BR112015019027A2 - dispositivo de bombardeio de íons e método para utilização do mesmo para limpar superfície de substrato - Google Patents

dispositivo de bombardeio de íons e método para utilização do mesmo para limpar superfície de substrato

Info

Publication number
BR112015019027A2
BR112015019027A2 BR112015019027A BR112015019027A BR112015019027A2 BR 112015019027 A2 BR112015019027 A2 BR 112015019027A2 BR 112015019027 A BR112015019027 A BR 112015019027A BR 112015019027 A BR112015019027 A BR 112015019027A BR 112015019027 A2 BR112015019027 A2 BR 112015019027A2
Authority
BR
Brazil
Prior art keywords
electrode
ion bombardment
bombardment device
vacuum chamber
substrate surface
Prior art date
Application number
BR112015019027A
Other languages
English (en)
Other versions
BR112015019027A8 (pt
Inventor
Nomura Homare
Hirota Satoshi
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Publication of BR112015019027A2 publication Critical patent/BR112015019027A2/pt
Publication of BR112015019027A8 publication Critical patent/BR112015019027A8/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
    • C23C16/0245—Pretreatment of the material to be coated by cleaning or etching by etching with a plasma
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
    • C23C16/486—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation using ion beam radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582—Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4584—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/332—Coating
    • H01J2237/3321—CVD [Chemical Vapor Deposition]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/335—Cleaning

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Physical Vapour Deposition (AREA)
  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

resumo dispositivo de bombardeio de íons e método para utilização do mesmo para limpar superfície de substrato é fornecido um dispositivo de bombardeio de íons (1) para estabilização e limpeza da superfície de um substrato. o dispositivo é fornecido com o seguinte: uma câmara de vácuo (2); pelo menos um eletrodo (3) que é disposto sobre a face da parede interior da câmara de vácuo (2) e emite elétrons; uma pluralidade de anodos (4) que recebem os elétrons a partir do eletrodo (3) e que são dispostos de modo a enfrentar o eletrodo com o substrato ensanduichado entre os mesmos; e uma pluralidade de fontes de potência de descarga (5) correspondentes aos anodos (4), respectivamente. cada uma das fontes de potência de descarga (5) é isolada a partir da câmara de vácuo (2) e fornece para o anodo (4) correspondente à fonte de potência de descarga relevante (5) correntes e tensões que podem ser ajustadas independentemente umas das outras, gerando assim uma descarga luminescente entre tal anodo (4) e o eletrodo (3).
BR112015019027A 2013-02-07 2014-01-09 dispositivo de bombardeio de íons e método para utilização do mesmo para limpar superfície de substrato BR112015019027A8 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013022264A JP6076112B2 (ja) 2013-02-07 2013-02-07 イオンボンバードメント装置及びこの装置を用いた基材の表面のクリーニング方法
PCT/JP2014/000047 WO2014122876A1 (ja) 2013-02-07 2014-01-09 イオンボンバードメント装置及びこの装置を用いた基材の表面のクリーニング方法

Publications (2)

Publication Number Publication Date
BR112015019027A2 true BR112015019027A2 (pt) 2017-07-18
BR112015019027A8 BR112015019027A8 (pt) 2019-11-12

Family

ID=51299478

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112015019027A BR112015019027A8 (pt) 2013-02-07 2014-01-09 dispositivo de bombardeio de íons e método para utilização do mesmo para limpar superfície de substrato

Country Status (12)

Country Link
US (1) US20150299847A1 (pt)
EP (1) EP2955244A4 (pt)
JP (1) JP6076112B2 (pt)
KR (2) KR20170045397A (pt)
CN (1) CN104968826B (pt)
BR (1) BR112015019027A8 (pt)
CA (1) CA2893118C (pt)
IL (1) IL239072B (pt)
MX (1) MX368879B (pt)
RU (1) RU2015137774A (pt)
TW (1) TWI489513B (pt)
WO (1) WO2014122876A1 (pt)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108699690B (zh) * 2015-11-05 2021-07-09 布勒阿尔策瑙有限责任公司 用于真空涂覆的装置和方法
JP6476261B1 (ja) * 2017-10-17 2019-02-27 株式会社神戸製鋼所 成膜方法
CN108054079A (zh) * 2017-11-29 2018-05-18 上海华力微电子有限公司 焊盘结晶缺陷的去除方法
KR102336559B1 (ko) * 2019-11-26 2021-12-08 세메스 주식회사 부품 표면 처리 방법 및 부품 처리 장치
CN111029278B (zh) * 2019-12-10 2021-06-29 长江存储科技有限责任公司 一种晶圆片的加工方法和系统
US20220162737A1 (en) * 2020-11-25 2022-05-26 Oem Group, Llc Systems and methods for in-situ etching prior to physical vapor deposition in the same chamber
CN115354298A (zh) * 2022-07-05 2022-11-18 湖南红太阳光电科技有限公司 一种pecvd设备石墨舟清洗系统
CN115637418A (zh) * 2022-10-12 2023-01-24 中微半导体设备(上海)股份有限公司 形成涂层的方法、涂覆装置、零部件及等离子体反应装置

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JP5689051B2 (ja) * 2011-11-25 2015-03-25 株式会社神戸製鋼所 イオンボンバードメント装置

Also Published As

Publication number Publication date
EP2955244A1 (en) 2015-12-16
CN104968826B (zh) 2017-06-09
BR112015019027A8 (pt) 2019-11-12
MX2015008261A (es) 2015-09-29
EP2955244A4 (en) 2016-10-05
TWI489513B (zh) 2015-06-21
JP2014152356A (ja) 2014-08-25
CA2893118C (en) 2019-02-12
CN104968826A (zh) 2015-10-07
MX368879B (es) 2019-10-21
US20150299847A1 (en) 2015-10-22
KR20170045397A (ko) 2017-04-26
RU2015137774A (ru) 2017-03-13
KR101935090B1 (ko) 2019-01-03
IL239072B (en) 2019-05-30
TW201438053A (zh) 2014-10-01
IL239072A0 (en) 2015-07-30
CA2893118A1 (en) 2014-08-14
WO2014122876A1 (ja) 2014-08-14
JP6076112B2 (ja) 2017-02-08
KR20150104149A (ko) 2015-09-14

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements