BR112013019766A2 - estrutura de eletrodos para arranjos de nanoestrutura e métodos para os mesmos - Google Patents

estrutura de eletrodos para arranjos de nanoestrutura e métodos para os mesmos

Info

Publication number
BR112013019766A2
BR112013019766A2 BR112013019766A BR112013019766A BR112013019766A2 BR 112013019766 A2 BR112013019766 A2 BR 112013019766A2 BR 112013019766 A BR112013019766 A BR 112013019766A BR 112013019766 A BR112013019766 A BR 112013019766A BR 112013019766 A2 BR112013019766 A2 BR 112013019766A2
Authority
BR
Brazil
Prior art keywords
contact layer
nanowires
methods
electrode structure
nanostructure arrays
Prior art date
Application number
BR112013019766A
Other languages
English (en)
Portuguese (pt)
Inventor
Lorimer Adam
Wacker Barbara
Matus Gabriel
Tynes Kardel Justin
A Karri Madhav
L Scullin Matthew
Muckenhirn Sylvain
Original Assignee
Alphabet Energy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/331,768 external-priority patent/US20120152295A1/en
Application filed by Alphabet Energy Inc filed Critical Alphabet Energy Inc
Publication of BR112013019766A2 publication Critical patent/BR112013019766A2/pt

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/85Thermoelectric active materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117Shapes of semiconductor bodies
    • H10D62/118Nanostructure semiconductor bodies
    • H10D62/119Nanowire, nanosheet or nanotube semiconductor bodies
    • H10D62/122Nanowire, nanosheet or nanotube semiconductor bodies oriented at angles to substrates, e.g. perpendicular to substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/213Channel regions of field-effect devices
    • H10D62/221Channel regions of field-effect devices of FETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/81Structural details of the junction
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/85Thermoelectric active materials
    • H10N10/851Thermoelectric active materials comprising inorganic compositions
    • H10N10/855Thermoelectric active materials comprising inorganic compositions comprising compounds containing boron, carbon, oxygen or nitrogen
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/85Thermoelectric active materials
    • H10N10/851Thermoelectric active materials comprising inorganic compositions
    • H10N10/8556Thermoelectric active materials comprising inorganic compositions comprising compounds containing germanium or silicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80Constructional details
    • H10N10/85Thermoelectric active materials
    • H10N10/857Thermoelectric active materials comprising compositions changing continuously or discontinuously inside the material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
BR112013019766A 2011-02-02 2012-02-01 estrutura de eletrodos para arranjos de nanoestrutura e métodos para os mesmos BR112013019766A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161438709P 2011-02-02 2011-02-02
US13/331,768 US20120152295A1 (en) 2010-12-21 2011-12-20 Arrays of filled nanostructures with protruding segments and methods thereof
PCT/US2012/023425 WO2012161757A1 (en) 2011-02-02 2012-02-01 Electrode structures for arrays of nanostructures and methods thereof

Publications (1)

Publication Number Publication Date
BR112013019766A2 true BR112013019766A2 (pt) 2019-09-24

Family

ID=47217566

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112013019766A BR112013019766A2 (pt) 2011-02-02 2012-02-01 estrutura de eletrodos para arranjos de nanoestrutura e métodos para os mesmos

Country Status (7)

Country Link
EP (1) EP2671255A4 (enExample)
JP (1) JP2014510396A (enExample)
KR (1) KR20140012073A (enExample)
CN (1) CN103460387A (enExample)
BR (1) BR112013019766A2 (enExample)
CA (1) CA2825888A1 (enExample)
WO (1) WO2012161757A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104205382A (zh) 2012-01-25 2014-12-10 阿尔法贝特能源公司 用于热回收系统的模块化热电单元及其方法
US9257627B2 (en) 2012-07-23 2016-02-09 Alphabet Energy, Inc. Method and structure for thermoelectric unicouple assembly
US9065017B2 (en) 2013-09-01 2015-06-23 Alphabet Energy, Inc. Thermoelectric devices having reduced thermal stress and contact resistance, and methods of forming and using the same
CN103579484A (zh) * 2013-11-05 2014-02-12 姚芸 一种温差发电器用金属导体电极
TWI570972B (zh) * 2016-01-20 2017-02-11 財團法人工業技術研究院 熱電轉換裝置以及熱電轉換器
JP6830587B2 (ja) * 2016-04-11 2021-02-17 学校法人東京理科大学 導電膜付き柱状インゴット基板及びその製造方法、シリサイド系熱電変換素子及びその製造方法、熱電変換モジュール、並びにシリサイド系熱電変換素子の電極層形成用組成物
WO2019003582A1 (ja) * 2017-06-27 2019-01-03 株式会社村田製作所 熱電変換モジュールおよび電子部品モジュール
WO2019003581A1 (ja) * 2017-06-27 2019-01-03 株式会社村田製作所 熱電変換モジュールおよび電子部品モジュール
KR102265762B1 (ko) * 2019-11-27 2021-06-15 한국세라믹기술원 적외선 차단 투명전극 점착제 및 이를 이용한 스마트 윈도우

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3600486B2 (ja) * 1999-08-24 2004-12-15 セイコーインスツル株式会社 熱電変換素子の製造方法
JP2004532133A (ja) * 2001-03-30 2004-10-21 ザ・リージェンツ・オブ・ザ・ユニバーシティ・オブ・カリフォルニア ナノ構造及びナノワイヤーの組立方法並びにそれらから組立てられた装置
US8154093B2 (en) * 2002-01-16 2012-04-10 Nanomix, Inc. Nano-electronic sensors for chemical and biological analytes, including capacitance and bio-membrane devices
JP2004031696A (ja) * 2002-06-26 2004-01-29 Kyocera Corp 熱電モジュール及びその製造方法
US20050060884A1 (en) * 2003-09-19 2005-03-24 Canon Kabushiki Kaisha Fabrication of nanoscale thermoelectric devices
US6969679B2 (en) * 2003-11-25 2005-11-29 Canon Kabushiki Kaisha Fabrication of nanoscale thermoelectric devices
US8039726B2 (en) * 2005-05-26 2011-10-18 General Electric Company Thermal transfer and power generation devices and methods of making the same
WO2008060282A1 (en) * 2006-11-17 2008-05-22 General Electric Company Thermal transfer and power generation devices and methods of making the same
US8049203B2 (en) * 2006-12-22 2011-11-01 Qunano Ab Nanoelectronic structure and method of producing such
US20080178920A1 (en) * 2006-12-28 2008-07-31 Schlumberger Technology Corporation Devices for cooling and power
US7905013B2 (en) * 2007-06-04 2011-03-15 Sharp Laboratories Of America, Inc. Method for forming an iridium oxide (IrOx) nanowire neural sensor array
JP4925964B2 (ja) * 2007-08-06 2012-05-09 株式会社デンソー 積層型熱電変換素子及びその製造方法
FR2923601B1 (fr) * 2007-11-12 2010-01-01 Commissariat Energie Atomique Detecteur de rayonnement electromagnetique a connexion par nanofil et procede de realisation
TWI401830B (zh) * 2008-12-31 2013-07-11 Ind Tech Res Inst 低熱回流之熱電奈米線陣列及其製造方法

Also Published As

Publication number Publication date
WO2012161757A1 (en) 2012-11-29
EP2671255A1 (en) 2013-12-11
CN103460387A (zh) 2013-12-18
EP2671255A4 (en) 2015-10-28
KR20140012073A (ko) 2014-01-29
JP2014510396A (ja) 2014-04-24
CA2825888A1 (en) 2012-11-29

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2543 DE 01-10-2019 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.