JP4662689B2 - 取外し可能な電磁波障害シールド - Google Patents
取外し可能な電磁波障害シールド Download PDFInfo
- Publication number
- JP4662689B2 JP4662689B2 JP2002568876A JP2002568876A JP4662689B2 JP 4662689 B2 JP4662689 B2 JP 4662689B2 JP 2002568876 A JP2002568876 A JP 2002568876A JP 2002568876 A JP2002568876 A JP 2002568876A JP 4662689 B2 JP4662689 B2 JP 4662689B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- emi shield
- shield
- substrate
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
- H05K9/0035—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids with retainers mounted beforehand on the PCB, e.g. clips
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Telephone Function (AREA)
- Fittings On The Vehicle Exterior For Carrying Loads, And Devices For Holding Or Mounting Articles (AREA)
Description
Claims (18)
- (a)表面上に少なくとも一つの電気素子が配置された基板と、
(b)該少なくとも一つの電気素子を包囲するように該基板の表面上にパターンの形で配置された、互いに別個の複数の導電性固締ユニットと、
(c)誘電材料層と、該誘電材料層の外面上に拡がる導電層とを具備したEMIシールドと、
(d)前記導電性固締ユニットの前記パターンに対応するように該EMIシールドに形成された複数の開口とを具備し、
(e)少なくとも一つの前記開口が接触領域を有すると共に、前記EMIシールドの前記誘電材料層と前記導電層との両方が前記開口の前記接触領域において、前記接触領域が少なくとも一つの前記導電性固締ユニットと係合しこれを保持できるようにするのに必要な程度まで撓むことができ、
(f)前記EMIシールドの前記導電層が前記接触領域において、少なくとも一つの前記導電性固締ユニットと電気的に接触しており、
前記導電性固締ユニットが前記EMIシールドに取り外し可能に取り付けられ、
前記開口は、最初は前記導電性固締ユニットよりも大きいが、前記導電性固締ユニットが通り抜けた後にはこれよりも小さくなるように再形成される、
装置。 - 少なくとも一つの前記導電性固締ユニットがはんだ球である請求項1に記載の装置。
- 前記基板がその上に配置されたグラウンドトレースを有し、少なくとも一つの前記はんだ球が該基板上の該グラウンドトレースにはんだ付けされる請求項2に記載の装置。
- 少なくとも一つの前記はんだ球が前記EMIシールドの前記接触領域に締まり接触している請求項3に記載の装置。
- 前記誘電材料層の前記外面上に前記導電層が配置される請求項1に記載の装置。
- 前記導電層が、アルミニウム、スズ、金、ニッケル、銀、銅、並びにそれらの複合体及び合金からなるグループの中から選択される請求項5に記載の装置。
- 前記導電層が箔である請求項1に記載の装置。
- 前記導電層が、スパッタリング、真空蒸着、気相蒸着、無電解メッキ、及び電解メッキのグループの中から選択されたプロセスによって形成される請求項1に記載の装置。
- 前記基板が複数の電気素子を有し、前記EMIシールドが更に、これら複数の電気素子を覆うようになっている複数のコンパートメントを具備した請求項1に記載の装置。
- 前記導電性固締ユニットが前記EMIシールドを貫通すると前記開口が形成される請求項1に記載の装置。
- 基板のためのEMIシールドにおいて、該基板が、該基板の表面上に配置された少なくとも一つの電気素子と、該少なくとも一つの電気素子を包囲するように該基板の表面上にパターンの形で配置された、互いに別個の複数の導電性固締ユニットとを有しており、前記導電性固締ユニットが前記EMIシールドに取り外し可能に取り付けられ、
該EMIシールドが、
(a)内面及び外面を有する誘電材料層と、
(b)該外面上に拡がる導電層と、
(c)前記導電性固締ユニットの前記パターンに対応するように前記EMIシールドに形成された複数の開口とを具備し、
(d)少なくとも一つの前記開口が接触領域を有すると共に、前記EMIシールドの前記誘電材料層と前記導電層との両方が前記開口の前記接触領域において、前記接触領域が少なくとも一つの前記導電性固締ユニットと係合しこれを保持できるようにするのに必要な程度まで撓むことができ、
(e)前記EMIシールドの前記導電層が前記接触領域において、少なくとも一つの前記導電性固締ユニットと電気的に接触しており、
前記開口は、最初は前記導電性固締ユニットよりも大きいが、前記導電性固締ユニットが通り抜けた後にはこれよりも小さくなるように再形成される、
EMIシールド。 - 前記誘電材料層の前記外面上に前記導電層が配置される請求項11に記載のEMIシールド。
- 前記導電層が、アルミニウム、スズ、金、ニッケル、銀、銅、並びにそれらの複合体及び合金からなるグループの中から選択される請求項12に記載のEMIシールド。
- 前記導電層が箔である請求項11に記載のEMIシールド。
- 前記導電層が、スパッタリング、真空蒸着、気相蒸着、無電解メッキ、及び電解メッキのグループの中から選択されたプロセスによって形成される請求項11に記載のEMIシールド。
- 前記基板が複数の電気素子を有し、前記EMIシールドが更に、これら複数の電気素子を覆うようになっている複数のコンパートメントを具備した請求項11に記載のEMIシールド。
- 少なくとも一つの前記導電性固締ユニットが前記EMIシールドを貫通すると少なくとも一つの前記開口が形成される請求項11に記載のEMIシールド。
- (a)表面上に少なくとも一つの電気素子が配置された基板と、
(b)該少なくとも一つの電気素子を包囲するように該基板の表面上に配置された複数のはんだ球と、
(c)該少なくとも一つの電気素子を覆うようになっている少なくとも一つのコンパートメントを具備し、更に、誘電材料層と、該誘電材料層の外面上に拡がる導電層とを具備したEMIシールドと、を具備し、
(d)該EMIシールドの該導電層が少なくとも一つの前記はんだ球と電気的に接触しており、かつ、前記EMIシールドと前記はんだ球が結合して電磁放射線が前記少なくとも一つのコンパートメントに入り又はそこから出るのを制限し、
前記はんだ球が前記EMIシールドに取り外し可能に取り付けられ、
前記開口は、最初は前記導電性固締ユニットよりも大きいが、前記導電性固締ユニットが通り抜けた後にはこれよりも小さくなるように再形成される、
装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/793,754 US6377475B1 (en) | 2001-02-26 | 2001-02-26 | Removable electromagnetic interference shield |
PCT/US2002/005705 WO2002069687A1 (en) | 2001-02-26 | 2002-02-15 | Removable electromagnetic interference shield |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004522298A JP2004522298A (ja) | 2004-07-22 |
JP4662689B2 true JP4662689B2 (ja) | 2011-03-30 |
Family
ID=25160708
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002568876A Expired - Fee Related JP4662689B2 (ja) | 2001-02-26 | 2002-02-15 | 取外し可能な電磁波障害シールド |
Country Status (17)
Country | Link |
---|---|
US (1) | US6377475B1 (ja) |
EP (1) | EP1364565B1 (ja) |
JP (1) | JP4662689B2 (ja) |
KR (1) | KR100507818B1 (ja) |
CN (1) | CN100341389C (ja) |
AT (1) | ATE372046T1 (ja) |
AU (1) | AU2002250184B2 (ja) |
BR (1) | BR0207558A (ja) |
CA (1) | CA2439065C (ja) |
DE (1) | DE60222096T2 (ja) |
HK (1) | HK1060815A1 (ja) |
HU (1) | HU227656B1 (ja) |
IL (2) | IL157410A0 (ja) |
MX (1) | MXPA03007606A (ja) |
NO (1) | NO334972B1 (ja) |
PL (1) | PL204563B1 (ja) |
WO (1) | WO2002069687A1 (ja) |
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-
2001
- 2001-02-26 US US09/793,754 patent/US6377475B1/en not_active Expired - Lifetime
-
2002
- 2002-02-15 CN CNB028055411A patent/CN100341389C/zh not_active Expired - Fee Related
- 2002-02-15 AT AT02719079T patent/ATE372046T1/de not_active IP Right Cessation
- 2002-02-15 HU HU0303300A patent/HU227656B1/hu unknown
- 2002-02-15 JP JP2002568876A patent/JP4662689B2/ja not_active Expired - Fee Related
- 2002-02-15 EP EP02719079A patent/EP1364565B1/en not_active Expired - Lifetime
- 2002-02-15 WO PCT/US2002/005705 patent/WO2002069687A1/en active IP Right Grant
- 2002-02-15 KR KR10-2003-7011128A patent/KR100507818B1/ko active IP Right Grant
- 2002-02-15 DE DE60222096T patent/DE60222096T2/de not_active Expired - Lifetime
- 2002-02-15 MX MXPA03007606A patent/MXPA03007606A/es unknown
- 2002-02-15 IL IL15741002A patent/IL157410A0/xx not_active IP Right Cessation
- 2002-02-15 CA CA002439065A patent/CA2439065C/en not_active Expired - Fee Related
- 2002-02-15 BR BR0207558-0A patent/BR0207558A/pt not_active Application Discontinuation
- 2002-02-15 AU AU2002250184A patent/AU2002250184B2/en not_active Ceased
- 2002-02-15 PL PL364597A patent/PL204563B1/pl unknown
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2003
- 2003-08-14 IL IL157410A patent/IL157410A/en unknown
- 2003-08-25 NO NO20033771A patent/NO334972B1/no not_active IP Right Cessation
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2004
- 2004-05-24 HK HK04103665A patent/HK1060815A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
NO334972B1 (no) | 2014-08-11 |
NO20033771D0 (no) | 2003-08-25 |
AU2002250184B2 (en) | 2004-08-19 |
CN1494822A (zh) | 2004-05-05 |
EP1364565A1 (en) | 2003-11-26 |
CA2439065C (en) | 2009-04-14 |
DE60222096D1 (de) | 2007-10-11 |
PL364597A1 (en) | 2004-12-13 |
US6377475B1 (en) | 2002-04-23 |
MXPA03007606A (es) | 2004-06-30 |
CA2439065A1 (en) | 2002-09-06 |
ATE372046T1 (de) | 2007-09-15 |
KR100507818B1 (ko) | 2005-08-10 |
WO2002069687A9 (en) | 2003-04-10 |
BR0207558A (pt) | 2004-09-14 |
HK1060815A1 (en) | 2004-08-20 |
EP1364565B1 (en) | 2007-08-29 |
IL157410A0 (en) | 2004-03-28 |
JP2004522298A (ja) | 2004-07-22 |
HU227656B1 (en) | 2011-10-28 |
NO20033771L (no) | 2003-10-15 |
PL204563B1 (pl) | 2010-01-29 |
DE60222096T2 (de) | 2008-05-15 |
CN100341389C (zh) | 2007-10-03 |
IL157410A (en) | 2007-06-17 |
WO2002069687A1 (en) | 2002-09-06 |
HUP0303300A3 (en) | 2004-06-28 |
KR20030080036A (ko) | 2003-10-10 |
HUP0303300A2 (hu) | 2003-12-29 |
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