CN101316487A - 具有金属连接结构的电子产品及其制备方法 - Google Patents
具有金属连接结构的电子产品及其制备方法 Download PDFInfo
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- CN101316487A CN101316487A CN200710200720.2A CN200710200720A CN101316487A CN 101316487 A CN101316487 A CN 101316487A CN 200710200720 A CN200710200720 A CN 200710200720A CN 101316487 A CN101316487 A CN 101316487A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
Landscapes
- Casings For Electric Apparatus (AREA)
- Standing Axle, Rod, Or Tube Structures Coupled By Welding, Adhesion, Or Deposition (AREA)
Abstract
本发明公开一种具有金属连接结构的电子产品,其包括一金属外壳及至少一金属零件,该至少一金属零件通过热熔胶层固定于该金属外壳内侧。另外,本发明还公开上述具有金属连接结构的电子产品的制备方法。上述电子产品具有制备简单,外观美的优点。
Description
技术领域
本发明涉及一种具有金属连接结构的电子产品及其制备方法。
背景技术
目前,为追求高机械强度及美观的效果,一些个人数位助理、笔记型电脑、数字相机、移动电话、mp3和mp4等电子产品中采用金属外壳,如不锈钢或镁铝合金外壳等。
上述电子产品中金属外壳一般通过板材冲压加工。金属外壳内表面需设置各种锁固元件或夹持结构,用于限定电子产品内部的各种元件,或者使金属外壳之间相互锁固。较为普遍的是,金属外壳内表面需固定连接各种弹片结构,用于顶持电子产品内部的元件;以及金属外壳内表面设置螺柱结构,用于锁固电子产品内部元件或提供金属外壳之间互相锁定等等。
然而,金属外壳上的锁固元件或夹持结构等复杂结构难以通过上述冲压加工同步完成。目前,业界一般采用激光焊接的方式将弹片、螺柱等与金属外壳焊在一起,但是,此种激光焊接方法因受激光能量的影响容易导致金属外壳变形或变色,从而产生产品外观不良。
因此,有必要提供一种可通过避免使用激光焊接,从而获得较佳外观的电子产品。
发明内容
提供一种美观度高的电子产品以及其制备方法。
一种具有金属连接结构的电子产品,其包括一金属外壳及至少一金属零件,该至少一金属零件通过热熔胶层固定该金属外壳内侧。
一种具有金属连接结构的电子产品的制备方法,该电子产品包括一金属外壳及至少一金属零件,该至少一金属零件通过热熔胶层热固定该金属外壳内侧,其包括如下步骤:提供该金属外壳,该至少一金属零件,以及至少一热熔胶层;启动热压机,使其压头升温至40℃至50℃内,于此温度范围下压头将该至少一热熔胶层热压于该金属外壳内侧预设位置并保持2秒钟;使压头升温至160℃至170℃,于此温度范围下压头将该至少一金属零件粘贴于该热熔胶层上并保持2秒钟,该金属零件通过热熔胶层固定于金属外壳内侧。
上述电子产品的金属连接结构采用热熔胶层热压连接,由于避免了使用激光直接焊接,而且,热压温度较低,该金属连接结构的金属外壳不会产生变形和变色,从而,在满足连接稳固的要求下,该金属外壳的整体外观较佳。
附图说明
图1是本发明较佳实施例一的电子产品的金属连接结构的立体示意图。
图2是图1所示金属连接结构的侧视图。
图3是本发明较佳实施例二的电子产品的金属连接结构的部分剖面示意图。
图4是图3局部IV的放大示意图。
具体实施方式
请一并参见图1与图2,本发明较佳实施例一的电子产品包括一金属连接结构20,其包括一个金属外壳21,一个热熔胶层23以及一个弹片25。弹片25通过热熔胶层23固定于该金属外壳21内侧。
本实施例中,该金属连接结构20应用于mp3电子产品。该金属外壳21为一弯曲壳体。该弹片25为冲压形成,其包括一矩形基部251及一U型弹性部252。U型弹性部252的两支脚从基部251一端部向外延伸。该热熔胶层23的外形与该弹片25的基部251的外形匹配,可使热熔胶层23与基部251充分接触。该热熔胶层23为无溶剂的胶粘剂,其具有均匀一致的粘接层。
该金属连接结构20的制备一般包括以下步骤:启动热压机(图未示),使其压头(图未示)升温至40℃至50℃内,于此温度范围下,压头将该热熔胶层23压于该金属外壳21内侧并保持2秒钟使之粘贴牢固;接着,继续使压头升温至160℃至170℃内,于此温度范围下,压头将该弹片25压于该热熔胶层23上并保持2秒钟使之粘贴牢固。
上述制备方法具有步骤简单、所采用设备简便的优点。由于避免了使用激光直接焊接,热压温度较低,该金属外壳21不会产生变形和变色,从而,在满足连接稳固的要求下,该金属外壳21的整体外观较佳。
请同时参见图3和图4,本发明较佳实施例二的电子产品包括一金属连接结构30,其包括一个金属外壳31,一个热熔胶层33以及一个螺柱35。
本实施例二中,该金属连接结构30应用于数码电子产品。为了获得较强的固定效果,该金属外壳31于预设位置开设圆形凹槽32,该圆形凹槽32可适当容纳螺柱35的底部。该热熔胶层33粘贴于该圆形凹槽32内,使热熔胶层33完全覆盖该凹槽32槽底。该螺柱35通过热熔胶层33固定于该金属外壳31的圆形凹槽内。该圆形凹槽32的深度一般大于热熔胶层33的厚度,使热压后的热熔胶层33完全容纳于圆形凹槽32内为佳。
该金属连接结构30的制备一般包括以下步骤:启动热压机(图未示),使其压头(图未示)升温至40℃至50℃内,于此温度范围下,压头将该热熔胶层33压于该金属外壳31的圆形凹槽32内并保持2秒钟使热熔胶层33粘贴于凹槽32内;接着,继续使压头升温至160℃至170℃内,于此温度范围下,压头将该螺柱35压于该热熔胶层33上并保持2秒钟使该螺柱35与热熔胶层33牢固地粘贴。
需要说明的是,本实施例二中,该金属外壳31的圆形凹槽32可省略,即将热熔胶层33直接粘贴于金属外壳31也可实现螺柱35的固定。
由于避免了使用激光直接焊接,热压温度较低,该金属外壳31不会产生变形和变色,从而,在满足连接稳固的要求下,该金属外壳31的整体外观较佳。
可以理解的是,本发明的金属连结结构所固定的金属零件并不仅限于弹片或螺柱,其他金属零件也可采用热熔胶层热压固定的方法。
另外,本领域技术人员还可在本发明精神内做其它变化,当然,这些依据本发明精神所做的变化,都应包含在本发明所要求保护的范围内。
Claims (10)
1.一种具有金属连接结构的电子产品,其包括一金属外壳及至少一金属零件,其特征在于:该至少一金属零件通过热熔胶层固定于该金属外壳内侧。
2.如权利要求1所述的具有金属连接结构的电子产品,其特征在于:该金属零件为弹片。
3.如权利要求2所述的具有金属连接结构的电子产品,其特征在于:该弹片包括一矩形基部以及一从该基部一端面延伸形成的U型弹性部,该U型弹性部的两支角与该基部相连,且该基部的形状与该热熔胶的形状相似。
4.如权利要求1所述的具有金属连接结构的电子产品,其特征在于:该金属零件为螺柱。
5.如权利要求4所述的具有金属连接结构的电子产品,其特征在于:该金属外壳内侧开设有至少一凹槽,该热熔胶层粘贴于该凹槽槽底,该螺柱通过该热熔胶层固定于该金属外壳。
6.如权利要求5所述的具有金属连接结构的电子产品,其特征在于:该圆形凹槽的深度大于该热熔胶层的厚度。
7.一种具有金属连接结构的电子产品的制备方法,该电子产品包括一金属外壳及至少一金属零件,该至少一金属零件通过热熔胶层热固定该金属外壳内侧,其包括以下步骤:
提供一金属外壳,至少一金属零件,以及至少一热熔胶层;
启动热压机,使其压头升温至40℃至50℃内,于此温度范围下压头将该至少一热熔胶层热压于该金属外壳内侧预设位置并保持2秒钟;
使压头升温至160℃至170℃,于此温度范围下压头将该至少一金属零件粘贴于该热熔胶层上并保持2秒钟,该金属零件通过热熔胶层固定于金属外壳内侧。
8.如权利要求7所述的具有金属连接结构的电子产品的制备方法,其特征在于:该金属零件为弹片。
9.如权利要求7所述的具有金属连接结构的电子产品的制备方法,其特征在于:该金属零件为螺柱。
10.如权利要求9所述的具有金属连接结构的电子产品的制备方法,其特征在于:该金属外壳内侧开设有至少一凹槽,该热熔胶层粘贴于该凹槽槽底,该螺柱通过该热熔胶层固定于该金属外壳。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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CN200710200720.2A CN101316487A (zh) | 2007-05-30 | 2007-05-30 | 具有金属连接结构的电子产品及其制备方法 |
US11/843,668 US20080298039A1 (en) | 2007-05-30 | 2007-08-23 | Electron device having metallic connecting structure and method for making the same |
US12/156,817 US8250746B2 (en) | 2007-05-30 | 2008-06-05 | Method for making electronic device having metallic connecting structure |
Applications Claiming Priority (1)
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CN200710200720.2A CN101316487A (zh) | 2007-05-30 | 2007-05-30 | 具有金属连接结构的电子产品及其制备方法 |
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CN (1) | CN101316487A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111526678A (zh) * | 2020-04-28 | 2020-08-11 | 维沃移动通信(重庆)有限公司 | 电子设备的壳体及电子设备 |
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DE2656130A1 (de) * | 1976-12-10 | 1978-06-15 | Tucker Metallwaren Gmbh | Verfahren zur befestigung eines gegenstandes an einer auflage sowie befestigungselement zur durchfuehrung des verfahrens |
CZ231092A3 (en) * | 1991-08-02 | 1993-02-17 | Emhart Inc | Arc welded joint between a carrier and a detail attached fixedly thereto |
US5366186A (en) * | 1993-08-19 | 1994-11-22 | Ford Motor Company | Module retention spring clip |
GB2283293A (en) * | 1993-10-29 | 1995-05-03 | Avdel Systems Ltd | Dual-function fastener and method of use |
DE4402550A1 (de) * | 1994-01-28 | 1995-08-03 | Raymond A Gmbh & Co Kg | Verklebbares Befestigungselement zum Halten von Bau- oder Funktionsteilen auf Trägerteilen |
US5835006A (en) * | 1996-05-22 | 1998-11-10 | Moorola, Inc. | Vibrator assembly |
US6051781A (en) * | 1997-09-24 | 2000-04-18 | Autosplice, Inc. | Surface mount electromagnetic frequency interference shield clip |
US6409859B1 (en) * | 1998-06-30 | 2002-06-25 | Amerasia International Technology, Inc. | Method of making a laminated adhesive lid, as for an Electronic device |
US6359215B1 (en) * | 2000-06-06 | 2002-03-19 | Chin Fu Horng | Elastomer device for preventing electromagnetic interference of a computer central processing unit |
US6377475B1 (en) * | 2001-02-26 | 2002-04-23 | Gore Enterprise Holdings, Inc. | Removable electromagnetic interference shield |
US6544047B2 (en) * | 2001-03-30 | 2003-04-08 | Intel Corporation | Dual-swiping interconnection clip, and hook and slot arrangement for printed circuit board (PCB) attachment |
JP3520277B2 (ja) * | 2001-11-05 | 2004-04-19 | 北川工業株式会社 | 導電部材 |
US7473995B2 (en) * | 2002-03-25 | 2009-01-06 | Intel Corporation | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly |
TW555109U (en) | 2002-10-25 | 2003-09-21 | Chuen-Rung Jang | Locking structure for upper and lower cases of interface card |
US7085139B2 (en) * | 2003-11-25 | 2006-08-01 | Research In Motion Limited | Surface mountable clip suitable for use in a mobile communication device |
US7030333B2 (en) * | 2004-01-22 | 2006-04-18 | Bradley David A | Method of joining plates with weld fastened studs |
-
2007
- 2007-05-30 CN CN200710200720.2A patent/CN101316487A/zh active Pending
- 2007-08-23 US US11/843,668 patent/US20080298039A1/en not_active Abandoned
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2008
- 2008-06-05 US US12/156,817 patent/US8250746B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111526678A (zh) * | 2020-04-28 | 2020-08-11 | 维沃移动通信(重庆)有限公司 | 电子设备的壳体及电子设备 |
Also Published As
Publication number | Publication date |
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US20080295316A1 (en) | 2008-12-04 |
US8250746B2 (en) | 2012-08-28 |
US20080298039A1 (en) | 2008-12-04 |
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