WO2018153094A1 - 一种非晶合金电子产品外壳与中板的接合方法 - Google Patents

一种非晶合金电子产品外壳与中板的接合方法 Download PDF

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Publication number
WO2018153094A1
WO2018153094A1 PCT/CN2017/103969 CN2017103969W WO2018153094A1 WO 2018153094 A1 WO2018153094 A1 WO 2018153094A1 CN 2017103969 W CN2017103969 W CN 2017103969W WO 2018153094 A1 WO2018153094 A1 WO 2018153094A1
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amorphous alloy
electronic product
alloy electronic
outer shell
middle plate
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PCT/CN2017/103969
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English (en)
French (fr)
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李昊度
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东莞帕姆蒂昊宇液态金属有限公司
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Publication of WO2018153094A1 publication Critical patent/WO2018153094A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/02—Pressure butt welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/002—Resistance welding; Severing by resistance heating specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/34—Preliminary treatment

Definitions

  • the invention relates to the technical field of production of amorphous alloy products, in particular to a method for joining an outer shell of an amorphous alloy electronic product and a middle plate.
  • Amorphous alloys have excellent mechanical properties, high chemical stability and luxurious appearance, so they have great potential in 3C product applications.
  • amorphous alloys are ideal for making mobile phone casings for high strength, scratch resistance, corrosion resistance, and high-quality appearance.
  • the middle plate considering the design requirements of the outer casing of the amorphous alloy electronic product, it is necessary to combine the outer casing of the amorphous alloy electronic product with the middle plate.
  • the intermediate plate structure is formed by an amorphous alloy at the same time, the outer casing of the amorphous alloy electronic product is combined with the amorphous alloy medium plate, which causes the product to be overweight and the heat dissipation is not good enough.
  • the middle plate is more suitable to fabricate the middle plate with other materials such as aluminum alloy, magnesium alloy, stainless steel or special plastic, and combine with the outer shell of the amorphous alloy electronic product to achieve the problem of reducing the weight and solving the heat dissipation performance requirement.
  • the bonding method of the outer shell of the amorphous alloy electronic product and the middle plate mainly includes welding, bonding and riveting.
  • the method of soldering when the outer shell of the amorphous alloy electronic product is combined with the middle plate, the heat generated by the soldering tends to cause problems such as crystallization, oxidation, or weld embrittlement of the outer shell of the amorphous alloy electronic product.
  • the bonding method is used, not only the surface of the two materials to be bonded is required to have a certain roughness and cleanliness, but also a sufficient bonding area between the two materials is required, and in addition, by bonding, although the bonding effect can be achieved, the bonding compound in the product is susceptible to the environment (light, heat, humidity, etc.) used, and is prone to problems such as embrittlement and aging, which may cause the bonding compound to fail.
  • the riveting method is one of the more feasible solutions at present.
  • the outer casing of the amorphous alloy electronic product when the outer casing of the amorphous alloy electronic product is riveted, the outer shell of the amorphous alloy electronic product needs to be heated to a temperature between Tg and Tx.
  • the temperature between Tg and Tx is higher, thereby increasing the risk of crystallization and surface oxidation of the outer shell of the amorphous alloy electronic product, even if it can be carried out in a special apparatus having a chamber and under a vacuum or an inert atmosphere to avoid the above. Crystallization and surface oxidation problems, but this will make the corresponding production The cost increases and is not mass-produced.
  • the temperature between Tg and Tx is higher than the failure temperature of some special medium plate materials (for example, the temperature of special plastics can only be resistant to 200 to 250 ° C). Therefore, the riveting method limits the application range.
  • the object of the present invention is to provide a method for bonding an outer shell of an amorphous alloy electronic product and an intermediate plate according to the deficiencies of the prior art, and the method for bonding the outer shell of the amorphous alloy electronic product to the middle plate can prevent the outer shell of the amorphous alloy electronic product from occurring. Oxidation and crystallization reaction, and can improve joint strength, reduce production input, and mass production.
  • a method of bonding an outer shell of an amorphous alloy electronic product to an intermediate plate comprises the steps of:
  • Step 1 pre-bonding: pre-bonding the outer shell of the amorphous alloy electronic product to the middle plate, wherein the outer shell of the amorphous alloy electronic product has a stud structure, the middle plate is provided with a through hole; the amorphous alloy electron a stud structure of the outer casing of the product is inserted into the through hole of the middle plate, and is locked by the clamp to pre-bond the outer casing of the amorphous alloy electronic product with the middle plate to obtain a pre-bonded whole;
  • the upper part of the through hole of the middle plate is provided with a chamfering structure or a circular concave structure, or the hole wall surface of the through hole of the middle plate is provided with a small groove or a pit structure;
  • the inner wall surface of the small groove or the pit structure is roughened
  • Step 2 heating: the pre-bonded whole obtained in the first step is placed in the chamber, and the pillar structure of the outer shell of the amorphous alloy electronic product is heated to between (Tg-100 ° C) and Tg or heated to 100 ° C. Tg;
  • Step 3 applying pressure: pressing the stud structure of the outer shell of the amorphous alloy electronic product with a punch for a certain time, so that the convex column structure of the outer shell of the amorphous alloy electronic product is deformed and filled with the middle plate a hole; the punch is capable of moving and pressing in three dimensions of XYZ and in a direction of 360 degrees;
  • Step 4 Cooling and setting: After the pressing of the third step is completed, the cooling is set, that is, the bonding of the outer shell of the amorphous alloy electronic product to the middle plate is completed.
  • the pillar structure is one of a solid cylinder, a hollow cylinder, a solid circular table, a hollow circular table, a solid cone, a solid rectangular parallelepiped or a hollow rectangular parallelepiped;
  • the convex column structure can be in three dimensions of XYZ and 360 Move in the direction of the degree of pressure.
  • the amorphous alloy when pre-bonding, the amorphous alloy
  • the height of the stud structure of the outer casing of the electronic product is greater than the depth of the through hole of the middle plate, and when the joining is completed, the depth of the stud structure of the outer shell of the amorphous alloy electronic product is inserted into the through hole of the middle plate Equal to or smaller than the depth of the through hole;
  • the stud structure of the outer shell of the amorphous alloy electronic product and the through hole of the middle plate are gap-fitted or over-fitted.
  • the pillar structure of the outer shell of the amorphous alloy electronic product is heated by using a heating device, and the specific heating method is to heat the punch first by induction heating, resistance heating or infrared heating. Then, the punch is moved to contact the stud structure of the outer shell of the amorphous alloy electronic product to transfer heat to the stud structure, so that the temperature of the stud structure reaches the process temperature, and an inert atmosphere is added during the process to blow the air to achieve local protection and prevent amorphous.
  • the alloy is oxidized or crystallized, and the punch continues to press down the stud structure, so that the stud structure flows under pressure and fills the through hole of the middle plate, and then the punch is withdrawn to complete the bonding.
  • the time for heating the stud structure of the outer shell of the amorphous alloy electronic product by the heating device is 2 s to 60 s.
  • the pressure applied to the pillar structure of the outer shell of the amorphous alloy electronic product by the punch is 0.1 N to 80 N, and the pressing time is 3 s to 20 s.
  • the punch structure of the outer shell of the amorphous alloy electronic product is pressed by a punch, specifically, the axis of the punch is coaxial with the axis of the through hole and located Directly above the through hole, when the pressure is applied, the punch moves downward and then compresses the stud structure of the outer shell of the amorphous alloy electronic product, and the punch returns to the original position after the pressing is completed.
  • a gap is maintained between the punch and the through hole of the middle plate, and the gap size is 0.03 mm to 0.07 mm.
  • cooling and setting step cooling and setting are performed by means of natural cooling.
  • the fixture comprises a fixture base and a fixture upper cover, and the pillar structure of the amorphous alloy electronic product casing is inserted into the through hole of the middle plate
  • the jig base is for placing an outer casing of an amorphous alloy electronic product, the upper cover of the jig is pressed against the middle plate, and the pressing and locking of the jig base and the upper cover of the jig makes the An amorphous alloy electronic product housing is pre-bonded to the intermediate plate.
  • the present invention has the following beneficial effects:
  • a method for bonding an outer shell of an amorphous alloy electronic product and a middle plate provided by the present invention heats the stud structure of the outer shell of the amorphous alloy electronic product to (Tg-100 ° C) compared with the prior art. Between ⁇ Tg or heating to the melting point and then pressurizing for a period of time, at this temperature, the structure of the outer shell of the amorphous alloy electronic product does not undergo a qualitative change, that is, the amorphous alloy structure is maintained, thereby avoiding the occurrence of the outer shell of the amorphous alloy electronic product. Oxidation and crystallization reactions. Referring to the viscosity temperature profile of Fig.
  • the viscosity in the temperature region between (Tg - 100 ° C) and Tg is sufficient to cause the atoms of the stud structure of the outer shell of the amorphous alloy electronic article to move, and thus the thermoplastic molding can be induced.
  • the method for bonding an outer shell of an amorphous alloy electronic product and a middle plate provided by the present invention does not need to heat the outer shell of the amorphous alloy electronic product to a glass transition temperature Tg or more, and can be compared with the prior art.
  • the production is carried out under an unprotected atmosphere (ie, under air) to avoid the effects of crystallization and oxidation. Therefore, the bonding method of the outer shell of the amorphous alloy electronic product and the intermediate plate can reduce production input and shorten the production cycle.
  • a method for bonding an outer shell of an amorphous alloy electronic product to an intermediate plate provided by the present invention wherein a chamfered structure or a concave-concave structure is provided at an upper portion of the through-hole of the intermediate plate, and a chamfered structure or a concave-concave structure region is combined It will be filled with an amorphous alloy and will form an inverted snap as a whole to increase the bonding surface at the time of bonding to enhance the bonding strength performance.
  • the hole wall surface of the through hole of the middle plate is provided with a small groove or a pit structure, and the inner wall surface of the small groove or the pit structure is roughened, for example, sandblasting, to increase the bonding area at the time of bonding, thereby enhancing The bonding strength property; therefore, the bonding strength between the outer casing of the amorphous alloy electronic product and the intermediate plate can be made good, and the advantages of mass productivity, high production efficiency, and low production cost can be obtained.
  • the method for bonding an outer shell of an amorphous alloy electronic product and a middle plate provided by the present invention can be cooled and shaped by means of natural cooling, and does not require special cooling treatment, and the outer shell of the amorphous alloy electronic product is
  • the bonding method of the board only needs to be combined with the production of a simple fixture, and therefore, the bonding method of the outer shell of the amorphous alloy electronic product and the middle plate can further reduce the production input and shorten the production cycle.
  • the method for bonding an outer shell of an amorphous alloy electronic product and a middle plate provided by the present invention has the advantages of simple method, low production cost, and can be applied to mass production.
  • FIG. 1 is a structural schematic view showing the pre-bonding of an outer shell of an amorphous alloy electronic product according to a first embodiment of the present invention.
  • FIG. 2 is a schematic view showing the structure of the amorphous alloy electronic product casing of the first embodiment of the present invention after being pre-bonded and joined to the intermediate plate.
  • Fig. 3 is a structural schematic view showing the outer casing and the intermediate plate of the amorphous alloy electronic product of the second embodiment of the present invention being pre-bonded and joined.
  • FIG. 4 is a schematic view showing the structure of the amorphous alloy electronic product casing of the embodiment 3 of the present invention before being pre-bonded and joined to the intermediate plate.
  • Fig. 5 is a structural schematic view showing the outer casing and the intermediate plate of the amorphous alloy electronic product of the fourth embodiment of the present invention being pre-bonded and joined.
  • Fig. 6 is a structural schematic view showing the outer casing and the intermediate plate of the amorphous alloy electronic product of the fifth embodiment of the present invention being pre-bonded and joined.
  • Fig. 7 is a structural schematic view showing the outer casing and the intermediate plate of the amorphous alloy electronic product of the sixth embodiment of the present invention being pre-bonded and joined.
  • Fig. 8 is a structural schematic view showing the pre-bonding of the outer casing of the amorphous alloy electronic product of the embodiment 7 of the present invention and the intermediate plate.
  • Fig. 9 is a structural schematic view showing the pre-bonding of the outer casing of the amorphous alloy electronic product of the embodiment 8 of the present invention with the intermediate plate.
  • Fig. 10 is a structural schematic view showing the pre-bonding of the outer casing of the amorphous alloy electronic product of the embodiment 9 of the present invention to the intermediate plate.
  • Fig. 11 is a structural schematic view showing the pre-bonding of the outer casing of the amorphous alloy electronic product of the embodiment 10 of the present invention with the intermediate plate.
  • Figure 12 is a diagram showing an example application of the present invention.
  • the amorphous alloy frame is provided with a vertical convex column structure
  • the opponent member is provided with a hole structure
  • eight support tables are indicated on the amorphous alloy frame
  • a convex column structure is arranged on the support table, and the corresponding component is on the corresponding amorphous alloy.
  • a through hole is formed at the position of the support table (the hole axis is parallel to the thickness direction of the aluminum alloy plate).
  • Figure 13 is a schematic view showing the structure of three kinds of punches.
  • Fig. 14 is a heating graph of a mode of induction heating, resistance heating or infrared heating.
  • the curve a represents the thermoplastic molding process of the present invention, heating between 100 ° C and Tg, since the curve does not pass through the crystallization zone, there is no risk of crystallization and oxidation;
  • the curve b represents a conventional thermoplastic molding process, Heating between Tg and Tx occurs because the extended dotted line enters the crystallization zone, so there is a risk of crystallization and oxidation.
  • Figure 15 is a graph showing the viscosity temperature of a pure metal.
  • Figure 16 is a schematic view showing the structure of an amorphous alloy electronic product casing in use.
  • Figure 17 is a schematic view showing the structure of an aluminum alloy intermediate plate in use.
  • Fig. 18 is a schematic structural view showing the bonding effect between the outer casing of the amorphous alloy electronic product of Fig. 16 and the aluminum alloy intermediate plate of Fig. 17 in application.
  • a middle plate 2 a through hole 21, a chamfered structure 201, a concave structure 202, a small groove or a pit structure 203;
  • Fixing fixture 3 fixture base 31, fixture upper cover 32;
  • Tg means the glass transition temperature
  • Tx means the crystallization temperature
  • (Tg - 100 ° C) to Tg mentioned in the present invention means a temperature value obtained by subtracting a Tg temperature value from 100 °C.
  • a method for bonding an outer shell of an amorphous alloy electronic product to a middle plate comprising the steps of:
  • Step one pre-combining: pre-bonding the outer casing 1 of the amorphous alloy electronic product to the intermediate plate 2, wherein the outer casing 1 of the amorphous alloy electronic product has a stud structure 11, and the middle plate 2 is provided with a through hole 21;
  • the stud structure 11 of the product casing 1 is inserted into the through hole 21 of the middle plate 2, and is locked by the jig 3 to pre-bond the amorphous alloy electronic product casing 1 and the intermediate plate 2 to obtain a pre-bonded whole;
  • the stud structure 11 is a solid cylinder; wherein the upper portion of the through hole of the middle plate 2 is provided with a chamfer structure 201;
  • the height of the stud structure 11 of the amorphous alloy electronic product casing 1 is greater than the depth of the through hole 21 of the intermediate plate 2, and when the joining is completed, the stud of the amorphous alloy electronic product casing 1
  • the depth of the structure 11 nested in the through hole 21 of the intermediate plate 2 is equal to or smaller than the depth of the through hole 21; wherein, the gap between the stud structure 11 of the amorphous alloy electronic product casing 1 and the through hole 21 of the intermediate plate 2 is a gap Cooperate.
  • the jig 3 includes a jig base 31 and a jig upper cover 32. After the stud structure 11 of the amorphous alloy electronic product casing 1 is inserted into the through hole 21 of the middle plate 2, the jig base 31 is used for placing the non-position. The outer casing 2 of the crystal alloy electronic product, the upper cover 32 of the jig is pressed against the middle plate 2, and the outer casing 2 of the amorphous alloy electronic product is pre-bonded by the press-locking of the jig base 31 and the upper cover 32 of the jig.
  • Step 2 heating: the pre-bonded whole obtained in step 1 is placed in the chamber, and the stud structure 11 of the amorphous alloy electronic product outer casing 1 is heated to between (Tg - 100 ° C) and Tg by a heating device;
  • the specific heating mode is resistance heating; in this embodiment, the heating time is 30s;
  • Step 3 Applying pressure: the stud structure 11 of the amorphous alloy electronic product casing 1 is pressed by the punch 4 for 10 s, so that the stud structure 11 of the amorphous alloy electronic product casing 1 is deformed and filled with the intermediate plate.
  • the through hole 21 of 2; in this embodiment, the pressure applied to the pillar structure 11 of the amorphous alloy electronic product casing 1 by the punch 4 is 50N; wherein the punch 4 can be in three dimensions of XYZ and 360 The direction of the degree is moved and pressed; the stud structure 11 is capable of moving and pressing in three dimensions of XYZ and in a direction of 360 degrees.
  • the stud structure 11 of the amorphous alloy electronic product casing 1 is pressed by the punch 4, specifically, the axis of the punch 4 is coaxial with the axis of the through hole 21 and located in the through hole 21.
  • the punch 4 moves downward and then compresses the stud structure 11 of the amorphous alloy electronic product casing 1.
  • the punch 4 returns to the original position.
  • the punch 4 has a stroke to ensure that the amount of compression is uniform and that it is not excessively compressed.
  • the gap between the punch 4 and the through hole 21 of the middle plate 2 is maintained, and the gap size is 0.05 mm;
  • the present invention heats the stud structure 11 of the outer casing 1 of the amorphous alloy electronic product to (Tg-100 ° C). Between -Tg is then pressurized for a period of time at which the structure of the outer shell of the amorphous alloy electronic product 1 does not undergo a qualitative change, that is, the amorphous alloy structure is maintained, thereby preventing oxidation and crystallization of the outer shell of the amorphous alloy electronic product 1. Reaction.
  • the bonding method of the outer shell of the amorphous alloy electronic product and the intermediate plate can reduce the production investment, shorten the production cycle, and can make the bonding strength between the outer shell of the amorphous alloy electronic product 1 and the intermediate plate 2 good, and can be mass-produced. Advantages of high performance, low production efficiency and low production cost.
  • a method for bonding an outer shell of an amorphous alloy electronic product to a middle plate comprising the steps of:
  • Step one pre-combining: pre-bonding the outer shell of the amorphous alloy electronic product to the middle plate 2, wherein the outer shell of the amorphous alloy electronic product has a stud structure 11, the middle plate 2 is provided with a through hole 21; the outer shell of the amorphous alloy electronic product The stud structure 11 is inserted into the through hole 21 of the middle plate 2, and is locked by the jig 3 to pre-bond the outer casing of the amorphous alloy electronic product to the intermediate plate 2 to obtain a pre-bonded whole;
  • the pillar structure 11 is a solid cylinder; wherein the upper portion of the through hole of the middle plate 2 is provided with a chamfer structure 201;
  • the height of the stud structure 11 of the amorphous alloy electronic product casing 1 is greater than the depth of the through hole 21 of the intermediate plate 2, and when the joining is completed, the stud of the amorphous alloy electronic product casing 1
  • the depth of the structure 11 nested in the through hole 21 of the intermediate plate 2 is equal to or smaller than the depth of the through hole 21; wherein, the gap between the stud structure 11 of the amorphous alloy electronic product casing 1 and the through hole 21 of the intermediate plate 2 is a gap Cooperate.
  • the fixture comprises a fixture base and a fixture upper cover, and the pillar structure of the amorphous alloy electronic product casing is inserted into the through hole 21 of the middle plate, and the fixture base is used for placing the amorphous alloy electronic product casing, The upper cover is pressed against the middle plate, and the outer casing of the amorphous alloy electronic product is pre-bonded with the middle plate through the press-locking of the jig base and the upper cover of the jig.
  • Step 2 heating: putting the pre-bonded whole obtained in step 1 into the chamber, and heating the pillar structure of the outer shell of the amorphous alloy electronic product to a melting point by using a heating device;
  • the specific heating mode is electromagnetic induction Heating; in this embodiment, the heating time is 2 s;
  • Step 3 Applying pressure: the bump structure 11 of the outer shell of the amorphous alloy electronic product is pressed by the punch 4 for 3 s, so that the stud structure 11 of the outer shell of the amorphous alloy electronic product is deformed and filled with the middle plate 2
  • the stud structure 11 of the amorphous alloy electronic product casing 1 is pressed by the punch 4, specifically, the axis of the punch 4 is coaxial with the axis of the through hole 21 and located in the through hole 21.
  • the punch 4 moves downward and then compresses the stud structure 11 of the amorphous alloy electronic product casing 1.
  • the punch 4 returns to the original position.
  • the punch 4 has a stroke to ensure that the amount of compression is uniform and that it is not excessively compressed. Wherein, the gap between the punch 4 and the through hole 21 of the middle plate 2 is maintained, and the gap size is 0.03 mm;
  • a method for bonding an outer shell of an amorphous alloy electronic product and a middle plate of the embodiment compared with the prior art
  • the present invention heats the pillar structure of the outer shell of the amorphous alloy electronic product to a melting point and then pressurizes it for a period of time. At this temperature, the structure of the outer shell of the amorphous alloy electronic product does not undergo a qualitative change, that is, the amorphous alloy structure remains. Further, oxidation and crystallization reaction of the outer shell of the amorphous alloy electronic product can be avoided.
  • the bonding method of the outer shell of the amorphous alloy electronic product and the intermediate plate can reduce the production investment, shorten the production cycle, and can make the bonding strength between the outer shell of the amorphous alloy electronic product and the middle plate good, and can be mass-produced, The advantages of high production efficiency and low production cost.
  • a method for bonding an outer shell of an amorphous alloy electronic product to a middle plate comprising the steps of:
  • Step one pre-combining: pre-bonding the outer shell of the amorphous alloy electronic product to the middle plate 2, wherein the outer shell of the amorphous alloy electronic product has a stud structure 11, the middle plate 2 is provided with a through hole 21; the outer shell of the amorphous alloy electronic product The stud structure 11 is inserted into the through hole 21 of the middle plate 2, and is locked by the clamping tool to pre-bond the outer casing of the amorphous alloy electronic product to the intermediate plate 2 to obtain a pre-bonded whole; in this embodiment, The pillar structure 11 is a solid circular table; wherein the upper portion of the through hole of the middle plate 2 is provided with a chamfer structure 201;
  • the height of the stud structure 11 of the amorphous alloy electronic product casing 1 is greater than the depth of the through hole 21 of the intermediate plate 2, and when the joining is completed, the stud of the amorphous alloy electronic product casing 1
  • the depth of the structure 11 nested in the through hole 21 of the intermediate plate 2 is equal to or smaller than the depth of the through hole 21; wherein, between the stud structure 11 of the amorphous alloy electronic product casing 1 and the through hole 21 of the intermediate plate 2 is excessive Cooperate.
  • the fixture comprises a fixture base and a fixture upper cover, and the pillar structure of the amorphous alloy electronic product casing is inserted into the through hole 21 of the middle plate, and the fixture base is used for placing the amorphous alloy electronic product casing, The upper cover is pressed against the middle plate, and the outer casing of the amorphous alloy electronic product is pre-bonded with the middle plate through the press-locking of the jig base and the upper cover of the jig.
  • Step 2 heating: putting the pre-bonded whole obtained in step 1 into the chamber, and heating the pillar structure of the outer shell of the amorphous alloy electronic product to between (Tg-100 ° C) and Tg by using a heating device;
  • the specific heating mode is resistance heating; in this embodiment, the heating time is 10s;
  • Step 3 Applying pressure: the bump structure 11 of the outer shell of the amorphous alloy electronic product is pressed by the punch 4 for 6 s, so that the stud structure 11 of the outer shell of the amorphous alloy electronic product is deformed and filled with the middle plate 2
  • the through hole 21 in this embodiment, the pressure applied to the pillar structure 11 of the amorphous alloy electronic product casing by the punch 4 is 20N; wherein the punch 4 can be in three dimensions of XYZ and in a direction of 360 degrees Applying pressure; the stud structure 11 can move in three dimensions of XYZ and in a 360 degree direction Pressure.
  • the bump structure 4 of the outer casing of the amorphous alloy electronic product is pressed by the punch 4, specifically, the axis of the punch 4 is coaxial with the axis of the through hole 21 and is located at the positive of the through hole 21.
  • the punch 4 moves downward and then compresses the stud structure 11 of the amorphous alloy electronic product casing 1. After the pressing is completed, the punch 4 returns to the original position.
  • the punch 4 has a stroke to ensure that the amount of compression is uniform and that it is not excessively compressed. Wherein, the gap between the punch 4 and the through hole 21 of the middle plate 2 is maintained, and the gap size is 0.04 mm;
  • the present invention heats the pillar structure of the outer shell of the amorphous alloy electronic product to (Tg-100 ° C) to Tg.
  • the pressure is then applied for a period of time at which the structure of the outer shell of the amorphous alloy electronic product does not undergo a qualitative change, that is, the amorphous alloy structure is maintained, thereby preventing oxidation and crystallization of the outer shell of the amorphous alloy electronic product.
  • the bonding method of the outer shell of the amorphous alloy electronic product and the intermediate plate can reduce the production investment, shorten the production cycle, and can make the bonding strength between the outer shell of the amorphous alloy electronic product and the middle plate good, and can be mass-produced, The advantages of high production efficiency and low production cost.
  • a method for bonding an outer shell of an amorphous alloy electronic product to a middle plate comprising the steps of:
  • Step one pre-combining: pre-bonding the outer shell of the amorphous alloy electronic product to the middle plate 2, wherein the outer shell of the amorphous alloy electronic product has a stud structure 11, the middle plate 2 is provided with a through hole 21; the outer shell of the amorphous alloy electronic product The stud structure 11 is inserted into the through hole 21 of the middle plate 2, and is locked by the clamping tool to pre-bond the outer casing of the amorphous alloy electronic product to the intermediate plate 2 to obtain a pre-bonded whole; in this embodiment, The pillar structure 11 is a solid circular table; wherein the upper portion of the through hole of the middle plate 2 is provided with a chamfer structure 201;
  • the height of the stud structure 11 of the amorphous alloy electronic product casing 1 is greater than the depth of the through hole 21 of the intermediate plate 2, and when the joining is completed, the stud of the amorphous alloy electronic product casing 1
  • the depth of the structure 11 nested in the through hole 21 of the intermediate plate 2 is equal to or smaller than the depth of the through hole 21; wherein, between the stud structure 11 of the amorphous alloy electronic product casing 1 and the through hole 21 of the intermediate plate 2 is excessive Cooperate.
  • the fixture comprises a fixture base and a fixture upper cover, and the pillar structure of the amorphous alloy electronic product casing is inserted into the through hole 21 of the middle plate, and the fixture base is used for placing the amorphous alloy electronic product casing, The upper cover is pressed against the middle plate, and the outer casing of the amorphous alloy electronic product is pre-bonded with the middle plate through the press-locking of the jig base and the upper cover of the jig.
  • Step 2 heating: putting the pre-bonded whole obtained in step 1 into the chamber, and heating the pillar structure of the outer shell of the amorphous alloy electronic product to between (Tg-100 ° C) and Tg by using a heating device;
  • the specific heating mode is resistance heating; in this embodiment, the heating time is 10s;
  • Step 3 Applying pressure: the bump structure 11 of the outer shell of the amorphous alloy electronic product is pressed by the punch 4 for 6 s, so that the stud structure 11 of the outer shell of the amorphous alloy electronic product is deformed and filled with the middle plate 2
  • the through hole 21 in this embodiment, the pressure applied to the pillar structure 11 of the amorphous alloy electronic product casing by the punch 4 is 20N; wherein the punch 4 can be in three dimensions of XYZ and in a direction of 360 degrees
  • the moving pressure is applied; the stud structure 11 is capable of moving and pressing in three dimensions of XYZ and in a direction of 360 degrees.
  • the bump structure 4 of the outer casing of the amorphous alloy electronic product is pressed by the punch 4, specifically, the axis of the punch 4 is coaxial with the axis of the through hole 21 and is located at the positive of the through hole 21.
  • the punch 4 moves downward and then compresses the stud structure 11 of the amorphous alloy electronic product casing 1. After the pressing is completed, the punch 4 returns to the original position.
  • the punch 4 has a stroke to ensure that the amount of compression is uniform and that it is not excessively compressed. Wherein, the gap between the punch 4 and the through hole 21 of the middle plate 2 is maintained, and the gap size is 0.04 mm;
  • the present invention heats the pillar structure of the outer shell of the amorphous alloy electronic product to (Tg-100 ° C) to Tg.
  • the pressure is then applied for a period of time at which the structure of the outer shell of the amorphous alloy electronic product does not undergo a qualitative change, that is, the amorphous alloy structure is maintained, thereby preventing oxidation and crystallization of the outer shell of the amorphous alloy electronic product.
  • the bonding method of the outer shell of the amorphous alloy electronic product and the intermediate plate can reduce the production investment, shorten the production cycle, and can make the bonding strength between the outer shell of the amorphous alloy electronic product and the middle plate good, and can be mass-produced, The advantages of high production efficiency and low production cost.
  • a method for bonding an outer shell of an amorphous alloy electronic product to a middle plate comprising the steps of:
  • Step one pre-combining: pre-bonding the outer shell of the amorphous alloy electronic product to the middle plate 2, wherein the outer shell of the amorphous alloy electronic product has a stud structure 11, the middle plate 2 is provided with a through hole 21; the outer shell of the amorphous alloy electronic product The stud structure 11 is inserted into the through hole 21 of the middle plate 2, and is locked by the clamping tool to pre-bond the outer casing of the amorphous alloy electronic product to the intermediate plate 2 to obtain a pre-bonded whole; in this embodiment, The pillar structure 11 is a hollow cylinder; wherein the upper portion of the through hole of the middle plate 2 is provided with a chamfer structure 201;
  • the height of the stud structure 11 of the amorphous alloy electronic product casing 1 is greater than the depth of the through hole 21 of the intermediate plate 2, and when the joining is completed, the stud of the amorphous alloy electronic product casing 1
  • the depth of the structure 11 nested in the through hole 21 of the intermediate plate 2 is equal to or smaller than the depth of the through hole 21; wherein, the gap between the stud structure 11 of the outer casing of the amorphous alloy electronic product and the through hole 21 of the intermediate plate 2 is a clearance fit .
  • the fixture comprises a fixture base and a fixture upper cover, and the pillar structure of the amorphous alloy electronic product casing is inserted into the through hole of the middle plate, and the fixture base is used for placing the amorphous alloy electronic product casing, the fixture The upper cover presses the middle plate, and the outer casing of the amorphous alloy electronic product is pre-bonded with the middle plate through the pressing and locking of the jig base and the upper cover of the jig.
  • Step 2 heating: putting the pre-bonded whole obtained in step 1 into the chamber, and heating the pillar structure 11 of the outer shell of the amorphous alloy electronic product to between (Tg-100 ° C) and Tg by using a heating device;
  • the specific heating mode is electromagnetic induction heating; in this embodiment, the heating time is 2s;
  • Step 3 Applying pressure: the bump structure 11 of the outer shell of the amorphous alloy electronic product is pressed by the punch 4 for 3 s, so that the stud structure 11 of the outer shell of the amorphous alloy electronic product is deformed and filled with the middle plate 2
  • the bump structure 4 of the outer casing of the amorphous alloy electronic product is pressed by the punch 4, specifically, the axis of the punch 4 is coaxial with the axis of the through hole 21 and is located at the positive of the through hole 21.
  • the punch 4 moves downward and then compresses the stud structure 11 of the outer casing of the amorphous alloy electronic product, and after the pressing is completed, the punch 4 returns to the original position.
  • the punch 4 has a stroke to ensure that the amount of compression is uniform and that it is not excessively compressed. Wherein, the gap between the punch 4 and the through hole 21 of the middle plate 2 is maintained, and the gap size is 0.03 mm;
  • the present invention heats the pillar structure of the outer shell of the amorphous alloy electronic product to (Tg-100 ° C) to Tg.
  • the pressure is then applied for a period of time at which the structure of the outer shell of the amorphous alloy electronic product does not undergo a qualitative change, that is, the amorphous alloy structure is maintained, thereby preventing oxidation and crystallization of the outer shell of the amorphous alloy electronic product.
  • the bonding method of the outer shell of the amorphous alloy electronic product and the intermediate plate can reduce the production input, shorten the production cycle, and enable the combination between the outer shell of the amorphous alloy electronic product and the middle plate. It has good strength and has the advantages of high productivity, high production efficiency and low production cost.
  • a method for bonding an outer shell of an amorphous alloy electronic product to a middle plate comprising the steps of:
  • Step one pre-combining: pre-bonding the outer shell of the amorphous alloy electronic product to the middle plate 2, wherein the outer shell of the amorphous alloy electronic product has a stud structure 11, the middle plate 2 is provided with a through hole 21; the outer shell of the amorphous alloy electronic product The stud structure 11 is inserted into the through hole 21 of the middle plate 2, and is locked by the clamping tool to pre-bond the outer casing of the amorphous alloy electronic product to the intermediate plate 2 to obtain a pre-bonded whole; in this embodiment, The pillar structure 11 is a hollow cylinder; wherein the upper portion of the through hole of the middle plate 2 is provided with a chamfer structure 201;
  • the height of the stud structure 11 of the amorphous alloy electronic product casing 1 is greater than the depth of the through hole 21 of the intermediate plate 2, and when the joining is completed, the stud of the amorphous alloy electronic product casing 1
  • the depth of the structure 11 nested in the through hole 21 of the intermediate plate 2 is equal to or smaller than the depth of the through hole 21; wherein, the gap between the stud structure 11 of the outer casing of the amorphous alloy electronic product and the through hole 21 of the intermediate plate 2 is a clearance fit .
  • the fixture comprises a fixture base and a fixture upper cover, and the pillar structure of the amorphous alloy electronic product casing is inserted into the through hole of the middle plate, and the fixture base is used for placing the amorphous alloy electronic product casing, the fixture The upper cover presses the middle plate, and the outer casing of the amorphous alloy electronic product is pre-bonded with the middle plate through the pressing and locking of the jig base and the upper cover of the jig.
  • Step 2 heating: putting the pre-bonded whole obtained in step 1 into the chamber, and heating the pillar structure 11 of the outer shell of the amorphous alloy electronic product to between (Tg-100 ° C) and Tg by using a heating device;
  • the specific heating mode is electromagnetic induction heating; in this embodiment, the heating time is 2s;
  • Step 3 Applying pressure: the bump structure 11 of the outer shell of the amorphous alloy electronic product is pressed by the punch 4 for 3 s, so that the stud structure 11 of the outer shell of the amorphous alloy electronic product is deformed and filled with the middle plate 2
  • the bump structure 4 of the outer casing of the amorphous alloy electronic product is pressed by the punch 4, specifically, the axis of the punch 4 is coaxial with the axis of the through hole 21 and is located at the positive of the through hole 21.
  • the punch 4 moves downward and then compresses the stud structure 11 of the outer casing of the amorphous alloy electronic product, and after the pressing is completed, the punch 4 returns to the original position.
  • the punch 4 has a stroke to ensure that the amount of compression is the same each time, Not over-compressed. Wherein, the gap between the punch 4 and the through hole 21 of the middle plate 2 is maintained, and the gap size is 0.03 mm;
  • the present invention heats the pillar structure of the outer shell of the amorphous alloy electronic product to (Tg-100 ° C) to Tg.
  • the pressure is then applied for a period of time at which the structure of the outer shell of the amorphous alloy electronic product does not undergo a qualitative change, that is, the amorphous alloy structure is maintained, thereby preventing oxidation and crystallization of the outer shell of the amorphous alloy electronic product.
  • the bonding method of the outer shell of the amorphous alloy electronic product and the intermediate plate can reduce the production investment, shorten the production cycle, and can make the bonding strength between the outer shell of the amorphous alloy electronic product and the middle plate good, and can be mass-produced, The advantages of high production efficiency and low production cost.
  • a method for bonding an outer shell of an amorphous alloy electronic product to a middle plate comprising the steps of:
  • Step one pre-combination: pre-bonding the outer shell of the amorphous alloy electronic product with the middle plate, wherein the outer shell of the amorphous alloy electronic product has a convex column structure, the middle plate is provided with a through hole; the convex column structure of the outer shell of the amorphous alloy electronic product Nesting into the through hole of the middle plate and locking by the clamping tool to pre-bond the outer shell of the amorphous alloy electronic product with the middle plate to obtain a pre-bonded whole; in this embodiment, the convex column structure is a hollow round table; The upper portion of the through hole of the middle plate 2 is provided with a chamfer structure 201;
  • the height of the stud structure 11 of the amorphous alloy electronic product casing 1 is greater than the depth of the through hole 21 of the intermediate plate 2, and when the joining is completed, the stud of the amorphous alloy electronic product casing 1
  • the depth of the structure 11 nested in the through hole 21 of the intermediate plate 2 is equal to or smaller than the depth of the through hole 21; wherein the stud structure of the outer shell of the amorphous alloy electronic product and the through hole of the intermediate plate are excessively fitted.
  • the fixture comprises a fixture base and a fixture upper cover, and the pillar structure of the amorphous alloy electronic product casing is inserted into the through hole of the middle plate, and the fixture base is used for placing the amorphous alloy electronic product casing, the fixture The upper cover presses the middle plate, and the outer casing of the amorphous alloy electronic product is pre-bonded with the middle plate through the pressing and locking of the jig base and the upper cover of the jig.
  • Step 2 heating: putting the pre-bonded whole obtained in step 1 into the chamber, and heating the pillar structure of the outer shell of the amorphous alloy electronic product to between (Tg-100 ° C) and Tg by using a heating device;
  • the specific heating mode is infrared heating; in this embodiment, the heating time is 60 s;
  • Step 3 Applying pressure: the punch structure of the outer shell of the amorphous alloy electronic product is pressed by a punch for 20 s, so that the convex column structure of the outer shell of the amorphous alloy electronic product is deformed and filled with the middle plate.
  • the pressure applied to the pillar structure of the outer shell of the amorphous alloy electronic product by the punch is 80N; wherein the punch 4 can move and apply pressure in three dimensions of XYZ and in a direction of 360 degrees.
  • the stud structure 11 is capable of moving and pressing in three dimensions of XYZ and in a direction of 360 degrees.
  • the punch structure of the outer shell of the amorphous alloy electronic product is pressed by a punch, specifically, the axial center of the punch is coaxial with the axial center of the through hole and directly above the through hole, and when pressed
  • the punch moves down and compresses the stud structure of the outer shell of the amorphous alloy electronic product, and the punch returns to the original position after the pressing is completed.
  • the punch has a stroke to ensure that the amount of compression is consistent and not excessively compressed. Wherein, a gap is maintained between the punch and the through hole of the middle plate, and the gap size is 0.07 mm;
  • the present invention heats the pillar structure of the outer shell of the amorphous alloy electronic product to (Tg-100 ° C) to Tg.
  • the pressure is then applied for a period of time at which the structure of the outer shell of the amorphous alloy electronic product does not undergo a qualitative change, that is, the amorphous alloy structure is maintained, thereby preventing oxidation and crystallization of the outer shell of the amorphous alloy electronic product.
  • the bonding method of the outer shell of the amorphous alloy electronic product and the intermediate plate can reduce the production investment, shorten the production cycle, and can make the bonding strength between the outer shell of the amorphous alloy electronic product and the middle plate good, and can be mass-produced, The advantages of high production efficiency and low production cost.
  • a method for bonding an outer shell of an amorphous alloy electronic product to a middle plate comprising the steps of:
  • Step one pre-combination: pre-bonding the outer shell of the amorphous alloy electronic product with the middle plate, wherein the outer shell of the amorphous alloy electronic product has a convex column structure, the middle plate is provided with a through hole; the convex column structure of the outer shell of the amorphous alloy electronic product Nesting into the through hole of the middle plate and locking by the clamping tool to pre-bond the outer casing of the amorphous alloy electronic product with the middle plate to obtain a pre-bonded whole; in this embodiment, the convex column structure is a solid cone; The upper portion of the through hole of the middle plate 2 is provided with a chamfer structure 201;
  • the height of the stud structure 11 of the amorphous alloy electronic product casing 1 is greater than the depth of the through hole 21 of the intermediate plate 2, and when the joining is completed, the stud of the amorphous alloy electronic product casing 1
  • the depth of the structure 11 nested in the through hole 21 of the intermediate plate 2 is equal to or smaller than the depth of the through hole 21; wherein the pillar structure of the outer shell of the amorphous alloy electronic product and the through hole of the middle plate are gap-fitted.
  • the fixture comprises a fixture base and a fixture upper cover, and the pillar structure of the amorphous alloy electronic product casing is inserted into the through hole of the middle plate, and the fixture base is used for placing the amorphous alloy electronic product casing, the fixture The upper cover presses the middle plate, and the outer casing of the amorphous alloy electronic product is sealed by the pressing of the fixture base and the upper cover of the jig.
  • the middle plate is pre-bonded.
  • Step 2 heating: putting the pre-bonded whole obtained in step 1 into the chamber, and heating the pillar structure of the outer shell of the amorphous alloy electronic product to between (Tg-100 ° C) and Tg by using a heating device;
  • the specific heating mode is electromagnetic induction heating; in this embodiment, the heating time is 20s;
  • Step 3 Apply pressure: press the convex column structure of the outer shell of the amorphous alloy electronic product with a punch for 15 s, so that the convex column structure of the outer shell of the amorphous alloy electronic product is deformed and filled with the through hole of the middle plate;
  • the pressure applied to the pillar structure of the outer shell of the amorphous alloy electronic product by the punch is 70N; wherein the punch 4 can move and press in three directions of XYZ and in a direction of 360 degrees;
  • the structure 11 is capable of moving and pressing in three dimensions of XYZ and in a direction of 360 degrees.
  • the punch structure of the outer shell of the amorphous alloy electronic product is pressed by a punch, specifically, the axial center of the punch is coaxial with the axial center of the through hole and directly above the through hole, and when pressed
  • the punch moves down and compresses the stud structure of the outer shell of the amorphous alloy electronic product, and the punch returns to the original position after the pressing is completed.
  • the punch has a stroke to ensure that the amount of compression is consistent and not excessively compressed. Wherein, a gap is maintained between the punch and the through hole of the middle plate, and the gap size is 0.06 mm;
  • the present invention heats the pillar structure of the outer shell of the amorphous alloy electronic product to (Tg-100 ° C) to Tg.
  • the pressure is then applied for a period of time at which the structure of the outer shell of the amorphous alloy electronic product does not undergo a qualitative change, that is, the amorphous alloy structure is maintained, thereby preventing oxidation and crystallization of the outer shell of the amorphous alloy electronic product.
  • the bonding method of the outer shell of the amorphous alloy electronic product and the intermediate plate can reduce the production investment, shorten the production cycle, and can make the bonding strength between the outer shell of the amorphous alloy electronic product and the middle plate good, and can be mass-produced, The advantages of high production efficiency and low production cost.
  • a method for bonding an outer shell of an amorphous alloy electronic product to a middle plate comprising the steps of:
  • Step one pre-combination: pre-bonding the outer shell of the amorphous alloy electronic product with the middle plate, wherein the outer shell of the amorphous alloy electronic product has a convex column structure, the middle plate is provided with a through hole; the convex column structure of the outer shell of the amorphous alloy electronic product Inserting into the through hole of the middle plate and locking by the clamping tool to pre-bond the outer casing of the amorphous alloy electronic product with the middle plate to obtain a pre-bonded whole; in this embodiment, the convex column structure is a solid rectangular parallelepiped; The upper portion of the through hole of the middle plate 2 is provided with a concave structure 202;
  • the height of the stud structure 11 of the amorphous alloy electronic product outer casing 1 when pre-bonded The degree is greater than the depth of the through hole 21 of the intermediate plate 2, and when the bonding is completed, the depth of the stud structure 11 of the amorphous alloy electronic product casing 1 nested in the through hole 21 of the intermediate plate 2 is equal to or smaller than the depth of the through hole 21.
  • the stud structure of the outer shell of the amorphous alloy electronic product is excessively matched with the through hole of the middle plate.
  • the fixture comprises a fixture base and a fixture upper cover, and the pillar structure of the amorphous alloy electronic product casing is inserted into the through hole of the middle plate, and the fixture base is used for placing the amorphous alloy electronic product casing, the fixture The upper cover presses the middle plate, and the outer casing of the amorphous alloy electronic product is pre-bonded with the middle plate through the pressing and locking of the jig base and the upper cover of the jig.
  • Step 2 heating: putting the pre-bonded whole obtained in step 1 into the chamber, and heating the pillar structure of the outer shell of the amorphous alloy electronic product to between (Tg-100 ° C) and Tg by using a heating device;
  • the specific heating mode is infrared heating; in this embodiment, the heating time is 50s;
  • Step 3 Applying pressure: pressurizing the stud structure of the outer shell of the amorphous alloy electronic product with a punch for 8 s, so that the stud structure of the outer shell of the amorphous alloy electronic product is deformed and filled with the through hole of the middle plate;
  • the pressure applied to the pillar structure of the outer shell of the amorphous alloy electronic product by the punch is 60N; wherein the punch 4 can move and press in three directions of XYZ and in a direction of 360 degrees;
  • the structure 11 is capable of moving and pressing in three dimensions of XYZ and in a direction of 360 degrees.
  • the punch structure of the outer shell of the amorphous alloy electronic product is pressed by a punch, specifically, the axial center of the punch is coaxial with the axial center of the through hole and directly above the through hole, and when pressed
  • the punch moves down and compresses the stud structure of the outer shell of the amorphous alloy electronic product, and the punch returns to the original position after the pressing is completed.
  • the punch has a stroke to ensure that the amount of compression is consistent and not excessively compressed.
  • a gap is maintained between the punch and the through hole of the middle plate, and the gap size is 0.05 mm;
  • the present invention heats the pillar structure of the outer shell of the amorphous alloy electronic product to (Tg-100 ° C) to Tg.
  • the pressure is then applied for a period of time at which the structure of the outer shell of the amorphous alloy electronic product does not undergo a qualitative change, that is, the amorphous alloy structure is maintained, thereby preventing oxidation and crystallization of the outer shell of the amorphous alloy electronic product.
  • the bonding method of the outer shell of the amorphous alloy electronic product and the intermediate plate can reduce the production investment, shorten the production cycle, and can make the bonding strength between the outer shell of the amorphous alloy electronic product and the middle plate good, and can be mass-produced, The advantages of high production efficiency and low production cost.
  • a method for bonding an outer shell of an amorphous alloy electronic product to a middle plate comprising the steps of:
  • Step one pre-combination: pre-bonding the outer shell of the amorphous alloy electronic product with the middle plate, wherein the outer shell of the amorphous alloy electronic product has a convex column structure, the middle plate is provided with a through hole; the convex column structure of the outer shell of the amorphous alloy electronic product Nesting into the through hole of the middle plate and locking by the clamping tool to pre-bond the outer shell of the amorphous alloy electronic product with the middle plate to obtain a pre-bonded whole; in this embodiment, the convex column structure is a hollow rectangular parallelepiped;
  • the hole wall surface of the through hole of the middle plate 2 is provided with a small groove or pit structure 203, wherein the inner wall surface of the small groove or the pit structure is roughened, for example, sand blasting;
  • the height of the stud structure 11 of the amorphous alloy electronic product casing 1 is greater than the depth of the through hole 21 of the intermediate plate 2, and when the joining is completed, the stud of the amorphous alloy electronic product casing 1
  • the depth of the structure 11 nested in the through hole 21 of the intermediate plate 2 is equal to or smaller than the depth of the through hole 21; wherein the pillar structure of the outer shell of the amorphous alloy electronic product and the through hole of the middle plate are gap-fitted.
  • the fixture comprises a fixture base and a fixture upper cover, and the pillar structure of the amorphous alloy electronic product casing is inserted into the through hole of the middle plate, and the fixture base is used for placing the amorphous alloy electronic product casing, the fixture The upper cover presses the middle plate, and the outer casing of the amorphous alloy electronic product is pre-bonded with the middle plate through the pressing and locking of the jig base and the upper cover of the jig.
  • Step 2 heating: the pre-bonded whole obtained in step 1 is placed in the chamber, and the pillar structure of the outer shell of the amorphous alloy electronic product is heated to between 100 ° C and Tg by using a heating device; in this embodiment, The heating mode is resistance heating; in this embodiment, the heating time is 40s;
  • Step 3 Applying pressure: pressurizing the stud structure of the outer shell of the amorphous alloy electronic product with a punch for 17 s, so that the stud structure of the outer shell of the amorphous alloy electronic product is deformed and filled with the through hole of the middle plate;
  • the pressure applied to the pillar structure of the outer shell of the amorphous alloy electronic product by the punch is 30N; wherein the punch 4 can move and press in three directions of XYZ and in a direction of 360 degrees;
  • the structure 11 is capable of moving and pressing in three dimensions of XYZ and in a direction of 360 degrees.
  • the punch structure of the outer shell of the amorphous alloy electronic product is pressed by a punch, specifically, the axial center of the punch is coaxial with the axial center of the through hole and directly above the through hole, and when pressed
  • the punch moves down and compresses the stud structure of the outer shell of the amorphous alloy electronic product, and the punch returns to the original position after the pressing is completed.
  • the punch has a stroke to ensure that the amount of compression is consistent and not excessively compressed. Wherein, a gap is maintained between the punch and the through hole of the middle plate, and the gap size is 0.03 mm;
  • the present invention heats the pillar structure of the outer shell of the amorphous alloy electronic product to (Tg-100 ° C) to Tg.
  • the pressure is then applied for a period of time at which the structure of the outer shell of the amorphous alloy electronic product does not undergo a qualitative change, that is, the amorphous alloy structure is maintained, thereby preventing oxidation and crystallization of the outer shell of the amorphous alloy electronic product.
  • the bonding method of the outer shell of the amorphous alloy electronic product and the intermediate plate can reduce the production investment, shorten the production cycle, and can make the bonding strength between the outer shell of the amorphous alloy electronic product and the middle plate good, and can be mass-produced, The advantages of high production efficiency and low production cost.
  • the glass transition temperature of the commonly used alloy is shown in Table 1.

Abstract

一种非晶合金电子产品外壳与中板的接合方法，包括：步骤一，预结合；步骤二，加热；步骤三，施压；步骤四，冷却定型。该接合方法对非晶合金电子产品外壳的凸柱结构加热至（Tg－100℃）~Tg之间然后进行加压一段时间，此温度下非晶合金电子产品外壳的结构不会发生质变，即仍保持非晶合金结构，进而能够避免非晶合金电子产品外壳发生氧化及结晶化反应。另外，该接合方法能够降低生产投入，缩短生产周期，并能够使得非晶合金电子产品外壳与中板之间的结合强度好，且具有能大量生产、生产效率高和生产成本低的优点。

Description

一种非晶合金电子产品外壳与中板的接合方法 技术领域
本发明涉及非晶合金产品生产技术领域，具体涉及一种非晶合金电子产品外壳与中板的接合方法。
背景技术
非晶合金具有绝佳力学性能、高化学稳定性及奢华外观效果，因此在3C产品应用上具有很大潜力。在手机应用方面，非晶合金极适合用来制作手机外壳以达到高强度、耐刮、耐腐蚀、高质感外观效果。同时，考虑到非晶合金电子产品外壳本身设计需求，需要将非晶合金电子产品外壳与中板结合。但若同时要以非晶合金成型中板结构，非晶合金电子产品外壳与非晶合金中板结合后，则会使得产品存在过重及散热不够好的问题。因此，较适合以其它材质如铝合金、镁合金、不锈钢或者特种塑胶等来制作中板，藉由与非晶合金电子产品外壳相结合以达到减轻重量及解决散热性能需求的问题。
目前，非晶合金电子产品外壳与中板的结合方法存在缺陷，以及结合强度不好是业内亟待解决的问题。现有技术中，非晶合金电子产品外壳与中板的结合方法主要有焊接、粘接和铆接三种。然而，如果采用焊接的方式，当非晶合金电子产品外壳与中板结合时，焊接产生的热量容易使得非晶合金电子产品外壳发生结晶化、氧化或焊缝脆化等问题。而如果使用粘接的方式，则不仅要求待粘接的两种材料表面具有一定的粗糙度及清洁度，更要求两种材料之间有足够的粘接面积，另外，通过粘接的方式，虽然可以达到结合效果，但是产品中的粘接胶料容易受到所使用环境(光、热、湿等)的影响，进而容易发生脆化、老化等问题，因而会导致粘接胶料失效。
另外，铆接的方式是目前较具可行性方案之一，但是，现有技术中，非晶合金电子产品外壳与中板铆接时需要使非晶合金电子产品外壳加热至温度为Tg～Tx之间，Tg～Tx之间的温度由于较高，因而增加了非晶合金电子产品外壳结晶化及表面氧化的风险，即使其可在具有腔室的特殊设备中并且真空或惰性气氛下进行来避免上述结晶化及表面氧化的问题，但是，这样会相应的使生产 成本增加，并且不具量产性。而且，Tg～Tx之间的温度高于某些特种中板材料的失效温度(如：特种塑胶温度仅可耐200～250℃)，因此，铆接的方式局限了应用范围。
发明内容
本发明的目的在于针对现有技术的不足，提供一种非晶合金电子产品外壳与中板的接合方法，该非晶合金电子产品外壳与中板的接合方法能够避免非晶合金电子产品外壳发生氧化及结晶化反应，并能提高接合强度，降低生产投入，且具量产性。
为了实现上述目的，本发明采用如下技术方案：
提供一种非晶合金电子产品外壳与中板的接合方法，它包括以下步骤：
步骤一，预结合：将非晶合金电子产品外壳与中板进行预结合，其中，所述非晶合金电子产品外壳具有凸柱结构，所述中板开设有通孔；所述非晶合金电子产品外壳的凸柱结构套入所述中板的通孔中，并通过夹治具锁紧以使得所述非晶合金电子产品外壳与所述中板进行预结合，得到预结合的整体；
所述中板的通孔的上部设置有倒角结构或圆凹结构，或者，所述中板的通孔的孔壁面设置有小槽或凹坑结构；
所述小槽或凹坑结构的内壁面进行粗糙化处理；
步骤二，加热：将步骤一得到的预结合的整体放入腔室内，并对非晶合金电子产品外壳的凸柱结构进行加热到(Tg－100℃)～Tg之间或者加热到100℃～Tg；
步骤三，施压：利用冲头对非晶合金电子产品外壳的凸柱结构进行施压一定时间，以使得非晶合金电子产品外壳的凸柱结构发生塑形变形并填充所述中板的通孔；所述冲头能够在XYZ三个维度并以360度的方向进行移动施压；
步骤四，冷却定型：步骤三的施压完成后，进行冷却定型，即完成非晶合金电子产品外壳与中板的接合。
上述技术方案中，所述凸柱结构为实心圆柱、空心圆柱、实心圆台、空心圆台、实心圆锥、实心长方体或空心长方体中的一种；所述凸柱结构能够在XYZ三个维度并以360度的方向进行移动施压。
上述技术方案中，所述步骤一预结合步骤中，当预结合时，所述非晶合金 电子产品外壳的凸柱结构的高度大于所述中板的通孔的深度，当完成接合后，所述非晶合金电子产品外壳的凸柱结构套入所述中板的通孔中的深度为等于或小于所述通孔的深度；
所述非晶合金电子产品外壳的凸柱结构与所述中板的通孔之间为间隙配合或者过度配合。
上述技术方案中，所述步骤二加热步骤中，利用加热装置对非晶合金电子产品外壳的凸柱结构进行加热，具体加热方式为以感应加热、电阻加热或者红外线加热的方式先加热冲头,再以冲头移动接触非晶合金电子产品外壳的凸柱结构以传递热量给凸柱结构，使得凸柱结构温度达到制程温度，并且过程中增加惰性气氛进行吹气以实现局部保护，防止非晶合金氧化或晶化，进而冲头继续下压凸柱结构，使得凸柱结构受压力而流动并填充中板的通孔，然后撤回冲头完成结合。
上述技术方案中，所述步骤二加热步骤中，利用加热装置对非晶合金电子产品外壳的凸柱结构进行加热的时间为2s～60s。
上述技术方案中，所述步骤三施压步骤中，利用冲头对非晶合金电子产品外壳的凸柱结构进行施压的压力为0.1N～80N，施压的时间为3s～20s。
上述技术方案中，所述步骤三施压步骤中，利用冲头对非晶合金电子产品外壳的凸柱结构进行施压，具体是，冲头的轴心与通孔的轴心同轴且位于通孔的正上方，施压时，冲头往下移动然后压缩所述非晶合金电子产品外壳的凸柱结构，施压完成后冲头返回原始位置。
上述技术方案中，所述步骤三施压步骤中，所述冲头与所述中板的通孔之间保持间隙，间隙大小为0.03mm～0.07mm。
上述技术方案中，所述步骤四冷却定型步骤中，利用自然冷却的方式进行冷却定型。
上述技术方案中，所述步骤一预结合步骤中，所述夹治具包括治具底座和治具上盖，非晶合金电子产品外壳的凸柱结构套入所述中板的通孔中后，所述治具底座用于放置非晶合金电子产品外壳，所述治具上盖压住所述中板，通过所述治具底座和所述治具上盖的压合锁紧使得所述非晶合金电子产品外壳与所述中板进行预结合。
本发明与现有技术相比较，有益效果在于：
(1)本发明提供的一种非晶合金电子产品外壳与中板的接合方法，与现有技术相比，本发明是对非晶合金电子产品外壳的凸柱结构加热至(Tg－100℃)～Tg之间或者加热到熔点然后进行加压一段时间，此温度下非晶合金电子产品外壳的结构不会发生质变，即仍保持非晶合金结构，进而能够避免非晶合金电子产品外壳发生氧化及结晶化反应。参看附图15的粘度温度曲线，(Tg－100℃)～Tg之间的温度区域内的粘度足够使得非晶合金电子产品外壳的凸柱结构的原子移动，因此能够诱发热塑成型。
(2)本发明提供的一种非晶合金电子产品外壳与中板的接合方法，与现有技术相比，本发明不需对非晶合金电子产品外壳加热到玻璃转化温度Tg以上，并且可选择无保护气氛下(即空气下)生产，达到避免结晶及氧化的效果，因此，该非晶合金电子产品外壳与中板的接合方法能够降低生产投入，缩短生产周期。
(3)本发明提供的一种非晶合金电子产品外壳与中板的接合方法，由于中板的通孔的上部设置有倒角结构或圆凹结构，结合时倒角结构或圆凹结构区域会被非晶合金填充，整体看形成倒卡扣状，以增加结合时的结合面从而增强结合强度性能。另外，由于中板的通孔的孔壁面设置有小槽或凹坑结构，且小槽或凹坑结构的内壁面进行粗糙化处理，例如喷砂处理，以增加结合时的结合面积，从而增强结合强度性能；因此，能够使得非晶合金电子产品外壳与中板之间的结合强度好，且具有能大量生产性、高生产效率和较低生产成本的优点。
(4)本发明提供的一种非晶合金电子产品外壳与中板的接合方法，由于利用自然冷却的方式进行冷却定型即可，不需要特殊冷却处理，并且该非晶合金电子产品外壳与中板的接合方法仅需结构简单的夹治具配合生产即可，因此，该非晶合金电子产品外壳与中板的接合方法能够进一步降低生产投入，及缩短生产周期。
(5)本发明提供的一种非晶合金电子产品外壳与中板的接合方法，具有方法简单，生产成本低，并能够适用于大规模生产的特点。
附图说明
图1是本发明的实施例1的非晶合金电子产品外壳与中板进行预结合的结构示意图。
图2是本发明的实施例1的非晶合金电子产品外壳与中板进行预结合和接合后的结构示意图。
图3是本发明的实施例2的非晶合金电子产品外壳与中板进行预结合和接合后的结构示意图。
图4是本发明的实施例3的非晶合金电子产品外壳与中板进行预结合和接合后的结构示意图。
图5是本发明的实施例4的非晶合金电子产品外壳与中板进行预结合和接合后的结构示意图。
图6是本发明的实施例5的非晶合金电子产品外壳与中板进行预结合和接合后的结构示意图。
图7是本发明的实施例6的非晶合金电子产品外壳与中板进行预结合和接合后的结构示意图。
图8是本发明的实施例7的非晶合金电子产品外壳与中板进行预结合的结构示意图。
图9是本发明的实施例8的非晶合金电子产品外壳与中板进行预结合的结构示意图。
图10是本发明的实施例9的非晶合金电子产品外壳与中板进行预结合的结构示意图。
图11是本发明的实施例10的非晶合金电子产品外壳与中板进行预结合的结构示意图。
图12是本发明的实例应用图。其中，非晶合金边框设有立凸柱结构，对手件设有孔结构，非晶合金边框上示意出8个支撑台，在支撑台上有凸柱结构，对手件上在对应非晶合金的支撑台的位置开设通孔(孔轴平行于铝合金板厚度方向)。
图13是三种冲头的结构示意图。
图14是感应加热、电阻加热或者红外线加热的方式的加热曲线图。其中，曲线a代表本发明的热塑成型制程，在100℃～Tg间进行加热，由于曲线不会经过结晶区，因此无晶化及氧化的风险；曲线b代表传统的热塑成型制程，在Tg～Tx间进行加热，因其延长的虚线进入了晶化区，因此有发生晶化及氧化的风险。
图15是纯金属的粘度温度曲线图。
图16是应用中的非晶合金电子产品外壳的结构示意图。
图17是应用中的铝合金中板的结构示意图。
图18是应用中的图16的非晶合金电子产品外壳与图17的铝合金中板之间的结合效果的结构示意图。
附图中包括：
非晶合金电子产品外壳1、凸柱结构11；
中板2、通孔21、倒角结构201、圆凹结构202、小槽或凹坑结构203；
夹治具3、治具底座31、治具上盖32；
冲头4。
具体实施方式
为了使本发明所解决的技术问题、技术方案及有益效果更加清楚明白，以下结合实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
本发明中所提及的Tg是指玻璃转化温度，Tx是指结晶温度。
其中，本发明提及的(Tg－100℃)～Tg，其中，(Tg－100℃)是指Tg温度值与100℃相减所得的温度值。
实施例1。
参见图1和图2。一种非晶合金电子产品外壳与中板的接合方法，它包括以下步骤：
步骤一，预结合：将非晶合金电子产品外壳1与中板2进行预结合，其中，非晶合金电子产品外壳1具有凸柱结构11，中板2开设有通孔21；非晶合金电子产品外壳1的凸柱结构11套入中板2的通孔21中，并通过夹治具3锁紧以使得非晶合金电子产品外壳1与中板2进行预结合，得到预结合的整体；本实施例中，凸柱结构11为实心圆柱；其中，中板2的通孔的上部设置有倒角结构201；
本实施例中，当预结合时，非晶合金电子产品外壳1的凸柱结构11的高度大于中板2的通孔21的深度，当完成接合后，非晶合金电子产品外壳1的凸柱结构11套入中板2的通孔21中的深度为等于或小于通孔21的深度；其中，非晶合金电子产品外壳1的凸柱结构11与中板2的通孔21之间为间隙配合。
其中，夹治具3包括治具底座31和治具上盖32，非晶合金电子产品外壳1的凸柱结构11套入中板2的通孔21中后，治具底座31用于放置非晶合金电子产品外壳1，治具上盖32压住中板2，通过治具底座31和治具上盖32的压合锁紧使得非晶合金电子产品外壳1与中板2进行预结合。
步骤二，加热：将步骤一得到的预结合的整体放入腔室内，并利用加热装置对非晶合金电子产品外壳1的凸柱结构11进行加热到(Tg－100℃)～Tg之间；本实施例中，具体加热方式为电阻加热；本实施例中，加热时间为30s；
步骤三，施压：利用冲头4对非晶合金电子产品外壳1的凸柱结构11进行施压10s，以使得非晶合金电子产品外壳1的凸柱结构11发生塑形变形并填充中板2的通孔21；本实施例中，利用冲头4对非晶合金电子产品外壳1的凸柱结构11进行施压的压力为50N；其中，冲头4能够在XYZ三个维度并以360度的方向进行移动施压；凸柱结构11能够在XYZ三个维度并以360度的方向进行移动施压。
本实施例中，利用冲头4对非晶合金电子产品外壳1的凸柱结构11进行施压，具体是，冲头4的轴心与通孔21的轴心同轴且位于通孔21的正上方，施压时，冲头4往下移动然后压缩非晶合金电子产品外壳1的凸柱结构11，施压完成后冲头4返回原始位置。另外，冲头4有行程，能确保每次压缩量一致，也不会过度压缩。其中，冲头4与中板2的通孔21之间保持间隙，间隙大小为0.05mm；
本实施例的一种非晶合金电子产品外壳与中板的接合方法，与现有技术相比，本发明是对非晶合金电子产品外壳1的凸柱结构11加热至(Tg－100℃)～Tg之间然后进行加压一段时间，此温度下非晶合金电子产品外壳1的结构不会发生质变，即仍保持非晶合金结构，进而能够避免非晶合金电子产品外壳1发生氧化及结晶化反应。另外，该非晶合金电子产品外壳与中板的接合方法能够降低生产投入，缩短生产周期，并能够使得非晶合金电子产品外壳1与中板2之间的结合强度好，且具有能大量生产性、高生产效率和较低生产成本的优点。
实施例2。
见图3。一种非晶合金电子产品外壳与中板的接合方法，它包括以下步骤：
步骤一，预结合：将非晶合金电子产品外壳与中板2进行预结合，其中，非晶合金电子产品外壳具有凸柱结构11，中板2开设有通孔21；非晶合金电子产品外壳的凸柱结构11套入中板2的通孔21中，并通过夹治具3锁紧以使得非晶合金电子产品外壳与中板2进行预结合，得到预结合的整体；本实施例中，凸柱结构11为实心圆柱；其中，中板2的通孔的上部设置有倒角结构201；
本实施例中，当预结合时，非晶合金电子产品外壳1的凸柱结构11的高度大于中板2的通孔21的深度，当完成接合后，非晶合金电子产品外壳1的凸柱结构11套入中板2的通孔21中的深度为等于或小于通孔21的深度；其中，非晶合金电子产品外壳1的凸柱结构11与中板2的通孔21之间为间隙配合。
其中，夹治具包括治具底座和治具上盖，非晶合金电子产品外壳的凸柱结构套入中板的通孔21中后，治具底座用于放置非晶合金电子产品外壳，治具上盖压住中板，通过治具底座和治具上盖的压合锁紧使得非晶合金电子产品外壳与中板进行预结合。
步骤二，加热：将步骤一得到的预结合的整体放入腔室内，并利用加热装置对非晶合金电子产品外壳的凸柱结构进行加热到熔点；本实施例中，具体加热方式为电磁感应加热；本实施例中，加热时间为2s；
步骤三，施压：利用冲头4对非晶合金电子产品外壳的凸柱结构11进行施压3s，以使得非晶合金电子产品外壳的凸柱结构11发生塑形变形并填充中板2的通孔21；本实施例中，利用冲头4对非晶合金电子产品外壳的凸柱结构11进行施压的压力为0.1N；其中，冲头4能够在XYZ三个维度并以360度的方向进行移动施压；凸柱结构11能够在XYZ三个维度并以360度的方向进行移动施压。
本实施例中，利用冲头4对非晶合金电子产品外壳1的凸柱结构11进行施压，具体是，冲头4的轴心与通孔21的轴心同轴且位于通孔21的正上方，施压时，冲头4往下移动然后压缩非晶合金电子产品外壳1的凸柱结构11，施压完成后冲头4返回原始位置。另外，冲头4有行程，能确保每次压缩量一致，也不会过度压缩。其中，冲头4与中板2的通孔21之间保持间隙，间隙大小为0.03mm；
本实施例的一种非晶合金电子产品外壳与中板的接合方法，与现有技术相 比，本发明是对非晶合金电子产品外壳的凸柱结构加热至熔点然后进行加压一段时间，此温度下非晶合金电子产品外壳的结构不会发生质变，即仍保持非晶合金结构，进而能够避免非晶合金电子产品外壳发生氧化及结晶化反应。另外，该非晶合金电子产品外壳与中板的接合方法能够降低生产投入，缩短生产周期，并能够使得非晶合金电子产品外壳与中板之间的结合强度好，且具有能大量生产性、高生产效率和较低生产成本的优点。
实施例3。
见图4。一种非晶合金电子产品外壳与中板的接合方法，它包括以下步骤：
步骤一，预结合：将非晶合金电子产品外壳与中板2进行预结合，其中，非晶合金电子产品外壳具有凸柱结构11，中板2开设有通孔21；非晶合金电子产品外壳的凸柱结构11套入中板2的通孔21中，并通过夹治具锁紧以使得非晶合金电子产品外壳与中板2进行预结合，得到预结合的整体；本实施例中，凸柱结构11为实心圆台；其中，中板2的通孔的上部设置有倒角结构201；
本实施例中，当预结合时，非晶合金电子产品外壳1的凸柱结构11的高度大于中板2的通孔21的深度，当完成接合后，非晶合金电子产品外壳1的凸柱结构11套入中板2的通孔21中的深度为等于或小于通孔21的深度；其中，非晶合金电子产品外壳1的凸柱结构11与中板2的通孔21之间为过度配合。
其中，夹治具包括治具底座和治具上盖，非晶合金电子产品外壳的凸柱结构套入中板的通孔21中后，治具底座用于放置非晶合金电子产品外壳，治具上盖压住中板，通过治具底座和治具上盖的压合锁紧使得非晶合金电子产品外壳与中板进行预结合。
步骤二，加热：将步骤一得到的预结合的整体放入腔室内，并利用加热装置对非晶合金电子产品外壳的凸柱结构进行加热到(Tg－100℃)～Tg之间；本实施例中，具体加热方式为电阻加热；本实施例中，加热时间为10s；
步骤三，施压：利用冲头4对非晶合金电子产品外壳的凸柱结构11进行施压6s，以使得非晶合金电子产品外壳的凸柱结构11发生塑形变形并填充中板2的通孔21；本实施例中，利用冲头4对非晶合金电子产品外壳的凸柱结构11进行施压的压力为20N；其中，冲头4能够在XYZ三个维度并以360度的方向进行移动施压；凸柱结构11能够在XYZ三个维度并以360度的方向进行移动 施压。
本实施例中，利用冲头4对非晶合金电子产品外壳的凸柱结构11进行施压，具体是，冲头4的轴心与通孔21的轴心同轴且位于通孔21的正上方，施压时，冲头4往下移动然后压缩非晶合金电子产品外壳1的凸柱结构11，施压完成后冲头4返回原始位置。另外，冲头4有行程，能确保每次压缩量一致，也不会过度压缩。其中，冲头4与中板2的通孔21之间保持间隙，间隙大小为0.04mm；
本实施例的一种非晶合金电子产品外壳与中板的接合方法，与现有技术相比，本发明是对非晶合金电子产品外壳的凸柱结构加热至(Tg－100℃)～Tg之间然后进行加压一段时间，此温度下非晶合金电子产品外壳的结构不会发生质变，即仍保持非晶合金结构，进而能够避免非晶合金电子产品外壳发生氧化及结晶化反应。另外，该非晶合金电子产品外壳与中板的接合方法能够降低生产投入，缩短生产周期，并能够使得非晶合金电子产品外壳与中板之间的结合强度好，且具有能大量生产性、高生产效率和较低生产成本的优点。
实施例4。
见图5。一种非晶合金电子产品外壳与中板的接合方法，它包括以下步骤：
步骤一，预结合：将非晶合金电子产品外壳与中板2进行预结合，其中，非晶合金电子产品外壳具有凸柱结构11，中板2开设有通孔21；非晶合金电子产品外壳的凸柱结构11套入中板2的通孔21中，并通过夹治具锁紧以使得非晶合金电子产品外壳与中板2进行预结合，得到预结合的整体；本实施例中，凸柱结构11为实心圆台；其中，中板2的通孔的上部设置有倒角结构201；
本实施例中，当预结合时，非晶合金电子产品外壳1的凸柱结构11的高度大于中板2的通孔21的深度，当完成接合后，非晶合金电子产品外壳1的凸柱结构11套入中板2的通孔21中的深度为等于或小于通孔21的深度；其中，非晶合金电子产品外壳1的凸柱结构11与中板2的通孔21之间为过度配合。
其中，夹治具包括治具底座和治具上盖，非晶合金电子产品外壳的凸柱结构套入中板的通孔21中后，治具底座用于放置非晶合金电子产品外壳，治具上盖压住中板，通过治具底座和治具上盖的压合锁紧使得非晶合金电子产品外壳与中板进行预结合。
步骤二，加热：将步骤一得到的预结合的整体放入腔室内，并利用加热装置对非晶合金电子产品外壳的凸柱结构进行加热到(Tg－100℃)～Tg之间；本实施例中，具体加热方式为电阻加热；本实施例中，加热时间为10s；
步骤三，施压：利用冲头4对非晶合金电子产品外壳的凸柱结构11进行施压6s，以使得非晶合金电子产品外壳的凸柱结构11发生塑形变形并填充中板2的通孔21；本实施例中，利用冲头4对非晶合金电子产品外壳的凸柱结构11进行施压的压力为20N；其中，冲头4能够在XYZ三个维度并以360度的方向进行移动施压；凸柱结构11能够在XYZ三个维度并以360度的方向进行移动施压。
本实施例中，利用冲头4对非晶合金电子产品外壳的凸柱结构11进行施压，具体是，冲头4的轴心与通孔21的轴心同轴且位于通孔21的正上方，施压时，冲头4往下移动然后压缩非晶合金电子产品外壳1的凸柱结构11，施压完成后冲头4返回原始位置。另外，冲头4有行程，能确保每次压缩量一致，也不会过度压缩。其中，冲头4与中板2的通孔21之间保持间隙，间隙大小为0.04mm；
本实施例的一种非晶合金电子产品外壳与中板的接合方法，与现有技术相比，本发明是对非晶合金电子产品外壳的凸柱结构加热至(Tg－100℃)～Tg之间然后进行加压一段时间，此温度下非晶合金电子产品外壳的结构不会发生质变，即仍保持非晶合金结构，进而能够避免非晶合金电子产品外壳发生氧化及结晶化反应。另外，该非晶合金电子产品外壳与中板的接合方法能够降低生产投入，缩短生产周期，并能够使得非晶合金电子产品外壳与中板之间的结合强度好，且具有能大量生产性、高生产效率和较低生产成本的优点。
实施例5。
见图6。一种非晶合金电子产品外壳与中板的接合方法，它包括以下步骤：
步骤一，预结合：将非晶合金电子产品外壳与中板2进行预结合，其中，非晶合金电子产品外壳具有凸柱结构11，中板2开设有通孔21；非晶合金电子产品外壳的凸柱结构11套入中板2的通孔21中，并通过夹治具锁紧以使得非晶合金电子产品外壳与中板2进行预结合，得到预结合的整体；本实施例中，凸柱结构11为空心圆柱；其中，中板2的通孔的上部设置有倒角结构201；
本实施例中，当预结合时，非晶合金电子产品外壳1的凸柱结构11的高度大于中板2的通孔21的深度，当完成接合后，非晶合金电子产品外壳1的凸柱结构11套入中板2的通孔21中的深度为等于或小于通孔21的深度；其中，非晶合金电子产品外壳的凸柱结构11与中板2的通孔21之间为间隙配合。
其中，夹治具包括治具底座和治具上盖，非晶合金电子产品外壳的凸柱结构套入中板的通孔中后，治具底座用于放置非晶合金电子产品外壳，治具上盖压住中板，通过治具底座和治具上盖的压合锁紧使得非晶合金电子产品外壳与中板进行预结合。
步骤二，加热：将步骤一得到的预结合的整体放入腔室内，并利用加热装置对非晶合金电子产品外壳的凸柱结构11进行加热到(Tg－100℃)～Tg之间；本实施例中，具体加热方式为电磁感应加热；本实施例中，加热时间为2s；
步骤三，施压：利用冲头4对非晶合金电子产品外壳的凸柱结构11进行施压3s，以使得非晶合金电子产品外壳的凸柱结构11发生塑形变形并填充中板2的通孔21；本实施例中，利用冲头4对非晶合金电子产品外壳的凸柱结构11进行施压的压力为0.1N；其中，冲头4能够在XYZ三个维度并以360度的方向进行移动施压；凸柱结构11能够在XYZ三个维度并以360度的方向进行移动施压。
本实施例中，利用冲头4对非晶合金电子产品外壳的凸柱结构11进行施压，具体是，冲头4的轴心与通孔21的轴心同轴且位于通孔21的正上方，施压时，冲头4往下移动然后压缩非晶合金电子产品外壳的凸柱结构11，施压完成后冲头4返回原始位置。另外，冲头4有行程，能确保每次压缩量一致，也不会过度压缩。其中，冲头4与中板2的通孔21之间保持间隙，间隙大小为0.03mm；
本实施例的一种非晶合金电子产品外壳与中板的接合方法，与现有技术相比，本发明是对非晶合金电子产品外壳的凸柱结构加热至(Tg－100℃)～Tg之间然后进行加压一段时间，此温度下非晶合金电子产品外壳的结构不会发生质变，即仍保持非晶合金结构，进而能够避免非晶合金电子产品外壳发生氧化及结晶化反应。另外，该非晶合金电子产品外壳与中板的接合方法能够降低生产投入，缩短生产周期，并能够使得非晶合金电子产品外壳与中板之间的结合 强度好，且具有能大量生产性、高生产效率和较低生产成本的优点。
实施例6。
见图7。一种非晶合金电子产品外壳与中板的接合方法，它包括以下步骤：
步骤一，预结合：将非晶合金电子产品外壳与中板2进行预结合，其中，非晶合金电子产品外壳具有凸柱结构11，中板2开设有通孔21；非晶合金电子产品外壳的凸柱结构11套入中板2的通孔21中，并通过夹治具锁紧以使得非晶合金电子产品外壳与中板2进行预结合，得到预结合的整体；本实施例中，凸柱结构11为空心圆柱；其中，中板2的通孔的上部设置有倒角结构201；
本实施例中，当预结合时，非晶合金电子产品外壳1的凸柱结构11的高度大于中板2的通孔21的深度，当完成接合后，非晶合金电子产品外壳1的凸柱结构11套入中板2的通孔21中的深度为等于或小于通孔21的深度；其中，非晶合金电子产品外壳的凸柱结构11与中板2的通孔21之间为间隙配合。
其中，夹治具包括治具底座和治具上盖，非晶合金电子产品外壳的凸柱结构套入中板的通孔中后，治具底座用于放置非晶合金电子产品外壳，治具上盖压住中板，通过治具底座和治具上盖的压合锁紧使得非晶合金电子产品外壳与中板进行预结合。
步骤二，加热：将步骤一得到的预结合的整体放入腔室内，并利用加热装置对非晶合金电子产品外壳的凸柱结构11进行加热到(Tg－100℃)～Tg之间；本实施例中，具体加热方式为电磁感应加热；本实施例中，加热时间为2s；
步骤三，施压：利用冲头4对非晶合金电子产品外壳的凸柱结构11进行施压3s，以使得非晶合金电子产品外壳的凸柱结构11发生塑形变形并填充中板2的通孔21；本实施例中，利用冲头4对非晶合金电子产品外壳的凸柱结构11进行施压的压力为0.1N；其中，冲头4能够在XYZ三个维度并以360度的方向进行移动施压；凸柱结构11能够在XYZ三个维度并以360度的方向进行移动施压。
本实施例中，利用冲头4对非晶合金电子产品外壳的凸柱结构11进行施压，具体是，冲头4的轴心与通孔21的轴心同轴且位于通孔21的正上方，施压时，冲头4往下移动然后压缩非晶合金电子产品外壳的凸柱结构11，施压完成后冲头4返回原始位置。另外，冲头4有行程，能确保每次压缩量一致，也 不会过度压缩。其中，冲头4与中板2的通孔21之间保持间隙，间隙大小为0.03mm；
本实施例的一种非晶合金电子产品外壳与中板的接合方法，与现有技术相比，本发明是对非晶合金电子产品外壳的凸柱结构加热至(Tg－100℃)～Tg之间然后进行加压一段时间，此温度下非晶合金电子产品外壳的结构不会发生质变，即仍保持非晶合金结构，进而能够避免非晶合金电子产品外壳发生氧化及结晶化反应。另外，该非晶合金电子产品外壳与中板的接合方法能够降低生产投入，缩短生产周期，并能够使得非晶合金电子产品外壳与中板之间的结合强度好，且具有能大量生产性、高生产效率和较低生产成本的优点。
实施例7。
一种非晶合金电子产品外壳与中板的接合方法，它包括以下步骤：
步骤一，预结合：将非晶合金电子产品外壳与中板进行预结合，其中，非晶合金电子产品外壳具有凸柱结构，中板开设有通孔；非晶合金电子产品外壳的凸柱结构套入中板的通孔中，并通过夹治具锁紧以使得非晶合金电子产品外壳与中板进行预结合，得到预结合的整体；本实施例中，凸柱结构为空心圆台；其中，中板2的通孔的上部设置有倒角结构201；
本实施例中，当预结合时，非晶合金电子产品外壳1的凸柱结构11的高度大于中板2的通孔21的深度，当完成接合后，非晶合金电子产品外壳1的凸柱结构11套入中板2的通孔21中的深度为等于或小于通孔21的深度；其中，非晶合金电子产品外壳的凸柱结构与中板的通孔之间为过度配合。
其中，夹治具包括治具底座和治具上盖，非晶合金电子产品外壳的凸柱结构套入中板的通孔中后，治具底座用于放置非晶合金电子产品外壳，治具上盖压住中板，通过治具底座和治具上盖的压合锁紧使得非晶合金电子产品外壳与中板进行预结合。
步骤二，加热：将步骤一得到的预结合的整体放入腔室内，并利用加热装置对非晶合金电子产品外壳的凸柱结构进行加热到(Tg－100℃)～Tg之间；本实施例中，具体加热方式为红外线加热；本实施例中，加热时间为60s；
步骤三，施压：利用冲头对非晶合金电子产品外壳的凸柱结构进行施压20s，以使得非晶合金电子产品外壳的凸柱结构发生塑形变形并填充中板的通 孔；本实施例中，利用冲头对非晶合金电子产品外壳的凸柱结构进行施压的压力为80N；其中，冲头4能够在XYZ三个维度并以360度的方向进行移动施压；凸柱结构11能够在XYZ三个维度并以360度的方向进行移动施压。
本实施例中，利用冲头对非晶合金电子产品外壳的凸柱结构进行施压，具体是，冲头的轴心与通孔的轴心同轴且位于通孔的正上方，施压时，冲头往下移动然后压缩非晶合金电子产品外壳的凸柱结构，施压完成后冲头返回原始位置。另外，冲头有行程，能确保每次压缩量一致，也不会过度压缩。其中，冲头与中板的通孔之间保持间隙，间隙大小为0.07mm；
本实施例的一种非晶合金电子产品外壳与中板的接合方法，与现有技术相比，本发明是对非晶合金电子产品外壳的凸柱结构加热至(Tg－100℃)～Tg之间然后进行加压一段时间，此温度下非晶合金电子产品外壳的结构不会发生质变，即仍保持非晶合金结构，进而能够避免非晶合金电子产品外壳发生氧化及结晶化反应。另外，该非晶合金电子产品外壳与中板的接合方法能够降低生产投入，缩短生产周期，并能够使得非晶合金电子产品外壳与中板之间的结合强度好，且具有能大量生产性、高生产效率和较低生产成本的优点。
实施例8。
一种非晶合金电子产品外壳与中板的接合方法，它包括以下步骤：
步骤一，预结合：将非晶合金电子产品外壳与中板进行预结合，其中，非晶合金电子产品外壳具有凸柱结构，中板开设有通孔；非晶合金电子产品外壳的凸柱结构套入中板的通孔中，并通过夹治具锁紧以使得非晶合金电子产品外壳与中板进行预结合，得到预结合的整体；本实施例中，凸柱结构为实心圆锥；其中，中板2的通孔的上部设置有倒角结构201；
本实施例中，当预结合时，非晶合金电子产品外壳1的凸柱结构11的高度大于中板2的通孔21的深度，当完成接合后，非晶合金电子产品外壳1的凸柱结构11套入中板2的通孔21中的深度为等于或小于通孔21的深度；其中，非晶合金电子产品外壳的凸柱结构与中板的通孔之间为间隙配合。
其中，夹治具包括治具底座和治具上盖，非晶合金电子产品外壳的凸柱结构套入中板的通孔中后，治具底座用于放置非晶合金电子产品外壳，治具上盖压住中板，通过治具底座和治具上盖的压合锁紧使得非晶合金电子产品外壳与 中板进行预结合。
步骤二，加热：将步骤一得到的预结合的整体放入腔室内，并利用加热装置对非晶合金电子产品外壳的凸柱结构进行加热到(Tg－100℃)～Tg之间；本实施例中，具体加热方式为电磁感应加热；本实施例中，加热时间为20s；
步骤三，施压：利用冲头对非晶合金电子产品外壳的凸柱结构进行施压15s，以使得非晶合金电子产品外壳的凸柱结构发生塑形变形并填充中板的通孔；本实施例中，利用冲头对非晶合金电子产品外壳的凸柱结构进行施压的压力为70N；其中，冲头4能够在XYZ三个维度并以360度的方向进行移动施压；凸柱结构11能够在XYZ三个维度并以360度的方向进行移动施压。
本实施例中，利用冲头对非晶合金电子产品外壳的凸柱结构进行施压，具体是，冲头的轴心与通孔的轴心同轴且位于通孔的正上方，施压时，冲头往下移动然后压缩非晶合金电子产品外壳的凸柱结构，施压完成后冲头返回原始位置。另外，冲头有行程，能确保每次压缩量一致，也不会过度压缩。其中，冲头与中板的通孔之间保持间隙，间隙大小为0.06mm；
本实施例的一种非晶合金电子产品外壳与中板的接合方法，与现有技术相比，本发明是对非晶合金电子产品外壳的凸柱结构加热至(Tg－100℃)～Tg之间然后进行加压一段时间，此温度下非晶合金电子产品外壳的结构不会发生质变，即仍保持非晶合金结构，进而能够避免非晶合金电子产品外壳发生氧化及结晶化反应。另外，该非晶合金电子产品外壳与中板的接合方法能够降低生产投入，缩短生产周期，并能够使得非晶合金电子产品外壳与中板之间的结合强度好，且具有能大量生产性、高生产效率和较低生产成本的优点。
实施例9。
一种非晶合金电子产品外壳与中板的接合方法，它包括以下步骤：
步骤一，预结合：将非晶合金电子产品外壳与中板进行预结合，其中，非晶合金电子产品外壳具有凸柱结构，中板开设有通孔；非晶合金电子产品外壳的凸柱结构套入中板的通孔中，并通过夹治具锁紧以使得非晶合金电子产品外壳与中板进行预结合，得到预结合的整体；本实施例中，凸柱结构为实心长方体；其中，中板2的通孔的上部设置有圆凹结构202；
本实施例中，当预结合时，非晶合金电子产品外壳1的凸柱结构11的高 度大于中板2的通孔21的深度，当完成接合后，非晶合金电子产品外壳1的凸柱结构11套入中板2的通孔21中的深度为等于或小于通孔21的深度；其中，非晶合金电子产品外壳的凸柱结构与中板的通孔之间为过度配合。
其中，夹治具包括治具底座和治具上盖，非晶合金电子产品外壳的凸柱结构套入中板的通孔中后，治具底座用于放置非晶合金电子产品外壳，治具上盖压住中板，通过治具底座和治具上盖的压合锁紧使得非晶合金电子产品外壳与中板进行预结合。
步骤二，加热：将步骤一得到的预结合的整体放入腔室内，并利用加热装置对非晶合金电子产品外壳的凸柱结构进行加热到(Tg－100℃)～Tg之间；本实施例中，具体加热方式为红外线加热；本实施例中，加热时间为50s；
步骤三，施压：利用冲头对非晶合金电子产品外壳的凸柱结构进行施压8s，以使得非晶合金电子产品外壳的凸柱结构发生塑形变形并填充中板的通孔；本实施例中，利用冲头对非晶合金电子产品外壳的凸柱结构进行施压的压力为60N；其中，冲头4能够在XYZ三个维度并以360度的方向进行移动施压；凸柱结构11能够在XYZ三个维度并以360度的方向进行移动施压。
本实施例中，利用冲头对非晶合金电子产品外壳的凸柱结构进行施压，具体是，冲头的轴心与通孔的轴心同轴且位于通孔的正上方，施压时，冲头往下移动然后压缩非晶合金电子产品外壳的凸柱结构，施压完成后冲头返回原始位置。另外，冲头有行程，能确保每次压缩量一致，也不会过度压缩。其中，冲头与中板的通孔之间保持间隙，间隙大小为0.05mm；
本实施例的一种非晶合金电子产品外壳与中板的接合方法，与现有技术相比，本发明是对非晶合金电子产品外壳的凸柱结构加热至(Tg－100℃)～Tg之间然后进行加压一段时间，此温度下非晶合金电子产品外壳的结构不会发生质变，即仍保持非晶合金结构，进而能够避免非晶合金电子产品外壳发生氧化及结晶化反应。另外，该非晶合金电子产品外壳与中板的接合方法能够降低生产投入，缩短生产周期，并能够使得非晶合金电子产品外壳与中板之间的结合强度好，且具有能大量生产性、高生产效率和较低生产成本的优点。
实施例10。
一种非晶合金电子产品外壳与中板的接合方法，它包括以下步骤：
步骤一，预结合：将非晶合金电子产品外壳与中板进行预结合，其中，非晶合金电子产品外壳具有凸柱结构，中板开设有通孔；非晶合金电子产品外壳的凸柱结构套入中板的通孔中，并通过夹治具锁紧以使得非晶合金电子产品外壳与中板进行预结合，得到预结合的整体；本实施例中，凸柱结构为空心长方体；其中，中板2的通孔的孔壁面设置有小槽或凹坑结构203，其中，小槽或凹坑结构的内壁面进行粗糙化处理，例如喷砂处理；
本实施例中，当预结合时，非晶合金电子产品外壳1的凸柱结构11的高度大于中板2的通孔21的深度，当完成接合后，非晶合金电子产品外壳1的凸柱结构11套入中板2的通孔21中的深度为等于或小于通孔21的深度；其中，非晶合金电子产品外壳的凸柱结构与中板的通孔之间为间隙配合。
其中，夹治具包括治具底座和治具上盖，非晶合金电子产品外壳的凸柱结构套入中板的通孔中后，治具底座用于放置非晶合金电子产品外壳，治具上盖压住中板，通过治具底座和治具上盖的压合锁紧使得非晶合金电子产品外壳与中板进行预结合。
步骤二，加热：将步骤一得到的预结合的整体放入腔室内，并利用加热装置对非晶合金电子产品外壳的凸柱结构进行加热到100℃～Tg之间；本实施例中，具体加热方式为电阻加热；本实施例中，加热时间为40s；
步骤三，施压：利用冲头对非晶合金电子产品外壳的凸柱结构进行施压17s，以使得非晶合金电子产品外壳的凸柱结构发生塑形变形并填充中板的通孔；本实施例中，利用冲头对非晶合金电子产品外壳的凸柱结构进行施压的压力为30N；其中，冲头4能够在XYZ三个维度并以360度的方向进行移动施压；凸柱结构11能够在XYZ三个维度并以360度的方向进行移动施压。
本实施例中，利用冲头对非晶合金电子产品外壳的凸柱结构进行施压，具体是，冲头的轴心与通孔的轴心同轴且位于通孔的正上方，施压时，冲头往下移动然后压缩非晶合金电子产品外壳的凸柱结构，施压完成后冲头返回原始位置。另外，冲头有行程，能确保每次压缩量一致，也不会过度压缩。其中，冲头与中板的通孔之间保持间隙，间隙大小为0.03mm；
本实施例的一种非晶合金电子产品外壳与中板的接合方法，与现有技术相比，本发明是对非晶合金电子产品外壳的凸柱结构加热至(Tg－100℃)～Tg 之间然后进行加压一段时间，此温度下非晶合金电子产品外壳的结构不会发生质变，即仍保持非晶合金结构，进而能够避免非晶合金电子产品外壳发生氧化及结晶化反应。另外，该非晶合金电子产品外壳与中板的接合方法能够降低生产投入，缩短生产周期，并能够使得非晶合金电子产品外壳与中板之间的结合强度好，且具有能大量生产性、高生产效率和较低生产成本的优点。
其中，常用合金的玻璃转化温度如表1所示。
表1常用合金的玻璃转化温度
Figure PCTCN2017103969-appb-000001
其中，本发明的一种非晶合金电子产品外壳与中板的接合方法的实施例1至10，所制得的铆接产品的结合拉拔力的测试数据如表2所示。
表2结合拉拔力测试数据对比表
Figure PCTCN2017103969-appb-000002
最后应当说明的是，以上实施例仅用以说明本发明的技术方案，而非对本发明保护范围的限制，尽管参照较佳实施例对本发明作了详细地说明，本领域的普通技术人员应当理解，可以对本发明的技术方案进行修改或者等同替换，而不脱离本发明技术方案的实质和范围。

Claims (10)

  1. 一种非晶合金电子产品外壳与中板的接合方法，其特征在于：它包括以下步骤：
    步骤一，预结合：将非晶合金电子产品外壳与中板进行预结合，其中，所述非晶合金电子产品外壳具有凸柱结构，所述中板开设有通孔；所述非晶合金电子产品外壳的凸柱结构套入所述中板的通孔中，并通过夹治具锁紧以使得所述非晶合金电子产品外壳与所述中板进行预结合，得到预结合的整体；
    所述中板的通孔的上部设置有倒角结构或圆凹结构，或者，所述中板的通孔的孔壁面设置有小槽或凹坑结构；
    所述小槽或凹坑结构的内壁面进行粗糙化处理；
    步骤二，加热：将步骤一得到的预结合的整体放入腔室内，并对非晶合金电子产品外壳的凸柱结构进行加热到(Tg－100℃)～Tg之间或者加热到100℃～Tg；
    步骤三，施压：利用冲头对非晶合金电子产品外壳的凸柱结构进行施压一定时间，以使得非晶合金电子产品外壳的凸柱结构发生塑形变形并填充所述中板的通孔；所述冲头能够在XYZ三个维度并以360度的方向进行移动施压；
    步骤四，冷却定型：步骤三的施压完成后，进行冷却定型，即完成非晶合金电子产品外壳与中板的接合。
  2. 根据权利要求1所述的一种非晶合金电子产品外壳与中板的接合方法，其特征在于：所述凸柱结构为实心圆柱、空心圆柱、实心圆台、空心圆台、实心圆锥、实心长方体或空心长方体中的一种；所述凸柱结构能够在XYZ三个维度并以360度的方向进行移动施压。
  3. 根据权利要求1所述的一种非晶合金电子产品外壳与中板的接合方法，其特征在于：所述步骤一预结合步骤中，当预结合时，所述非晶合金电子产品外壳的凸柱结构的高度大于所述中板的通孔的深度，当完成接合后，所述非晶合金电子产品外壳的凸柱结构套入所述中板的通孔中的深度为等于或小于所述通孔的深度；
    所述非晶合金电子产品外壳的凸柱结构与所述中板的通孔之间为间隙配 合或者过度配合。
  4. 根据权利要求1所述的一种非晶合金电子产品外壳与中板的接合方法，其特征在于：所述步骤二加热步骤中，利用加热装置对非晶合金电子产品外壳的凸柱结构进行加热，具体加热方式为以感应加热、电阻加热或者红外线加热的方式先加热冲头,再以冲头移动接触非晶合金电子产品外壳的凸柱结构以传递热量给凸柱结构，使得凸柱结构温度达到制程温度，并且当凸柱结构加热到(Tg－100℃)～Tg时，过程中增加惰性气氛进行吹气以实现局部保护，防止非晶合金氧化或晶化，进而冲头继续下压凸柱结构，使得凸柱结构受压力而流动并填充中板的通孔，然后撤回冲头完成结合。
  5. 根据权利要求1所述的一种非晶合金电子产品外壳与中板的接合方法，其特征在于：所述步骤二加热步骤中，利用加热装置对非晶合金电子产品外壳的凸柱结构进行加热的时间为2s～60s。
  6. 根据权利要求1所述的一种非晶合金电子产品外壳与中板的接合方法，其特征在于：所述步骤三施压步骤中，利用冲头对非晶合金电子产品外壳的凸柱结构进行施压的压力为0.1N～80N，施压的时间为3s～20s。
  7. 根据权利要求1所述的一种非晶合金电子产品外壳与中板的接合方法，其特征在于：所述步骤三施压步骤中，利用冲头对非晶合金电子产品外壳的凸柱结构进行施压，具体是，冲头的轴心与通孔的轴心同轴且位于通孔的正上方，施压时，冲头往下移动然后压缩所述非晶合金电子产品外壳的凸柱结构，施压完成后冲头返回原始位置。
  8. 根据权利要求7所述的一种非晶合金电子产品外壳与中板的接合方法，其特征在于：所述步骤三施压步骤中，所述冲头与所述中板的通孔之间保持间隙，间隙大小为0.03mm～0.07mm。
  9. 根据权利要求1所述的一种非晶合金电子产品外壳与中板的接合方法，其特征在于：所述步骤四冷却定型步骤中，利用自然冷却的方式进行冷却定型。
  10. 根据权利要求1所述的一种非晶合金电子产品外壳与中板的接合方法，其特征在于：所述步骤一预结合步骤中，所述夹治具包括治具底座和治具上盖，非晶合金电子产品外壳的凸柱结构套入所述中板的通孔中后，所述治具底座用于放置非晶合金电子产品外壳，所述治具上盖压住所述中板，通过所述治具底 座和所述治具上盖的压合锁紧使得所述非晶合金电子产品外壳与所述中板进行预结合。
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CN106825887A (zh) * 2017-02-24 2017-06-13 东莞帕姆蒂昊宇液态金属有限公司 一种非晶合金电子产品外壳与中板的接合方法

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