BR0215769A - Chapeamento por imersão de prata - Google Patents
Chapeamento por imersão de prataInfo
- Publication number
- BR0215769A BR0215769A BR0215769-1A BR0215769A BR0215769A BR 0215769 A BR0215769 A BR 0215769A BR 0215769 A BR0215769 A BR 0215769A BR 0215769 A BR0215769 A BR 0215769A
- Authority
- BR
- Brazil
- Prior art keywords
- silver
- plating
- metal
- printed circuit
- plate
- Prior art date
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title abstract 5
- 229910052709 silver Inorganic materials 0.000 title abstract 5
- 239000004332 silver Substances 0.000 title abstract 5
- 238000007747 plating Methods 0.000 title abstract 3
- 229910052751 metal Inorganic materials 0.000 abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 238000007598 dipping method Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/14—Removing excess of molten coatings; Controlling or regulating the coating thickness
- C23C2/16—Removing excess of molten coatings; Controlling or regulating the coating thickness using fluids under pressure, e.g. air knives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Electrodes Of Semiconductors (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
"CHAPEAMENTO POR IMERSãO DE PRATA". O problema na formação de camadas soldáveis e aderíveis em placas de circuitos impressos é que as superfícies embarcam, após armazenamento das placas, antes de posterior processamento (montagem dos componentes elétricos), afetando, desse modo, a capacidade de soldagem e a capacidade de aderência. Para superar esse problema, sugere-se depositar, em uma primeira etapa do processo, um primeiro metal, que é mais nobre do que o cobre, na placa de circuito impresso, e chapear prata, em uma segunda etapa do processo, com a condição de que o primeiro metal seja depositado a uma velocidade que é, no máximo, metade da velocidade de chapeamento de prata na segunda etapa do processo, quando o primeiro metal é prata.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP02090262A EP1245697A3 (de) | 2002-07-17 | 2002-07-17 | Verfahren zum aussenstromlosen Abscheiden von Silber |
| PCT/EP2002/009997 WO2004007798A1 (en) | 2002-07-17 | 2002-09-06 | Immersion plating of silver |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR0215769A true BR0215769A (pt) | 2005-03-15 |
Family
ID=8185607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR0215769-1A BR0215769A (pt) | 2002-07-17 | 2002-09-06 | Chapeamento por imersão de prata |
Country Status (13)
| Country | Link |
|---|---|
| US (1) | US7479305B2 (pt) |
| EP (2) | EP1245697A3 (pt) |
| JP (1) | JP4194556B2 (pt) |
| KR (1) | KR20050029220A (pt) |
| CN (1) | CN100564594C (pt) |
| AT (1) | ATE364739T1 (pt) |
| AU (1) | AU2002368066A1 (pt) |
| BR (1) | BR0215769A (pt) |
| CA (1) | CA2484757A1 (pt) |
| DE (1) | DE60220723T2 (pt) |
| ES (1) | ES2287363T3 (pt) |
| MY (1) | MY140935A (pt) |
| WO (1) | WO2004007798A1 (pt) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10226328B3 (de) * | 2002-06-11 | 2004-02-19 | Atotech Deutschland Gmbh | Saure Lösung zur Silberabscheidung und Verfahren zum Abscheiden von Silberschichten auf Metalloberflächen |
| US8349393B2 (en) * | 2004-07-29 | 2013-01-08 | Enthone Inc. | Silver plating in electronics manufacture |
| KR101042483B1 (ko) * | 2005-03-11 | 2011-06-16 | 히다치 가세고교 가부시끼가이샤 | 구리의 표면 처리 방법 및 구리 |
| WO2007033188A2 (en) * | 2005-09-12 | 2007-03-22 | University Of Dayton | Substrate-enhanced electroless deposition (seed) of metal nanoparticles on carbon nanotubes |
| EP2213766A4 (en) * | 2007-10-22 | 2014-01-22 | Nat Inst For Materials Science | AUTOCATALYTIC DEPOSITION METHOD FOR ALLOY COATING FILM AND DEPOSITION FLUID |
| EP2453041B1 (en) * | 2010-11-10 | 2014-02-12 | Atotech Deutschland GmbH | Solution and process for the pre-treatment of copper surfaces using an N-alkoxylated adhesion-promoting compound |
| EP2528089B1 (en) * | 2011-05-23 | 2014-03-05 | Alchimer | Method for forming a vertical electrical connection in a layered semiconductor structure |
| EP2581470B1 (en) * | 2011-10-12 | 2016-09-28 | ATOTECH Deutschland GmbH | Electroless palladium plating bath composition |
| EP2784180B1 (en) * | 2013-03-25 | 2015-12-30 | ATOTECH Deutschland GmbH | Method for activating a copper surface for electroless plating |
| EP3251825A1 (en) | 2016-05-31 | 2017-12-06 | Boegli-Gravures S.A. | Method and device for embossing planar material |
| CN108315725A (zh) * | 2018-01-11 | 2018-07-24 | 广东禾木科技有限公司 | 一种银键合丝表面的杂质的去除方法 |
| JP7285123B2 (ja) * | 2019-04-10 | 2023-06-01 | 上村工業株式会社 | 金めっき方法及びめっき皮膜 |
| CN111778498B (zh) * | 2020-07-02 | 2024-04-26 | 深圳市化讯半导体材料有限公司 | 一种镀膜结构及其制备方法 |
| CN113638019A (zh) * | 2021-08-13 | 2021-11-12 | 安徽师范大学 | 一种电镀厚银的铜基工件及其制作方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB967681A (en) * | 1959-12-31 | 1964-08-26 | Mond Nickel Co Ltd | Improvements relating to the formation of metallic coatings |
| US3917885A (en) * | 1974-04-26 | 1975-11-04 | Engelhard Min & Chem | Electroless gold plating process |
| US4529667A (en) * | 1983-04-06 | 1985-07-16 | The Furukawa Electric Company, Ltd. | Silver-coated electric composite materials |
| JPS60241291A (ja) * | 1984-05-16 | 1985-11-30 | 株式会社東芝 | 印刷配線板の製造方法 |
| US5882802A (en) * | 1988-08-29 | 1999-03-16 | Ostolski; Marian J. | Noble metal coated, seeded bimetallic non-noble metal powders |
| JP2754828B2 (ja) | 1990-02-08 | 1998-05-20 | 松下電器産業株式会社 | プリント配線板の製造方法 |
| JPH06299375A (ja) | 1993-02-18 | 1994-10-25 | Murata:Kk | はんだ、無電解はんだ、銀、ニッケル、亜鉛、銅、銅合金等 の金属の表面処理方法 |
| GB9425031D0 (en) | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Printed circuit board manufacture |
| JP3594724B2 (ja) | 1995-09-29 | 2004-12-02 | 大日本印刷株式会社 | リードフレームの部分貴金属めっき方法 |
| KR100266726B1 (ko) * | 1995-09-29 | 2000-09-15 | 기타지마 요시토시 | 리드프레임과 이 리드프레임을 갖춘 반도체장치 |
| US5733599A (en) * | 1996-03-22 | 1998-03-31 | Macdermid, Incorporated | Method for enhancing the solderability of a surface |
| JP3532046B2 (ja) | 1996-10-25 | 2004-05-31 | 株式会社大和化成研究所 | 非シアン置換銀めっき浴 |
| DE69703834T2 (de) | 1996-11-21 | 2001-06-21 | Koninkl Philips Electronics Nv | Verfahren zur anwendung einer silberschicht auf einem glassubstrat |
| JPH10330950A (ja) * | 1997-06-02 | 1998-12-15 | Nippon Parkerizing Co Ltd | 改良充填置換析出型めっき金属材料及びその製造方法 |
| JP2000212763A (ja) | 1999-01-19 | 2000-08-02 | Shipley Far East Ltd | 銀合金メッキ浴及びそれを用いる銀合金被膜の形成方法 |
| DE10050862C2 (de) | 2000-10-06 | 2002-08-01 | Atotech Deutschland Gmbh | Bad und Verfahren zum stromlosen Abscheiden von Silber auf Metalloberflächen |
| JP2002180259A (ja) | 2000-12-12 | 2002-06-26 | Shipley Co Llc | めっき液における金属析出促進化合物および該化合物を含むめっき液 |
| US20030000846A1 (en) * | 2001-05-25 | 2003-01-02 | Shipley Company, L.L.C. | Plating method |
-
2002
- 2002-07-17 EP EP02090262A patent/EP1245697A3/de not_active Withdrawn
- 2002-09-06 WO PCT/EP2002/009997 patent/WO2004007798A1/en active IP Right Grant
- 2002-09-06 AU AU2002368066A patent/AU2002368066A1/en not_active Abandoned
- 2002-09-06 EP EP02807595A patent/EP1521862B1/en not_active Expired - Lifetime
- 2002-09-06 CN CNB028293274A patent/CN100564594C/zh not_active Expired - Fee Related
- 2002-09-06 US US10/521,085 patent/US7479305B2/en not_active Expired - Fee Related
- 2002-09-06 AT AT02807595T patent/ATE364739T1/de active
- 2002-09-06 CA CA002484757A patent/CA2484757A1/en not_active Abandoned
- 2002-09-06 ES ES02807595T patent/ES2287363T3/es not_active Expired - Lifetime
- 2002-09-06 BR BR0215769-1A patent/BR0215769A/pt not_active IP Right Cessation
- 2002-09-06 DE DE60220723T patent/DE60220723T2/de not_active Expired - Lifetime
- 2002-09-06 JP JP2004520358A patent/JP4194556B2/ja not_active Expired - Fee Related
- 2002-09-06 KR KR1020057000834A patent/KR20050029220A/ko not_active Application Discontinuation
- 2002-09-19 MY MYPI20023480A patent/MY140935A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN1639385A (zh) | 2005-07-13 |
| ES2287363T3 (es) | 2007-12-16 |
| CA2484757A1 (en) | 2004-01-22 |
| DE60220723T2 (de) | 2008-03-06 |
| AU2002368066A1 (en) | 2004-02-02 |
| DE60220723D1 (de) | 2007-07-26 |
| KR20050029220A (ko) | 2005-03-24 |
| WO2004007798A1 (en) | 2004-01-22 |
| EP1245697A3 (de) | 2003-02-19 |
| EP1245697A2 (de) | 2002-10-02 |
| US20060165909A1 (en) | 2006-07-27 |
| EP1521862A1 (en) | 2005-04-13 |
| US7479305B2 (en) | 2009-01-20 |
| JP4194556B2 (ja) | 2008-12-10 |
| EP1521862B1 (en) | 2007-06-13 |
| CN100564594C (zh) | 2009-12-02 |
| ATE364739T1 (de) | 2007-07-15 |
| MY140935A (en) | 2010-02-12 |
| JP2005538246A (ja) | 2005-12-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 6A E 7A ANUIDADES. |
|
| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2055 DE 25/05/2010. |