BR0207558A - Blindagem de interferência eletromagnética removìvel - Google Patents

Blindagem de interferência eletromagnética removìvel

Info

Publication number
BR0207558A
BR0207558A BR0207558-0A BR0207558A BR0207558A BR 0207558 A BR0207558 A BR 0207558A BR 0207558 A BR0207558 A BR 0207558A BR 0207558 A BR0207558 A BR 0207558A
Authority
BR
Brazil
Prior art keywords
electrically conductive
shield
electromagnetic interference
contact region
layer
Prior art date
Application number
BR0207558-0A
Other languages
English (en)
Inventor
Bradley E Reis
Original Assignee
Gore Enterprise Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gore Enterprise Holdings Inc filed Critical Gore Enterprise Holdings Inc
Publication of BR0207558A publication Critical patent/BR0207558A/pt

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H05K9/0035Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids with retainers mounted beforehand on the PCB, e.g. clips

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Telephone Function (AREA)
  • Fittings On The Vehicle Exterior For Carrying Loads, And Devices For Holding Or Mounting Articles (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

"BLINDAGEM DE INTERFERêNCIA ELETROMAGNéTICA REMOVìVEL". Um aparelho blindado de interferência eletromagnética tendo um substrato com pelo menos um componente elétrico disposto no mesmo; uma pluralidade de unidades de prendimento eletricamente condutivas distintas dispostas em um padrão no referido substrato circundando o pelo menos um componente elétrico; uma blindagem compreendendo uma camada de material dielétrico tendo uma superfície interna e uma superfície externa, e uma camada eletricamente condutiva sobre pelo menos uma da superfície interna e externa; uma pluralidade de aberturas formadas na blindagem tal que as aberturas correspondem ao padrão das unidades de prendimento eletricamente condutivas; no qual pelo menos uma das aberturas tem uma região de contato, e no qual ambas a camada de material dielétrico e a camada eletricamente condutiva da blindagem na região de contato da abertura deflexionam à extensão necessária para permitir que a região de contato engage e retenha a unidade de prendimento eletricamente condutiva; e no qual a camada eletricamente condutiva da blindagem na região de contato está em contato elétrico com a unidade de prendimento eletricamente condutiva.
BR0207558-0A 2001-02-26 2002-02-15 Blindagem de interferência eletromagnética removìvel BR0207558A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/793,754 US6377475B1 (en) 2001-02-26 2001-02-26 Removable electromagnetic interference shield
PCT/US2002/005705 WO2002069687A1 (en) 2001-02-26 2002-02-15 Removable electromagnetic interference shield

Publications (1)

Publication Number Publication Date
BR0207558A true BR0207558A (pt) 2004-09-14

Family

ID=25160708

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0207558-0A BR0207558A (pt) 2001-02-26 2002-02-15 Blindagem de interferência eletromagnética removìvel

Country Status (17)

Country Link
US (1) US6377475B1 (pt)
EP (1) EP1364565B1 (pt)
JP (1) JP4662689B2 (pt)
KR (1) KR100507818B1 (pt)
CN (1) CN100341389C (pt)
AT (1) ATE372046T1 (pt)
AU (1) AU2002250184B2 (pt)
BR (1) BR0207558A (pt)
CA (1) CA2439065C (pt)
DE (1) DE60222096T2 (pt)
HK (1) HK1060815A1 (pt)
HU (1) HU227656B1 (pt)
IL (2) IL157410A0 (pt)
MX (1) MXPA03007606A (pt)
NO (1) NO334972B1 (pt)
PL (1) PL204563B1 (pt)
WO (1) WO2002069687A1 (pt)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050095410A1 (en) * 2001-03-19 2005-05-05 Mazurkiewicz Paul H. Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating
US6900383B2 (en) * 2001-03-19 2005-05-31 Hewlett-Packard Development Company, L.P. Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces
JP4050025B2 (ja) * 2001-09-27 2008-02-20 カルソニックカンセイ株式会社 回路基板取付部構造
US6649827B2 (en) 2001-09-28 2003-11-18 Siemens Information & Communication Moblie, Llc Radio frequency shield enclosure for a printed circuit board
US6949706B2 (en) 2001-09-28 2005-09-27 Siemens Information And Communication Mobile, Llc Radio frequency shield for electronic equipment
US6744640B2 (en) * 2002-04-10 2004-06-01 Gore Enterprise Holdings, Inc. Board-level EMI shield with enhanced thermal dissipation
TW519375U (en) * 2002-05-30 2003-01-21 Hannstar Display Corp Fixing structure of blocking mask
US6787695B2 (en) * 2002-06-25 2004-09-07 Motorola, Inc Ergonomic shield for assembly to and disassembly from a substrate
US6909615B2 (en) * 2002-09-17 2005-06-21 Wavezero, Inc. Equipment and methods for producing continuous metallized thermoformable EMI shielding material
US6844520B2 (en) * 2002-09-26 2005-01-18 General Electric Company Methods for fabricating gas turbine engine combustors
JP3916068B2 (ja) * 2002-11-06 2007-05-16 ソニー・エリクソン・モバイルコミュニケーションズ株式会社 無線装置
WO2004077898A2 (en) * 2003-02-26 2004-09-10 Wavezero Inc. Methods and devices for connecting and grounding an emi shield to a printed circuit board
US7109410B2 (en) * 2003-04-15 2006-09-19 Wavezero, Inc. EMI shielding for electronic component packaging
WO2004114731A2 (en) * 2003-06-19 2004-12-29 Wavezero, Inc. Emi absorbing shielding for a printed circuit board
KR100694116B1 (ko) * 2005-05-26 2007-03-12 삼성전자주식회사 복합기
GB2426633A (en) * 2005-05-27 2006-11-29 Arka Technologies Ltd Component securing means
US20070023203A1 (en) * 2005-07-26 2007-02-01 Leizerovich Gustavo D Method and system for customized radio frequency shielding using solder bumps
US20070040030A1 (en) * 2005-08-16 2007-02-22 Mastercard International Incorporated Contactless proximity communications apparatus and method
US20080080160A1 (en) * 2005-12-16 2008-04-03 Laird Technologies, Inc. Emi shielding assemblies
US7262369B1 (en) 2006-03-09 2007-08-28 Laird Technologies, Inc. Combined board level EMI shielding and thermal management
US7463496B2 (en) * 2006-03-09 2008-12-09 Laird Technologies, Inc. Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith
US7623360B2 (en) 2006-03-09 2009-11-24 Laird Technologies, Inc. EMI shielding and thermal management assemblies including frames and covers with multi-position latching
US7317618B2 (en) * 2006-03-09 2008-01-08 Laird Technologies, Inc. Combined board level shielding and thermal management
US7138584B1 (en) * 2006-04-07 2006-11-21 Lotes Co., Ltd. Electrical connector
CN101316487A (zh) * 2007-05-30 2008-12-03 鸿富锦精密工业(深圳)有限公司 具有金属连接结构的电子产品及其制备方法
US20090008431A1 (en) * 2007-07-03 2009-01-08 Kossi Zonvide Solderable EMI Gasket and Grounding Pad
US8477499B2 (en) 2009-06-05 2013-07-02 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
US7965514B2 (en) 2009-06-05 2011-06-21 Laird Technologies, Inc. Assemblies and methods for dissipating heat from handheld electronic devices
CN102742377A (zh) * 2010-02-03 2012-10-17 卓英社有限公司 容易焊接的电磁波屏蔽用屏蔽壳体
US20110255250A1 (en) * 2010-04-19 2011-10-20 Richard Hung Minh Dinh Printed circuit board components for electronic devices
US8188381B2 (en) 2010-05-06 2012-05-29 Avago Technologies Fiber Ip (Singapore) Pte. Ltd. Mid-board module retention and EMI cage
TW201225752A (en) * 2010-12-10 2012-06-16 Askey Computer Corp Printed circuit board grounding structure for use with communication apparatus
KR101052559B1 (ko) * 2011-02-25 2011-07-29 김선기 전자파 차폐 및 보호용 실드케이스
CN202738374U (zh) * 2012-06-05 2013-02-13 鸿富锦精密工业(深圳)有限公司 电子装置
KR20140143991A (ko) * 2013-06-10 2014-12-18 삼성전기주식회사 무선 전력 전송용 차폐 장치 및 그를 이용한 무선 전력 전송 시스템
KR101608796B1 (ko) 2013-06-11 2016-04-04 삼성전자주식회사 쉴드 캔 조립체 및 그것을 갖는 전자 장치
WO2015197551A1 (de) * 2014-06-23 2015-12-30 Epcos Ag Gehäuse für ein elektrisches bauelement und verfahren zur herstellung eines gehäuses für ein elektrisches bauelement
US9635789B2 (en) * 2015-01-30 2017-04-25 Laird Technologies, Inc. Board level electromagnetic interference (EMI) shields with increased under-shield space
CN105823489B (zh) * 2016-01-29 2019-04-12 维沃移动通信有限公司 电子罗盘的制版方法及装置
US10108234B1 (en) * 2017-06-09 2018-10-23 Nzxt Inc. Shielded motherboard
US20190320524A1 (en) * 2018-04-13 2019-10-17 GM Global Technology Operations LLC Pcba with point field detector and magnetic shielding array located on same side of a conductor
KR102457138B1 (ko) * 2018-05-17 2022-10-21 삼성전자주식회사 커넥터를 포함하는 전자 장치
KR102651418B1 (ko) * 2019-07-25 2024-03-27 삼성전자 주식회사 차폐 시트 및 방열 부재를 포함하는 전자 장치
US11056441B2 (en) 2019-12-05 2021-07-06 Apple Inc. Electromagnetic shielding of compact electronic modules

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5148266A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies having interposer and flexible lead
US5148265A (en) 1990-09-24 1992-09-15 Ist Associates, Inc. Semiconductor chip assemblies with fan-in leads
US5153379A (en) 1990-10-09 1992-10-06 Motorola, Inc. Shielded low-profile electronic component assembly
CA2084499C (en) 1992-02-12 1998-11-03 William F. Weber Emi shield apparatus and methods
US5355016A (en) 1993-05-03 1994-10-11 Motorola, Inc. Shielded EPROM package
US5367434A (en) 1993-05-06 1994-11-22 Motorola, Inc. Electrical module assembly
US5591941A (en) 1993-10-28 1997-01-07 International Business Machines Corporation Solder ball interconnected assembly
GB2288286A (en) 1994-03-30 1995-10-11 Plessey Semiconductors Ltd Ball grid array arrangement
US5615824A (en) 1994-06-07 1997-04-01 Tessera, Inc. Soldering with resilient contacts
US5632631A (en) 1994-06-07 1997-05-27 Tessera, Inc. Microelectronic contacts with asperities and methods of making same
US5802699A (en) 1994-06-07 1998-09-08 Tessera, Inc. Methods of assembling microelectronic assembly with socket for engaging bump leads
US5495399A (en) 1994-07-05 1996-02-27 Motorola, Inc. Shield with detachable grasp support member
GB2297868B (en) 1995-02-07 1999-04-28 Nokia Mobile Phones Ltd A shielding device
JP3123638B2 (ja) 1995-09-25 2001-01-15 株式会社三井ハイテック 半導体装置
US6058018A (en) 1996-04-05 2000-05-02 Berg Technology, Inc. Electronic card
US5748455A (en) 1996-04-23 1998-05-05 Ericsson, Inc. Electromagnetic shield for a radiotelephone
US5759047A (en) 1996-05-24 1998-06-02 International Business Machines Corporation Flexible circuitized interposer with apertured member and method for making same
US5744759A (en) 1996-05-29 1998-04-28 International Business Machines Corporation Circuit boards that can accept a pluggable tab module that can be attached or removed without solder
US5838551A (en) 1996-08-01 1998-11-17 Northern Telecom Limited Electronic package carrying an electronic component and assembly of mother board and electronic package
SE507255C2 (sv) 1996-08-22 1998-05-04 Ericsson Telefon Ab L M Skärmskydd
SE511426C2 (sv) * 1996-10-28 1999-09-27 Ericsson Telefon Ab L M Anordning och förfarande vid avskärmning av elektronik
US5892245A (en) 1996-11-11 1999-04-06 Emulation Technology, Inc. Ball grid array package emulator
US5787580A (en) 1996-11-19 1998-08-04 Lg Information & Communications, Ltd. Method for making radio-frequency module by ball grid array package
GB2324649A (en) 1997-04-16 1998-10-28 Ibm Shielded semiconductor package
SE511926C2 (sv) 1997-04-16 1999-12-20 Ericsson Telefon Ab L M Skärmningshölje jämte förfarande för framställning och användning av ett skärmningshölje samt mobiltelefon med skärmningshölje
US6034429A (en) 1997-04-18 2000-03-07 Amkor Technology, Inc. Integrated circuit package
EP0881872B1 (fr) 1997-05-29 2003-08-20 Koninklijke Philips Electronics N.V. Ecran de blindage électromagnétique et support de circuit équipé d'un tel écran
DE29710640U1 (de) 1997-06-18 1997-08-21 Siemens AG, 80333 München Schirmung
US6060659A (en) 1997-07-29 2000-05-09 Lucent Technologies Inc. Electronic isolation shield and a method of determining the minimum number of securing points required on the shield to sufficiently secure the shield to a circuit board
US6097964A (en) 1997-09-04 2000-08-01 Nokia Mobile Phones Limited Navigation key for a handset
US5939784A (en) 1997-09-09 1999-08-17 Amkor Technology, Inc. Shielded surface acoustical wave package
US6051781A (en) 1997-09-24 2000-04-18 Autosplice, Inc. Surface mount electromagnetic frequency interference shield clip
US6140575A (en) * 1997-10-28 2000-10-31 3Com Corporation Shielded electronic circuit assembly
JPH11162601A (ja) 1997-11-27 1999-06-18 Texas Instr Japan Ltd ソケット
US5969418A (en) * 1997-12-22 1999-10-19 Ford Motor Company Method of attaching a chip to a flexible substrate
US6010340A (en) 1998-03-04 2000-01-04 Internatinal Business Machines Corporation Solder column tip compliancy modification for use in a BGA socket connector
US6136131A (en) 1998-06-02 2000-10-24 Instrument Specialties Company, Inc. Method of shielding and obtaining access to a component on a printed circuit board
US6027346A (en) 1998-06-29 2000-02-22 Xandex, Inc. Membrane-supported contactor for semiconductor test
US5951305A (en) 1998-07-09 1999-09-14 Tessera, Inc. Lidless socket and method of making same
US6126467A (en) 1998-07-22 2000-10-03 Enplas Corporation Socket for electrical parts
US6137693A (en) 1998-07-31 2000-10-24 Agilent Technologies Inc. High-frequency electronic package with arbitrarily-shaped interconnects and integral shielding
US6037667A (en) 1998-08-24 2000-03-14 Micron Technology, Inc. Socket assembly for use with solder ball
US6400018B2 (en) 1998-08-27 2002-06-04 3M Innovative Properties Company Via plug adapter
US6075255A (en) 1998-09-14 2000-06-13 Silicon Integrated Systems Company Contactor system for a ball grid array device
CA2344663A1 (en) 1998-10-14 2000-04-20 3M Innovative Properties Company Tape ball grid array with interconnected ground plane
US6069407A (en) 1998-11-18 2000-05-30 Vlsi Technology, Inc. BGA package using PCB and tape in a die-up configuration
US6097609A (en) 1998-12-30 2000-08-01 Intel Corporation Direct BGA socket
US6178097B1 (en) 1999-01-22 2001-01-23 Dial Tool Industries, Inc. RF shield having removable cover
US6157546A (en) 1999-03-26 2000-12-05 Ericsson Inc. Shielding apparatus for electronic devices
US6095842A (en) 1999-04-19 2000-08-01 Hon Hai Precision Ind. Co., Ltd. Contact with dual compliant pin sections used in a ZIF socket
US6111761A (en) 1999-08-23 2000-08-29 Motorola, Inc. Electronic assembly

Also Published As

Publication number Publication date
PL204563B1 (pl) 2010-01-29
WO2002069687A9 (en) 2003-04-10
HUP0303300A2 (hu) 2003-12-29
EP1364565B1 (en) 2007-08-29
KR100507818B1 (ko) 2005-08-10
DE60222096T2 (de) 2008-05-15
KR20030080036A (ko) 2003-10-10
HUP0303300A3 (en) 2004-06-28
DE60222096D1 (de) 2007-10-11
ATE372046T1 (de) 2007-09-15
HK1060815A1 (en) 2004-08-20
MXPA03007606A (es) 2004-06-30
IL157410A (en) 2007-06-17
JP2004522298A (ja) 2004-07-22
WO2002069687A1 (en) 2002-09-06
NO334972B1 (no) 2014-08-11
US6377475B1 (en) 2002-04-23
CN1494822A (zh) 2004-05-05
EP1364565A1 (en) 2003-11-26
HU227656B1 (en) 2011-10-28
CA2439065C (en) 2009-04-14
NO20033771D0 (no) 2003-08-25
CA2439065A1 (en) 2002-09-06
IL157410A0 (en) 2004-03-28
JP4662689B2 (ja) 2011-03-30
PL364597A1 (en) 2004-12-13
AU2002250184B2 (en) 2004-08-19
CN100341389C (zh) 2007-10-03
NO20033771L (no) 2003-10-15

Similar Documents

Publication Publication Date Title
BR0207558A (pt) Blindagem de interferência eletromagnética removìvel
BR9808555A (pt) Alojamento de blindagem elétrica, processo de sua produção, e, telefone celular.
BR9911568A (pt) Aparelho para aquecer um paciente
TW369740B (en) Connector, preferably a right angle connector, with integrated PCB assembly
DE69400401D1 (de) Elektromagnetische Interferenzabschirmung für elektrische Baugruppen
ES2142679T3 (es) Caja de blindaje con ranuras.
BR8207653A (pt) Forno e processo para cozimento em alta velocidade o forno tendo fonte de pressurizacao interna e fonte de calor integral
TW337587B (en) Field emission device ARC-suppressor
ATE60461T1 (de) Elektrisches bauelement mit induktiven und kapazitiven eigenschaften.
CA1258701A (en) Safety device for apparatus having relatively movable members
US4825015A (en) Electromagnetic shielding arrangement
BR9702405A (pt) Dessipador de calor para circuitos integrados e processo de fabricação de substrato de interconexão incluindo pelo menos um circuito integrado e um dissipador de calor
ES2098983T3 (es) Dispositivo para el tratamiento de objetos, en especial un dispositivo de galvanizacion de placas de circuitos impresos.
KR930702157A (ko) 형광 프린터용 광원
ATE188578T1 (de) Steckverbinder mit abschirmung
BR9900627A (pt) Disjuntor de média ou de alta tensão, comportando uma correia de transmissão contida em torno de dois pinhões
BR9813816A (pt) Motor com bloco de conectores colocado estrategicamente
ATE318501T1 (de) Abgeschirmtes modulgehäuse für substrate
KR920018418A (ko) 전자레인지
ATE274288T1 (de) Verfahren zur abschirmung einer auf einer leiterplatte realisierten elektrischen schaltung und eine entsprechende kombination einer leiterplatte mit einer abschirmung
MX166367B (es) Cable de señal de alta frecuencia con factor de disipacion electrica mejorado y metodo para producir el mismo
NO962658D0 (no) Fremgangsmåte og anordning ved en elektrisk installasjonsboks
ES2077518R (pt)
CA2325301C (en) Method and arrangement for minimizing electrical field stress in circuit interrupters and housings therefor
BR9814237A (pt) Transformador / reator e método para fabricação de um transformador / reator

Legal Events

Date Code Title Description
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]

Free format text: INDEFIRO O PEDIDO DE ACORDO COM O ART .8O COMBINADO COM ART. 13 DA LPI

B12B Appeal against refusal [chapter 12.2 patent gazette]