BR9807023A - Liga de estanho isenta de chumbo para soldar ligações, soldagem isenta de chumbo, estrutura de rede de esfera para dispor componentes eletrônicos sobre placas de circuitos, e, ligação entre um componente eletrônico e uma placa de circuito. - Google Patents

Liga de estanho isenta de chumbo para soldar ligações, soldagem isenta de chumbo, estrutura de rede de esfera para dispor componentes eletrônicos sobre placas de circuitos, e, ligação entre um componente eletrônico e uma placa de circuito.

Info

Publication number
BR9807023A
BR9807023A BR9807023-1A BR9807023A BR9807023A BR 9807023 A BR9807023 A BR 9807023A BR 9807023 A BR9807023 A BR 9807023A BR 9807023 A BR9807023 A BR 9807023A
Authority
BR
Brazil
Prior art keywords
lead
free
soldering
network structure
connection
Prior art date
Application number
BR9807023-1A
Other languages
English (en)
Inventor
Martinus Adrianus Oud
Roger Bilham
Original Assignee
Alpha Fry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpha Fry Ltd filed Critical Alpha Fry Ltd
Publication of BR9807023A publication Critical patent/BR9807023A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Battery Electrode And Active Subsutance (AREA)

Abstract

"SOLDAGEM ISENTA DE CHUMBO CONTENDO íNDIO E UM REFINADOR DE GRANULAçãO, ESTRUTURA DE REDE DE ESFERA PARA DISPOR COMPONENTES ELETRôNICOS SOBRE PLACAS DE CIRCUITOS, E, LIGAçãO ENTRE UM COMPONENTE ELETRôNICO E UMA PLACA DE CIRCUITO" . Uma liga isenta chumbo para solda de ligações compreendendo até 0,25% por peso de índio e um refinador de granulação o qual é uma liga consistindo de, por peso, 2,5% a 10% em alumínio, 1 a 5% em magnésio e o restante em zinco. As ligas possuem melhoradas propriedades mecânicas, tais como resistência ao arraste, e uma melhorada resistência à fadiga térmica.
BR9807023-1A 1997-01-29 1998-01-28 Liga de estanho isenta de chumbo para soldar ligações, soldagem isenta de chumbo, estrutura de rede de esfera para dispor componentes eletrônicos sobre placas de circuitos, e, ligação entre um componente eletrônico e uma placa de circuito. BR9807023A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB9701819.6A GB9701819D0 (en) 1997-01-29 1997-01-29 Lead-free tin alloy
PCT/GB1998/000254 WO1998032886A1 (en) 1997-01-29 1998-01-28 Lead-free tin alloy

Publications (1)

Publication Number Publication Date
BR9807023A true BR9807023A (pt) 2000-03-14

Family

ID=10806765

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9807023-1A BR9807023A (pt) 1997-01-29 1998-01-28 Liga de estanho isenta de chumbo para soldar ligações, soldagem isenta de chumbo, estrutura de rede de esfera para dispor componentes eletrônicos sobre placas de circuitos, e, ligação entre um componente eletrônico e uma placa de circuito.

Country Status (17)

Country Link
US (1) US6086687A (pt)
EP (1) EP1012354B1 (pt)
JP (1) JP2001513703A (pt)
KR (1) KR20000070612A (pt)
CN (1) CN1244897A (pt)
AU (1) AU5773898A (pt)
BR (1) BR9807023A (pt)
CA (1) CA2278143A1 (pt)
DE (1) DE69805191T2 (pt)
GB (1) GB9701819D0 (pt)
HU (1) HUP0000872A3 (pt)
ID (1) ID22420A (pt)
IL (1) IL130873A0 (pt)
NZ (1) NZ336586A (pt)
PL (1) PL334729A1 (pt)
WO (1) WO1998032886A1 (pt)
ZA (1) ZA98703B (pt)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2214130C (en) * 1996-09-19 2003-12-02 Northern Telecom Limited Assemblies of substrates and electronic components
US6503338B1 (en) * 2000-04-28 2003-01-07 Senju Metal Industry Co., Ltd. Lead-free solder alloys
EP1189252A1 (de) * 2000-09-13 2002-03-20 Siemens Aktiengesellschaft Sicherungseinsatz, Verfahren zu seiner Herstellung und Lotsubstanz
JP4293500B2 (ja) * 2001-05-07 2009-07-08 第一電子工業株式会社 電子部品の製造方法
US6805974B2 (en) 2002-02-15 2004-10-19 International Business Machines Corporation Lead-free tin-silver-copper alloy solder composition
SG107581A1 (en) * 2002-03-26 2004-12-29 Inst Of High Performance Compu Lead free tin based solder composition
US6840434B2 (en) * 2002-04-09 2005-01-11 Ford Motor Company Tin-and zinc-based solder fillers for aluminum body parts and methods of applying the same
US6649833B1 (en) 2002-08-09 2003-11-18 International Business Machines Corporation Negative volume expansion lead-free electrical connection
GB0302230D0 (en) * 2003-01-30 2003-03-05 Pilkington Plc Vehicular glazing panel
GB0605883D0 (en) * 2006-03-24 2006-05-03 Pilkington Plc Electrical connector
GB0605884D0 (en) 2006-03-24 2006-05-03 Pilkington Plc Electrical connector
DE102006047764A1 (de) * 2006-10-06 2008-04-10 W.C. Heraeus Gmbh Bleifreies Weichlot mit verbesserten Eigenschaften bei Temperaturen >150°C
US20080225490A1 (en) * 2007-03-15 2008-09-18 Daewoong Suh Thermal interface materials
KR100876646B1 (ko) * 2007-04-27 2009-01-09 한국과학기술원 취성파괴 방지를 위한 무전해 ＮｉＸＰ로 표면처리된전자부품의 접합 방법
ES2330713B2 (es) * 2008-06-11 2010-04-19 Abinash Banerji Afinador de grano de base aluminio.
DE102013206934A1 (de) * 2013-04-17 2014-10-23 Verein zur Förderung von Innovationen durch Forschung, Entwicklung und Technologietransfer e.V. (Verein INNOVENT e.V.) Verfahren zur Metallisierung eines Substrats
US10195698B2 (en) 2015-09-03 2019-02-05 AIM Metals & Alloys Inc. Lead-free high reliability solder alloys
CN112342417B (zh) * 2020-11-17 2022-03-15 昆明理工大学 一种锡基焊料及其制备方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2713196C3 (de) * 1977-03-25 1979-11-15 Vereinigte Zinkwerke Gmbh, 5190 Stolberg Zinnlegierung für Zinngerät sowie Verfahren zur Herstellung der Legierung
JPS56165588A (en) * 1980-05-26 1981-12-19 Aoki Metal:Kk High temperature solder for copper tube joining
JPS5730598A (en) * 1980-07-31 1982-02-18 Ebara Corp Method and apparatus for aeration
DE3135847C2 (de) * 1981-09-10 1983-11-03 Eerste Nederlandse Witmetaalfabriek B.V., Naarden Vorlegierung zur Herstellung feinkörniger Zinnlegierungen
DE3147226A1 (de) * 1981-11-28 1983-06-09 Vereinigte Zinkwerke Gmbh, 5190 Stolberg Legierung zum impfen zinnhaltiger gleitlagerlegierungen
GB8324353D0 (en) * 1983-09-12 1983-10-12 Darchem Ltd Materials
GB2171720A (en) * 1985-02-21 1986-09-03 London Scandinavian Metall Grain refining a solder alloy
JP2667691B2 (ja) * 1988-12-29 1997-10-27 株式会社徳力本店 低融点Ａｇはんだ
US5019336A (en) * 1989-03-13 1991-05-28 Allied-Signal Inc. Micro-additions to tin alloys
JP2950478B2 (ja) * 1990-04-19 1999-09-20 大豊工業株式会社 滑り軸受合金
EP0612578A1 (en) * 1993-02-22 1994-08-31 AT&T Corp. An Article comprising a pb-free solder having improved mechanical properties
JPH0825050B2 (ja) * 1993-06-08 1996-03-13 日本アルミット株式会社 無含鉛半田合金
NL9401339A (nl) * 1994-08-18 1996-04-01 Billiton Witmetaal Legering voor een glijlager of dergelijke, en een lager op basis van een zodanige legering.
JP2805595B2 (ja) * 1994-11-02 1998-09-30 三井金属鉱業株式会社 鉛無含有半田合金
DE4443459C2 (de) * 1994-12-07 1996-11-21 Wieland Werke Ag Bleifreies Weichlot und seine Verwendung

Also Published As

Publication number Publication date
IL130873A0 (en) 2001-01-28
EP1012354B1 (en) 2002-05-02
AU5773898A (en) 1998-08-18
US6086687A (en) 2000-07-11
HUP0000872A2 (en) 2000-07-28
KR20000070612A (ko) 2000-11-25
EP1012354A1 (en) 2000-06-28
HUP0000872A3 (en) 2001-03-28
WO1998032886A1 (en) 1998-07-30
JP2001513703A (ja) 2001-09-04
DE69805191D1 (de) 2002-06-06
GB9701819D0 (en) 1997-03-19
CA2278143A1 (en) 1998-07-30
PL334729A1 (en) 2000-03-13
ZA98703B (en) 1998-07-28
DE69805191T2 (de) 2002-10-02
NZ336586A (en) 2000-04-28
ID22420A (id) 1999-10-14
CN1244897A (zh) 2000-02-16

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Legal Events

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