BR0113560A - Método para depósito contìnuo de camadas metálicas por meio de plasma frio e dispositivo para depósito contìnuo de camadas metálicas por meio de plasma frio - Google Patents
Método para depósito contìnuo de camadas metálicas por meio de plasma frio e dispositivo para depósito contìnuo de camadas metálicas por meio de plasma frioInfo
- Publication number
- BR0113560A BR0113560A BR0113560-0A BR0113560A BR0113560A BR 0113560 A BR0113560 A BR 0113560A BR 0113560 A BR0113560 A BR 0113560A BR 0113560 A BR0113560 A BR 0113560A
- Authority
- BR
- Brazil
- Prior art keywords
- cold plasma
- metal
- chamber
- metal layers
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3432—Target-material dispenser
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/246—Replenishment of source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Surface Treatment Of Glass Fibres Or Filaments (AREA)
Abstract
"MéTODO PARA DEPóSITO CONTìNUO DE CAMADAS METáLICAS POR MEIO DE PLASMA FRIO E DISPOSITIVO PARA DEPóSITO CONTìNUO DE CAMADAS METáLICAS POR MEIO DE PLASMA FRIO". Sendo que a presente invenção refere-se a um método e um dispositivo para depositar uma camada de metal em um substrato (1) que consiste de uma deposição com plasma frio dentro de uma câmara de confinamento aquecido (7) de modo a evitar a formação de um depósito de metal em sua superfície, dita câmara (7) possuindo um orifício de entrada (21) e um orifício de saída (22) através do qual o substrato a ser revestido entra e deixa dita câmara, uma fonte de vapor formando um eletrodo, sendo provida em dita câmara permitindo a formação de plasma (6) na mesma, um contra-eletrodo sendo formado pelo substrato (1) ou por um elemento eletricamente condutor separado. A invenção é caracterizada pelo fato de que consiste na introdução de metal, com o qual é formada uma camada de metal no substrato (1), em estado derretido em um tanque de retenção (8) comunicando-se com a câmara de confinamento (7) e mantendo o metal derretido em dito tanque (8) a um nível substancialmente constante enquanto a camada de metal está sendo formada.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00202942A EP1182272A1 (fr) | 2000-08-23 | 2000-08-23 | Procédé et dispositif permettant le dépôt de couches métalliques en continu par plasma froid |
PCT/BE2001/000142 WO2002016664A1 (fr) | 2000-08-23 | 2001-08-23 | Procede et dispositif permettant le depot de couches metalliques en continu par plasma froid |
Publications (1)
Publication Number | Publication Date |
---|---|
BR0113560A true BR0113560A (pt) | 2003-07-08 |
Family
ID=8171943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR0113560-0A BR0113560A (pt) | 2000-08-23 | 2001-08-23 | Método para depósito contìnuo de camadas metálicas por meio de plasma frio e dispositivo para depósito contìnuo de camadas metálicas por meio de plasma frio |
Country Status (8)
Country | Link |
---|---|
US (1) | US7156960B2 (pt) |
EP (2) | EP1182272A1 (pt) |
JP (1) | JP2004507617A (pt) |
AU (1) | AU2001283725A1 (pt) |
BR (1) | BR0113560A (pt) |
CA (1) | CA2420243A1 (pt) |
WO (1) | WO2002016664A1 (pt) |
ZA (1) | ZA200301531B (pt) |
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---|---|---|---|---|
JP4359131B2 (ja) * | 2003-12-08 | 2009-11-04 | 株式会社日立ハイテクノロジーズ | 液体金属イオン銃、及びイオンビーム装置 |
BRPI0418685B1 (pt) * | 2004-03-31 | 2014-04-08 | Pirelli | Processo para produzir um fio de metal |
US20050229856A1 (en) * | 2004-04-20 | 2005-10-20 | Malik Roger J | Means and method for a liquid metal evaporation source with integral level sensor and external reservoir |
WO2008040329A1 (de) * | 2006-09-29 | 2008-04-10 | Von Ardenne Anlagentechnik Gmbh | Vakuumbeschichtungsverfahren und anordnung zur durchführung des verfahrens |
US8951632B2 (en) * | 2007-01-03 | 2015-02-10 | Applied Nanostructured Solutions, Llc | CNT-infused carbon fiber materials and process therefor |
US8951631B2 (en) * | 2007-01-03 | 2015-02-10 | Applied Nanostructured Solutions, Llc | CNT-infused metal fiber materials and process therefor |
US20100279569A1 (en) * | 2007-01-03 | 2010-11-04 | Lockheed Martin Corporation | Cnt-infused glass fiber materials and process therefor |
US8158217B2 (en) * | 2007-01-03 | 2012-04-17 | Applied Nanostructured Solutions, Llc | CNT-infused fiber and method therefor |
US20120189846A1 (en) * | 2007-01-03 | 2012-07-26 | Lockheed Martin Corporation | Cnt-infused ceramic fiber materials and process therefor |
US9005755B2 (en) | 2007-01-03 | 2015-04-14 | Applied Nanostructured Solutions, Llc | CNS-infused carbon nanomaterials and process therefor |
EP1972699A1 (fr) * | 2007-03-20 | 2008-09-24 | ArcelorMittal France | Procede de revetement d'un substrat et installation de depot sous vide d'alliage metallique |
US10039927B2 (en) | 2007-04-23 | 2018-08-07 | Plasmology4, Inc. | Cold plasma treatment devices and associated methods |
US20090081441A1 (en) * | 2007-09-20 | 2009-03-26 | Lockheed Martin Corporation | Fiber Tow Comprising Carbon-Nanotube-Infused Fibers |
US20090081383A1 (en) * | 2007-09-20 | 2009-03-26 | Lockheed Martin Corporation | Carbon Nanotube Infused Composites via Plasma Processing |
EP2048261A1 (fr) * | 2007-10-12 | 2009-04-15 | ArcelorMittal France | Générateur de vapeur industriel pour le dépôt d'un revêtement d'alliage sur une bande métallique |
BE1017852A3 (fr) * | 2007-11-19 | 2009-09-01 | Ind Plasma Services & Technologies Ipst Gmbh | Procede et installation de galvanisation par evaporation plasma. |
US8323408B2 (en) * | 2007-12-10 | 2012-12-04 | Solopower, Inc. | Methods and apparatus to provide group VIA materials to reactors for group IBIIIAVIA film formation |
JP5740552B2 (ja) * | 2007-12-21 | 2015-06-24 | アドヴァンスト ガルヴァニゼイション アーゲー | 真空蒸発法における蒸気流を制御するための方法及び装置 |
BE1017912A3 (fr) * | 2007-12-21 | 2009-11-03 | Ind Plasma Services & Technolo | Procede et dispositifs de controle d'un flux de vapeur en evaporation sous vide. |
CN102264942B (zh) * | 2008-12-26 | 2014-03-19 | 佳能安内华股份有限公司 | 成膜装置和使用该成膜装置的基板的制造方法 |
BRPI1007300A2 (pt) * | 2009-02-17 | 2019-09-24 | Applied Nanostructured Sols | compósitos compreendendo nanotubos de carbono sobre fibra |
BRPI1008131A2 (pt) * | 2009-02-27 | 2016-03-08 | Applied Nanostructured Sols | "crescimento de nanotubo de carbono de baixa temperatura usando método de preaquecimento de gás". |
US20100224129A1 (en) * | 2009-03-03 | 2010-09-09 | Lockheed Martin Corporation | System and method for surface treatment and barrier coating of fibers for in situ cnt growth |
CN102388172B (zh) * | 2009-04-10 | 2015-02-11 | 应用纳米结构方案公司 | 使用立式加热炉将碳纳米管并入纤维的方法和设备 |
US20100272891A1 (en) * | 2009-04-10 | 2010-10-28 | Lockheed Martin Corporation | Apparatus and method for the production of carbon nanotubes on a continuously moving substrate |
DK2417286T3 (en) * | 2009-04-10 | 2015-08-17 | Applied Nanostructured Solutions Inc | Device and method for producing carbon nanotubes on a substrate that moves continuously |
US20100260998A1 (en) * | 2009-04-10 | 2010-10-14 | Lockheed Martin Corporation | Fiber sizing comprising nanoparticles |
US9111658B2 (en) | 2009-04-24 | 2015-08-18 | Applied Nanostructured Solutions, Llc | CNS-shielded wires |
WO2010124260A1 (en) * | 2009-04-24 | 2010-10-28 | Lockheed Martin Corporation | Cnt-infused emi shielding composite and coating |
KR101696207B1 (ko) * | 2009-04-27 | 2017-01-13 | 어플라이드 나노스트럭처드 솔루션스, 엘엘씨. | 복합 구조물 제빙을 위한 cnt계 저항 가열 |
BRPI1014624A2 (pt) * | 2009-04-30 | 2016-04-05 | Applied Nanostructured Sols | método e sistema para catálise bem próxima para síntese de nanotubos de carbono |
CN102470546B (zh) * | 2009-08-03 | 2014-08-13 | 应用纳米结构方案公司 | 纳米颗粒在复合材料纤维中的结合 |
WO2011054008A2 (en) * | 2009-11-02 | 2011-05-05 | Applied Nanostructured Solutions, Llc | Cnt-infused aramid fiber materials and process therefor |
JP5643835B2 (ja) * | 2009-11-23 | 2014-12-17 | アプライド ナノストラクチャード ソリューションズ リミテッド ライアビリティー カンパニーApplied Nanostructuredsolutions, Llc | Cntを適合された海ベース複合材料構造体 |
BR112012010907A2 (pt) * | 2009-11-23 | 2019-09-24 | Applied Nanostructured Sols | "materiais compósitos de cerâmica contendo materiais de fibra infundidos em nanotubo de carbono e métodos para a produção dos mesmos" |
US20110123735A1 (en) * | 2009-11-23 | 2011-05-26 | Applied Nanostructured Solutions, Llc | Cnt-infused fibers in thermoset matrices |
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EP2531558B1 (en) * | 2010-02-02 | 2018-08-22 | Applied NanoStructured Solutions, LLC | Carbon nanotube-infused fiber materials containing parallel-aligned carbon nanotubes, methods for production thereof, and composite materials derived therefrom |
WO2011109485A1 (en) * | 2010-03-02 | 2011-09-09 | Applied Nanostructured Solutions,Llc | Electrical devices containing carbon nanotube-infused fibers and methods for production thereof |
US8665581B2 (en) | 2010-03-02 | 2014-03-04 | Applied Nanostructured Solutions, Llc | Spiral wound electrical devices containing carbon nanotube-infused electrode materials and methods and apparatuses for production thereof |
US8361229B2 (en) * | 2010-04-22 | 2013-01-29 | Primestar Solar, Inc. | Seal configuration for a system for continuous deposition of a thin film layer on a substrate |
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AU2011305809A1 (en) | 2010-09-22 | 2013-02-28 | Applied Nanostructured Solutions, Llc | Carbon fiber substrates having carbon nanotubes grown thereon and processes for production thereof |
AU2011305751A1 (en) | 2010-09-23 | 2012-06-21 | Applied Nanostructured Solutions, Llc | CNT-infused fiber as a self shielding wire for enhanced power transmission line |
JP5797275B2 (ja) * | 2010-12-13 | 2015-10-21 | ポスコ | 連続コーティング装置 |
US9027609B2 (en) | 2011-05-03 | 2015-05-12 | United Technologies Corporation | Argon gas level controller |
EP2756740B1 (en) * | 2011-09-15 | 2018-04-11 | Cold Plasma Medical Technologies, Inc. | Cold plasma treatment devices and associated methods |
US9085464B2 (en) | 2012-03-07 | 2015-07-21 | Applied Nanostructured Solutions, Llc | Resistance measurement system and method of using the same |
KR20130119107A (ko) * | 2012-04-23 | 2013-10-31 | 삼성에스디아이 주식회사 | 증착장치 |
DE102013109663A1 (de) * | 2013-09-04 | 2015-03-05 | Fhr Anlagenbau Gmbh | Bedampfungseinrichtung zum Beschichten flächenförmiger Substrate |
US10654953B2 (en) | 2016-12-29 | 2020-05-19 | Chevron Phillips Chemical Company Lp | Methods of preparing a catalyst |
US11267914B2 (en) | 2016-12-29 | 2022-03-08 | Chevron Phillips Chemical Company Lp | Methods of preparing a catalyst |
US20200369803A1 (en) | 2016-12-29 | 2020-11-26 | Chevron Phillips Chemical Company Lp | Methods of Preparing a Catalyst |
WO2018217914A1 (en) * | 2017-05-23 | 2018-11-29 | Starfire Industries, Llc | Atmospheric cold plasma jet coating and surface treatment |
CN107938369B (zh) * | 2017-11-06 | 2019-01-01 | 北京梦之墨科技有限公司 | 一种导电织物及其制备方法 |
DE102018215102A1 (de) * | 2018-05-28 | 2019-11-28 | Sms Group Gmbh | Vakuumbeschichtungsanlage, und Verfahren zum Beschichten eines bandförmigen Materials |
DE102021109537A1 (de) | 2021-04-15 | 2022-10-20 | Leibniz-Institut für Oberflächenmodifizierung e.V. | Lichtbogenplasmaquelle mit flüssiger Kathode |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3799862A (en) * | 1971-11-19 | 1974-03-26 | United Aircraft Corp | Apparatus for sputtering |
US4188467A (en) * | 1975-10-31 | 1980-02-12 | A. H. Robins Company, Incorporated | Process for tempering tissue for heparin production |
US4480585A (en) * | 1983-06-23 | 1984-11-06 | Energy Conversion Devices, Inc. | External isolation module |
JPS63199868A (ja) * | 1987-02-13 | 1988-08-18 | Mitsubishi Heavy Ind Ltd | 真空蒸発装置内の溶融金属レベル制御装置 |
US5178743A (en) * | 1989-06-15 | 1993-01-12 | Microelectronics And Computer Technology Corporation | Cylindrical magnetron sputtering system |
JPH03274264A (ja) * | 1990-03-22 | 1991-12-05 | Matsushita Electric Ind Co Ltd | 溶融材料あるいは昇華性材料の重量監視装置及びその重量制御装置 |
US5415757A (en) * | 1991-11-26 | 1995-05-16 | Leybold Aktiengesellschaft | Apparatus for coating a substrate with electrically nonconductive coatings |
BE1008303A3 (fr) * | 1994-06-02 | 1996-04-02 | Cockerill Rech & Dev | Procede et dispositif pour la formation d'un revetement sur un substrat par pulverisation cathodique. |
US6432281B2 (en) * | 1995-12-20 | 2002-08-13 | Recherche Et Developpement Due Groupe Cockerill Sambre | Process for formation of a coating on a substrate |
BE1009838A3 (fr) * | 1995-12-20 | 1997-10-07 | Cockerill Rech & Dev | Procede et dispositif pour la formation d'un revetement sur un substrat. |
PT908924E (pt) * | 1997-10-08 | 2003-09-30 | Cockerill Rech & Dev | Dispositivo para a formacao de um revestimento sobre um substrato por condensacao |
-
2000
- 2000-08-23 EP EP00202942A patent/EP1182272A1/fr not_active Withdrawn
-
2001
- 2001-08-23 CA CA002420243A patent/CA2420243A1/fr not_active Abandoned
- 2001-08-23 EP EP01962497A patent/EP1313889A1/fr not_active Withdrawn
- 2001-08-23 AU AU2001283725A patent/AU2001283725A1/en not_active Abandoned
- 2001-08-23 WO PCT/BE2001/000142 patent/WO2002016664A1/fr active Application Filing
- 2001-08-23 BR BR0113560-0A patent/BR0113560A/pt not_active Application Discontinuation
- 2001-08-23 US US10/362,585 patent/US7156960B2/en not_active Expired - Lifetime
- 2001-08-23 JP JP2002522334A patent/JP2004507617A/ja active Pending
-
2003
- 2003-02-25 ZA ZA200301531A patent/ZA200301531B/en unknown
Also Published As
Publication number | Publication date |
---|---|
US7156960B2 (en) | 2007-01-02 |
EP1182272A1 (fr) | 2002-02-27 |
EP1313889A1 (fr) | 2003-05-28 |
WO2002016664A1 (fr) | 2002-02-28 |
CA2420243A1 (fr) | 2002-02-28 |
JP2004507617A (ja) | 2004-03-11 |
US20040026234A1 (en) | 2004-02-12 |
ZA200301531B (en) | 2004-02-25 |
AU2001283725A1 (en) | 2002-03-04 |
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Legal Events
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B11A | Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing | ||
B11Y | Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette] |