BR0109302A - Aparelho e método de eletrodeposição - Google Patents

Aparelho e método de eletrodeposição

Info

Publication number
BR0109302A
BR0109302A BR0109302-9A BR0109302A BR0109302A BR 0109302 A BR0109302 A BR 0109302A BR 0109302 A BR0109302 A BR 0109302A BR 0109302 A BR0109302 A BR 0109302A
Authority
BR
Brazil
Prior art keywords
electrolyte
substrate
channel
anode
deflector
Prior art date
Application number
BR0109302-9A
Other languages
English (en)
Inventor
John Michael Lowe
Original Assignee
Technology Dev Associate Opera
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technology Dev Associate Opera filed Critical Technology Dev Associate Opera
Publication of BR0109302A publication Critical patent/BR0109302A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

"APARELHO E MéTODO DE ELETRODEPOSIçãO". Um único canal de fornecimento é formado por, e entre, a parede interna (2) e o defletor (3). O eletrólito (5) é bombeado para o interior do canal (1) e é direcionado por sobre o substrato (4) sendo um cátodo mantido a -10 volts. A parte superior da parede interna (2) do canal (1) forma o ânodo de tal modo que o eletrólito é forçado entre o substrato e a superfície horizontal superior do ânodo (6). Um segundo defletor (7) é fornecido de modo a auxiliar no coletamento e na remoção do eletrólito (5) após o impingimento com o substrato (4), possivelmente para reutilização. O contato entre o eletrólito (5) e o substrato (4) é otimizado fornecendo o eletrólito com um movimento de turbilhonamento conforme ele passa pelo canal (1). O ânodo (6) é uma barra condutora sólida (10), alternativamente ele é formado de barras sólidas (11) ou de tubos (12).
BR0109302-9A 2000-03-13 2001-03-13 Aparelho e método de eletrodeposição BR0109302A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0005886.7A GB0005886D0 (en) 2000-03-13 2000-03-13 Elector-plating apparatus and method
PCT/GB2001/001087 WO2001068949A1 (en) 2000-03-13 2001-03-13 Electro-plating apparatus and method

Publications (1)

Publication Number Publication Date
BR0109302A true BR0109302A (pt) 2003-12-30

Family

ID=9887432

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0109302-9A BR0109302A (pt) 2000-03-13 2001-03-13 Aparelho e método de eletrodeposição

Country Status (12)

Country Link
US (1) US6495018B1 (pt)
EP (1) EP1272692A1 (pt)
JP (1) JP2003527488A (pt)
KR (1) KR20030036143A (pt)
CN (1) CN1283847C (pt)
AU (1) AU775148B2 (pt)
BR (1) BR0109302A (pt)
CA (1) CA2403122A1 (pt)
GB (1) GB0005886D0 (pt)
MX (1) MXPA02008975A (pt)
RU (1) RU2244047C2 (pt)
WO (1) WO2001068949A1 (pt)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6793792B2 (en) * 2001-01-12 2004-09-21 Unitive International Limited Curaco Electroplating methods including maintaining a determined electroplating voltage and related systems
US7547623B2 (en) 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps
WO2004001837A2 (en) 2002-06-25 2003-12-31 Unitive International Limited Methods of forming electronic structures including conductive shunt layers and related structures
GB0229057D0 (en) * 2002-12-13 2003-01-15 Technology Dev Associate Opera Electro-plating appratus and method
US20050176270A1 (en) * 2004-02-11 2005-08-11 Daniel Luch Methods and structures for the production of electrically treated items and electrical connections
US20100193367A1 (en) * 2004-02-11 2010-08-05 Daniel Luch Methods and structures for the production of electrically treated items and electrical connections
DE102009023768A1 (de) * 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum Steuern von elektrochemischen Oberflächenprozessen
US8277626B2 (en) * 2010-06-11 2012-10-02 Ppg Industries Ohio, Inc. Method for depositing an electrodepositable coating composition onto a substrate using a plurality of liquid streams
CN108411339B (zh) * 2018-03-15 2019-02-22 北方工业大学 一种测量阴极电流的系统

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3334028A (en) * 1966-08-02 1967-08-01 Day Company Method of electroplating selected areas
FR2156981A5 (pt) * 1971-10-13 1973-06-01 Honeywell Bull
US4304641A (en) * 1980-11-24 1981-12-08 International Business Machines Corporation Rotary electroplating cell with controlled current distribution
JPS5996289A (ja) * 1982-11-26 1984-06-02 Sonitsukusu:Kk 部分メツキ方法及びその装置
JPS63140099A (ja) * 1986-12-01 1988-06-11 Ngk Insulators Ltd めつき処理装置
JPH02101189A (ja) * 1988-10-05 1990-04-12 L Daburu Ii:Kk 精密電気めっき方法及びその装置
JPH04311591A (ja) * 1991-04-08 1992-11-04 Sumitomo Metal Ind Ltd めっき装置及びめっき方法
US5156730A (en) * 1991-06-25 1992-10-20 International Business Machines Electrode array and use thereof
JP3255382B2 (ja) * 1993-08-27 2002-02-12 株式会社秩父富士 スパージャ式メッキ装置
JP2541481B2 (ja) * 1993-10-06 1996-10-09 日本電気株式会社 噴流めっき装置
JPH08100296A (ja) * 1994-09-30 1996-04-16 Shibaura Eng Works Co Ltd メッキ装置
US6159354A (en) * 1997-11-13 2000-12-12 Novellus Systems, Inc. Electric potential shaping method for electroplating

Also Published As

Publication number Publication date
RU2244047C2 (ru) 2005-01-10
AU775148B2 (en) 2004-07-22
KR20030036143A (ko) 2003-05-09
WO2001068949A1 (en) 2001-09-20
CA2403122A1 (en) 2001-09-20
US6495018B1 (en) 2002-12-17
JP2003527488A (ja) 2003-09-16
GB0005886D0 (en) 2000-05-03
CN1426495A (zh) 2003-06-25
EP1272692A1 (en) 2003-01-08
MXPA02008975A (es) 2004-10-15
CN1283847C (zh) 2006-11-08
AU4080501A (en) 2001-09-24

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Legal Events

Date Code Title Description
B25D Requested change of name of applicant approved

Owner name: TDAO LIMITED (GB)

Free format text: ALTERADO DE: TECHNOLOGY DEVELOPMENT ASSOCIATE OPERATIONS LIMITED

B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 7O E 8O ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO DA RPI 2016 DE 25/08/2009.