BR0103203A - Formador de imagem tendo fotodiodos com porta e método para fabricação do mesmo - Google Patents

Formador de imagem tendo fotodiodos com porta e método para fabricação do mesmo

Info

Publication number
BR0103203A
BR0103203A BR0103203-8A BR0103203A BR0103203A BR 0103203 A BR0103203 A BR 0103203A BR 0103203 A BR0103203 A BR 0103203A BR 0103203 A BR0103203 A BR 0103203A
Authority
BR
Brazil
Prior art keywords
photodiode
door
field plate
pixels
side wall
Prior art date
Application number
BR0103203-8A
Other languages
English (en)
Other versions
BRPI0103203B1 (pt
Inventor
Robert Forrest Kwasnick
George Edward Possin
Ching-Yeu Wei
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of BR0103203A publication Critical patent/BR0103203A/pt
Publication of BRPI0103203B1 publication Critical patent/BRPI0103203B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

Patente de Invenção: "FORMADOR DE IMAGEM TENDO FOTODIODOS COM PORTA E MéTODO PARA FABRICAçãO DO MESMO". Formador de imagem de estado sólido é proporcionado, o qual compreende um conjunto de formação de imagem de fotodiodos com porta. O formador de imagem compreende uma pluralidade de pixels de fotossensores dispostos em um conjunto de pixels e cada um dos pixels dos fotossensores inclui um fotodiodo tendo uma parede lateral, a parede lateral tendo uma camada dielétrica de porta disposta sobre ela e uma placa de campo disposta em torno do corpo do fotodiodo. A placa de campo compreende silício amorfo disposto na camada dielétrica de porta e se estende substancial e completamente em torno da parede lateral do referido fotodiodo. A placa de campo é acoplada eletricamente ao eletrodo comum do conjunto de formação de imagem de modo que a placa de campo cria uma campo elétrico em torno do corpo do fotodiodo em correspondência com o potencial do referido eletrodo comum. Um método de fabricação do conjunto de fotodiodo com porta também é proporcionado.
BRPI0103203A 2000-08-03 2001-08-03 formador de imagem tendo fotodiodos com porta e método para fabricação do mesmo BRPI0103203B1 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/632,106 US6724010B1 (en) 2000-08-03 2000-08-03 Solid state imager having gated photodiodes and method for making same

Publications (2)

Publication Number Publication Date
BR0103203A true BR0103203A (pt) 2002-03-26
BRPI0103203B1 BRPI0103203B1 (pt) 2016-12-06

Family

ID=24534101

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0103203A BRPI0103203B1 (pt) 2000-08-03 2001-08-03 formador de imagem tendo fotodiodos com porta e método para fabricação do mesmo

Country Status (6)

Country Link
US (1) US6724010B1 (pt)
EP (1) EP1179852B1 (pt)
JP (1) JP4600964B2 (pt)
BR (1) BRPI0103203B1 (pt)
DE (1) DE60127047T2 (pt)
SG (1) SG90258A1 (pt)

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JP2007528116A (ja) * 2003-05-09 2007-10-04 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ フラットパネルｘ線検出器
US7030032B2 (en) * 2003-05-13 2006-04-18 Raytheon Company Photodiode passivation technique
KR100556349B1 (ko) * 2003-10-28 2006-03-03 엘지.필립스 엘시디 주식회사 액정표시소자용 어레이 기판의 제조방법
US6982176B2 (en) 2003-10-30 2006-01-03 General Electric Company Method for monitoring production of pixel detectors and detectors produced thereby
US7259377B2 (en) * 2005-12-15 2007-08-21 General Electric Company Diode design to reduce the effects of radiation damage
US7208742B1 (en) * 2005-12-15 2007-04-24 General Electric Company X-ray detector with radiation hard photodiode design
JP2008244251A (ja) * 2007-03-28 2008-10-09 Toshiba Corp アモルファスシリコンフォトダイオード及びその製造方法ならびにｘ線撮像装置
TWI355106B (en) * 2007-05-07 2011-12-21 Chunghwa Picture Tubes Ltd Organic photodetector and fabricating method of or
US20090108385A1 (en) * 2007-10-29 2009-04-30 Micron Technology, Inc. Method and apparatus for improving crosstalk and sensitivity in an imager
US7897929B2 (en) * 2007-12-06 2011-03-01 General Electric Company Reduced cost pixel design for flat panel x-ray imager
JP5461719B2 (ja) * 2008-01-29 2014-04-02 富士フイルム株式会社 電磁波検出素子
JP5185013B2 (ja) * 2008-01-29 2013-04-17 富士フイルム株式会社 電磁波検出素子
US7902512B1 (en) * 2009-12-04 2011-03-08 Carestream Health, Inc. Coplanar high fill factor pixel architecture
US10396229B2 (en) * 2011-05-09 2019-08-27 International Business Machines Corporation Solar cell with interdigitated back contacts formed from high and low work-function-tuned silicides of the same metal
KR20150034947A (ko) * 2013-09-27 2015-04-06 삼성디스플레이 주식회사 표시 장치의 금속 배선, 박막 트랜지스터 기판 및 박막 트랜지스터 기판의 제조 방법
US9461072B2 (en) * 2013-12-25 2016-10-04 Shenzhen China Star Optoelectronics Technology Co., Ltd. Liquid crystal display array substrates and a method for manufacturing the same
CN106935601B (zh) * 2017-03-13 2019-08-23 京东方科技集团股份有限公司 半导体器件、阵列基板和半导体器件的制造方法
CN109166943B (zh) * 2018-09-19 2021-01-26 京东方科技集团股份有限公司 探测基板及其制造方法、探测器

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US4327291A (en) * 1980-06-16 1982-04-27 Texas Instruments Incorporated Infrared charge injection device imaging system
US4729005A (en) 1985-04-29 1988-03-01 General Electric Company Method and apparatus for improved metal-insulator-semiconductor device operation
US4751560A (en) * 1986-02-24 1988-06-14 Santa Barbara Research Center Infrared photodiode array
US4857979A (en) * 1988-06-20 1989-08-15 Ford Aerospace & Communications Corporation Platinum silicide imager
JP2830177B2 (ja) * 1989-10-04 1998-12-02 富士ゼロックス株式会社 画像読取装置
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US5399884A (en) 1993-11-10 1995-03-21 General Electric Company Radiation imager with single passivation dielectric for transistor and diode
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US5663577A (en) 1996-03-01 1997-09-02 General Electric Company Solid state imager array with address line spacer structure
US5777355A (en) * 1996-12-23 1998-07-07 General Electric Company Radiation imager with discontinuous dielectric
WO1998032173A1 (en) * 1997-01-17 1998-07-23 General Electric Company Corrosion resistant imager
JP4011734B2 (ja) * 1998-06-02 2007-11-21 キヤノン株式会社 ２次元光センサ、それを用いた放射線検出装置及び放射線診断システム
US6326649B1 (en) * 1999-01-13 2001-12-04 Agere Systems, Inc. Pin photodiode having a wide bandwidth
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US6300648B1 (en) * 1999-12-28 2001-10-09 Xerox Corporation Continuous amorphous silicon layer sensors using sealed metal back contact

Also Published As

Publication number Publication date
JP2002118790A (ja) 2002-04-19
SG90258A1 (en) 2002-07-23
EP1179852B1 (en) 2007-03-07
JP4600964B2 (ja) 2010-12-22
BRPI0103203B1 (pt) 2016-12-06
EP1179852A3 (en) 2003-08-20
EP1179852A2 (en) 2002-02-13
DE60127047T2 (de) 2007-12-13
DE60127047D1 (de) 2007-04-19
US6724010B1 (en) 2004-04-20

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Legal Events

Date Code Title Description
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 06/12/2016, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 20A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2631 DE 08-06-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.