BR112018010979A2 - dispositivo de medição de vão e método de medição de vão - Google Patents

dispositivo de medição de vão e método de medição de vão

Info

Publication number
BR112018010979A2
BR112018010979A2 BR112018010979-7A BR112018010979A BR112018010979A2 BR 112018010979 A2 BR112018010979 A2 BR 112018010979A2 BR 112018010979 A BR112018010979 A BR 112018010979A BR 112018010979 A2 BR112018010979 A2 BR 112018010979A2
Authority
BR
Brazil
Prior art keywords
plate
span
thickness
span measurement
upper plate
Prior art date
Application number
BR112018010979-7A
Other languages
English (en)
Japanese (ja)
Portuguese (pt)
Inventor
Sasano Yuichi
Yoshitomi Kei
Goto Takuya
Kubota Takahiro
Original Assignee
Mitsubishi Heavy Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries, Ltd. filed Critical Mitsubishi Heavy Industries, Ltd.
Publication of BR112018010979A2 publication Critical patent/BR112018010979A2/pt

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/16Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring distance of clearance between spaced objects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/026Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/14Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B17/00Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations
    • G01B17/02Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/14Measuring arrangements characterised by the use of electric or magnetic techniques for measuring distance or clearance between spaced objects or spaced apertures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/06Systems determining position data of a target
    • G01S17/08Systems determining position data of a target for measuring distance only
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608Height gauges

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
BR112018010979-7A 2016-01-20 2016-11-24 dispositivo de medição de vão e método de medição de vão BR112018010979A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016009096A JP6723634B2 (ja) 2016-01-20 2016-01-20 隙間計測装置及び隙間計測方法
JP2016-009096 2016-01-20
PCT/JP2016/084834 WO2017126218A1 (ja) 2016-01-20 2016-11-24 隙間計測装置及び隙間計測方法

Publications (1)

Publication Number Publication Date
BR112018010979A2 true BR112018010979A2 (pt) 2018-12-04

Family

ID=59361586

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112018010979-7A BR112018010979A2 (pt) 2016-01-20 2016-11-24 dispositivo de medição de vão e método de medição de vão

Country Status (9)

Country Link
US (1) US11054253B2 (https=)
EP (1) EP3370035B1 (https=)
JP (1) JP6723634B2 (https=)
KR (1) KR102045696B1 (https=)
CN (1) CN108369093A (https=)
BR (1) BR112018010979A2 (https=)
CA (1) CA3006543C (https=)
ES (1) ES2765744T3 (https=)
WO (1) WO2017126218A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2951937T3 (es) * 2019-03-13 2023-10-25 Becker Marine Systems Gmbh Remo para embarcaciones con un dispositivo de medición de la holgura de cojinete, procedimiento de medición de la holgura de cojinete en un remo y dispositivo de medición de la holgura de cojinete para un remo
JP7283228B2 (ja) * 2019-05-27 2023-05-30 コニカミノルタ株式会社 測定装置、画像形成装置、および、測定方法
CN110631495B (zh) * 2019-10-25 2024-05-14 宁波中车时代传感技术有限公司 磁电式速度传感器曲面间隙检测方法
CN111690802B (zh) * 2020-06-17 2021-11-09 广西先进铝加工创新中心有限责任公司 一种辊底式热处理炉炉辊的安装调试方法
US12266579B2 (en) * 2021-08-30 2025-04-01 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for adjusting the gap between a wafer and a top plate in a thin-film deposition process
CN114179322B (zh) * 2021-12-08 2024-07-02 苏州博众智能机器人有限公司 一种模具间隙检测设备

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US4165178A (en) * 1978-06-29 1979-08-21 International Business Machines Corporation Gap measurement tool
JPS5784306A (en) * 1980-11-14 1982-05-26 Toshiba Corp Method for providing gap
JPS6367908U (https=) * 1986-10-23 1988-05-07
GB2206690B (en) * 1987-06-30 1991-12-11 Matsushita Electric Works Ltd Optically scanning displacement sensor
JPS6474405A (en) * 1987-09-16 1989-03-20 Toyota Motor Corp Method for measuring work gap at the time of arc welding
US5113358A (en) * 1990-03-28 1992-05-12 Barber-Colman Company Web caliper measuring system
US5250897A (en) * 1992-05-07 1993-10-05 Lsi Logic Corporation Solenoid/slug gap measurement tool for semiconductor equipment and method of measurement
JPH06288713A (ja) 1993-03-31 1994-10-18 Hitachi Ltd ギャップ位置計測方法及び画像処理方法
FR2745905B1 (fr) 1996-03-08 1998-04-24 Lorraine Laminage Appareil de detection acoustique de defauts dans une bande en defilement
JPH09318342A (ja) * 1996-05-31 1997-12-12 Ket Kagaku Kenkyusho:Kk 定圧機構
JP3529744B2 (ja) * 2001-07-05 2004-05-24 日本工業検査株式会社 鋼板厚測定装置
JP2010101656A (ja) * 2008-10-21 2010-05-06 Toyota Motor Corp 膜厚計測方法および膜厚計測装置
DE102010020116A1 (de) * 2010-05-10 2011-11-10 Helmut Fischer GmbH Institut für Elektronik und Messtechnik Verfahren und Vorrichtung zur Messung der Dicke dünner Schichten an großflächigen Messoberflächen
EP3514529B1 (de) * 2010-11-12 2023-03-15 EV Group E. Thallner GmbH Messeinrichtung zur messung von schichtdicken und fehlstellen eines waferstapels
GB2494170A (en) * 2011-09-01 2013-03-06 Sonar Pipeline Inspection Systems Ltd Acoustic pipeline inspection
CN103512904A (zh) * 2012-06-29 2014-01-15 鸿富锦精密工业(深圳)有限公司 工件外观测量装置及其操作方法
DE102014200157A1 (de) * 2013-10-28 2015-05-21 Micro-Epsilon Messtechnik Gmbh & Co. Kg Verfahren zur Dickenmessung an Messobjekten und Vorrichtung zur Anwendung des Verfahrens
CN104525722B (zh) * 2014-12-04 2016-09-14 柳州福臻车体实业有限公司 一种拉延模间隙的测量方法
JP6492228B2 (ja) * 2016-05-19 2019-03-27 三菱日立パワーシステムズ株式会社 計測用治具及び計測装置並びに隙間計測方法

Also Published As

Publication number Publication date
EP3370035A4 (en) 2018-09-05
US20180347973A1 (en) 2018-12-06
CA3006543A1 (en) 2017-07-27
WO2017126218A1 (ja) 2017-07-27
EP3370035A1 (en) 2018-09-05
US11054253B2 (en) 2021-07-06
KR20180074768A (ko) 2018-07-03
KR102045696B1 (ko) 2019-11-15
JP6723634B2 (ja) 2020-07-15
ES2765744T3 (es) 2020-06-10
JP2017129464A (ja) 2017-07-27
CN108369093A (zh) 2018-08-03
EP3370035B1 (en) 2019-10-23
CA3006543C (en) 2020-06-02

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Legal Events

Date Code Title Description
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 5A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 DA RPI 2647 DE 28/09/2021.