 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 5A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2664 DE 25-01-2022 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.