BR112012026749A2 - substância fosforescente de emissão de luz vermelha, processo para fabricação da mesma, e aparelho emissor de luz empregando substância fosforescente de emissão de luz vermelha - Google Patents

substância fosforescente de emissão de luz vermelha, processo para fabricação da mesma, e aparelho emissor de luz empregando substância fosforescente de emissão de luz vermelha

Info

Publication number
BR112012026749A2
BR112012026749A2 BR112012026749A BR112012026749A BR112012026749A2 BR 112012026749 A2 BR112012026749 A2 BR 112012026749A2 BR 112012026749 A BR112012026749 A BR 112012026749A BR 112012026749 A BR112012026749 A BR 112012026749A BR 112012026749 A2 BR112012026749 A2 BR 112012026749A2
Authority
BR
Brazil
Prior art keywords
light emitting
red light
substance
emitting substance
phosphorescent red
Prior art date
Application number
BR112012026749A
Other languages
English (en)
Inventor
Hiroshi Fukunaga
Hitoshi Matsushita
Kenji Terashima
Masamichi Harada
Toyonori Uemura
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk filed Critical Sharp Kk
Publication of BR112012026749A2 publication Critical patent/BR112012026749A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/0883—Arsenides; Nitrides; Phosphides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77342—Silicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
    • C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

substância fosforescente de emissão de luz vermelha, processo para fabricação da mesma, e aparelho emissor de luz empregando substância fosforescente de emissão de luz vermelha. a presente invenção refere-se a uma substância fosforescente emissora de luz vermelha de nitreto ativado com európio divalente representada substancialmente por: uma fórmula geral: (mi~1-~xeu~x~)miisin~3~ (1) (na fórmula (1), mi é um elemento de metal alcalinoterroso e representa pelo menos um elemento selecionado do grupo consistindo em mg, ca, sr e ba; mii é um elemento metálico trivalente e representa pelo menos um elemento selecionado do grupo consistindoem al, ga, in, sc, y, la, gd e lu; e x é um número satisfazendo 0,001<243> x <242> 0,10), em que: a condutividade elétrica de um líquido sobrenadante de uma solução contendo 10 partes em massa de água pura, com relação a 1 parte em massa da substância fosforescente emissora de luz vermelha, não é mais do que 10 ms/cm.
BR112012026749A 2010-04-19 2011-04-05 substância fosforescente de emissão de luz vermelha, processo para fabricação da mesma, e aparelho emissor de luz empregando substância fosforescente de emissão de luz vermelha BR112012026749A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010095926A JP2011225696A (ja) 2010-04-19 2010-04-19 赤色系発光蛍光体、その製造方法および赤色系発光蛍光体を用いた発光装置
PCT/JP2011/058597 WO2011132526A1 (ja) 2010-04-19 2011-04-05 赤色系発光蛍光体、その製造方法および赤色系発光蛍光体を用いた発光装置

Publications (1)

Publication Number Publication Date
BR112012026749A2 true BR112012026749A2 (pt) 2016-07-12

Family

ID=44834059

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112012026749A BR112012026749A2 (pt) 2010-04-19 2011-04-05 substância fosforescente de emissão de luz vermelha, processo para fabricação da mesma, e aparelho emissor de luz empregando substância fosforescente de emissão de luz vermelha

Country Status (7)

Country Link
US (1) US20130037846A1 (pt)
EP (1) EP2562230A4 (pt)
JP (1) JP2011225696A (pt)
CN (1) CN102858914A (pt)
BR (1) BR112012026749A2 (pt)
TW (1) TW201300496A (pt)
WO (1) WO2011132526A1 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013106550A (ja) * 2011-11-18 2013-06-06 Sharp Corp 植物育成用照明装置
JP2015083617A (ja) * 2012-02-09 2015-04-30 電気化学工業株式会社 蛍光体及び発光装置
JP2015083618A (ja) * 2012-02-09 2015-04-30 電気化学工業株式会社 蛍光体及び発光装置
JPWO2015002139A1 (ja) * 2013-07-03 2017-02-23 デンカ株式会社 蛍光体及び発光装置
DE102015103326A1 (de) 2015-03-06 2016-09-08 Osram Gmbh Leuchtstoffpartikel mit einer Schutzschicht und Verfahren zur Herstellung der Leuchtstoffpartikel mit der Schutzschicht
CN105441070B (zh) * 2015-10-23 2018-06-01 东台市天源光电科技有限公司 一种背光源用黄色硅酸盐荧光粉及其制造方法
CN106978176B (zh) * 2017-05-18 2019-03-08 济南大学 一种黄色荧光粉及制备方法和其在发光器件中的应用

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4101468B2 (ja) * 2001-04-09 2008-06-18 豊田合成株式会社 発光装置の製造方法
JP4210761B2 (ja) * 2004-03-12 2009-01-21 独立行政法人物質・材料研究機構 蛍光体とその製造方法
JP3921545B2 (ja) 2004-03-12 2007-05-30 独立行政法人物質・材料研究機構 蛍光体とその製造方法
JP4128564B2 (ja) * 2004-04-27 2008-07-30 松下電器産業株式会社 発光装置
JP4674348B2 (ja) 2004-09-22 2011-04-20 独立行政法人物質・材料研究機構 蛍光体とその製造方法および発光器具
JP4832995B2 (ja) * 2005-09-01 2011-12-07 シャープ株式会社 発光装置
JP2007332016A (ja) * 2006-05-19 2007-12-27 Tohoku Univ 複合金属化合物の製造方法
KR101258229B1 (ko) * 2006-06-30 2013-04-25 서울반도체 주식회사 발광 소자
JP2008116849A (ja) * 2006-11-07 2008-05-22 Sony Corp 表示装置
JP4466757B2 (ja) * 2007-04-18 2010-05-26 三菱化学株式会社 蛍光体、蛍光体含有組成物、発光装置、照明装置、画像表示装置、及び窒素含有化合物
JP2009019163A (ja) * 2007-07-13 2009-01-29 Sharp Corp 発光装置用蛍光体粒子集合体、発光装置、および液晶表示用バックライト装置
JP2009126891A (ja) * 2007-11-20 2009-06-11 Mitsubishi Chemicals Corp 酸化物蛍光体及びその製造方法、並びに、蛍光体含有組成物、発光装置、画像表示装置及び照明装置

Also Published As

Publication number Publication date
EP2562230A1 (en) 2013-02-27
JP2011225696A (ja) 2011-11-10
US20130037846A1 (en) 2013-02-14
TW201300496A (zh) 2013-01-01
EP2562230A4 (en) 2014-02-19
CN102858914A (zh) 2013-01-02
WO2011132526A1 (ja) 2011-10-27

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Legal Events

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B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

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B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2384 DE 13-09-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.