DE60127047D1 - Capteur d'image à l'etat solide comprenant des photodiodes commandees par porte et methode de fabrication - Google Patents

Capteur d'image à l'etat solide comprenant des photodiodes commandees par porte et methode de fabrication

Info

Publication number
DE60127047D1
DE60127047D1 DE60127047T DE60127047T DE60127047D1 DE 60127047 D1 DE60127047 D1 DE 60127047D1 DE 60127047 T DE60127047 T DE 60127047T DE 60127047 T DE60127047 T DE 60127047T DE 60127047 D1 DE60127047 D1 DE 60127047D1
Authority
DE
Germany
Prior art keywords
commandees
etat
capteur
methode
porte
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60127047T
Other languages
English (en)
Other versions
DE60127047T2 (de
Inventor
Robert Forrest Kwasnick
George Edward Possin
Ching-Yeu Wei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Application granted granted Critical
Publication of DE60127047D1 publication Critical patent/DE60127047D1/de
Publication of DE60127047T2 publication Critical patent/DE60127047T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
DE60127047T 2000-08-03 2001-07-26 Festkörper-Bildsensor mit Gate-gesteuerten Photodioden und Verfahren zur Herstellung Expired - Lifetime DE60127047T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US632106 2000-08-03
US09/632,106 US6724010B1 (en) 2000-08-03 2000-08-03 Solid state imager having gated photodiodes and method for making same

Publications (2)

Publication Number Publication Date
DE60127047D1 true DE60127047D1 (de) 2007-04-19
DE60127047T2 DE60127047T2 (de) 2007-12-13

Family

ID=24534101

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60127047T Expired - Lifetime DE60127047T2 (de) 2000-08-03 2001-07-26 Festkörper-Bildsensor mit Gate-gesteuerten Photodioden und Verfahren zur Herstellung

Country Status (6)

Country Link
US (1) US6724010B1 (de)
EP (1) EP1179852B1 (de)
JP (1) JP4600964B2 (de)
BR (1) BRPI0103203B1 (de)
DE (1) DE60127047T2 (de)
SG (1) SG90258A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070053493A1 (en) * 2003-05-09 2007-03-08 Koninklijke Philips Electronics N.V. Flat panel x-ray detector
US7030032B2 (en) * 2003-05-13 2006-04-18 Raytheon Company Photodiode passivation technique
KR100556349B1 (ko) * 2003-10-28 2006-03-03 엘지.필립스 엘시디 주식회사 액정표시소자용 어레이 기판의 제조방법
US6982176B2 (en) 2003-10-30 2006-01-03 General Electric Company Method for monitoring production of pixel detectors and detectors produced thereby
US7259377B2 (en) * 2005-12-15 2007-08-21 General Electric Company Diode design to reduce the effects of radiation damage
US7208742B1 (en) * 2005-12-15 2007-04-24 General Electric Company X-ray detector with radiation hard photodiode design
JP2008244251A (ja) * 2007-03-28 2008-10-09 Toshiba Corp アモルファスシリコンフォトダイオード及びその製造方法ならびにｘ線撮像装置
TWI355106B (en) * 2007-05-07 2011-12-21 Chunghwa Picture Tubes Ltd Organic photodetector and fabricating method of or
US20090108385A1 (en) * 2007-10-29 2009-04-30 Micron Technology, Inc. Method and apparatus for improving crosstalk and sensitivity in an imager
US7897929B2 (en) * 2007-12-06 2011-03-01 General Electric Company Reduced cost pixel design for flat panel x-ray imager
JP5461719B2 (ja) * 2008-01-29 2014-04-02 富士フイルム株式会社 電磁波検出素子
JP5185013B2 (ja) * 2008-01-29 2013-04-17 富士フイルム株式会社 電磁波検出素子
US7902512B1 (en) * 2009-12-04 2011-03-08 Carestream Health, Inc. Coplanar high fill factor pixel architecture
US10396229B2 (en) * 2011-05-09 2019-08-27 International Business Machines Corporation Solar cell with interdigitated back contacts formed from high and low work-function-tuned silicides of the same metal
KR20150034947A (ko) * 2013-09-27 2015-04-06 삼성디스플레이 주식회사 표시 장치의 금속 배선, 박막 트랜지스터 기판 및 박막 트랜지스터 기판의 제조 방법
US9461072B2 (en) * 2013-12-25 2016-10-04 Shenzhen China Star Optoelectronics Technology Co., Ltd. Liquid crystal display array substrates and a method for manufacturing the same
CN106935601B (zh) * 2017-03-13 2019-08-23 京东方科技集团股份有限公司 半导体器件、阵列基板和半导体器件的制造方法
CN109166943B (zh) * 2018-09-19 2021-01-26 京东方科技集团股份有限公司 探测基板及其制造方法、探测器

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4327291A (en) * 1980-06-16 1982-04-27 Texas Instruments Incorporated Infrared charge injection device imaging system
US4729005A (en) 1985-04-29 1988-03-01 General Electric Company Method and apparatus for improved metal-insulator-semiconductor device operation
US4751560A (en) * 1986-02-24 1988-06-14 Santa Barbara Research Center Infrared photodiode array
US4857979A (en) * 1988-06-20 1989-08-15 Ford Aerospace & Communications Corporation Platinum silicide imager
JP2830177B2 (ja) * 1989-10-04 1998-12-02 富士ゼロックス株式会社 画像読取装置
JPH03212975A (ja) * 1990-01-17 1991-09-18 Fuji Xerox Co Ltd イメージセンサ
JPH04154167A (ja) * 1990-10-18 1992-05-27 Fuji Xerox Co Ltd 半導体装置
JPH06314813A (ja) * 1993-03-04 1994-11-08 Sumitomo Electric Ind Ltd ｐｉｎ型受光素子、その製造方法及び光電子集積回路
US5399884A (en) 1993-11-10 1995-03-21 General Electric Company Radiation imager with single passivation dielectric for transistor and diode
US5435608A (en) 1994-06-17 1995-07-25 General Electric Company Radiation imager with common passivation dielectric for gate electrode and photosensor
US5663577A (en) 1996-03-01 1997-09-02 General Electric Company Solid state imager array with address line spacer structure
US5777355A (en) * 1996-12-23 1998-07-07 General Electric Company Radiation imager with discontinuous dielectric
DE69832761T2 (de) * 1997-01-17 2006-11-02 General Electric Co. Korrosionsbeständige bildaufnahmevorrichtung
JP4011734B2 (ja) * 1998-06-02 2007-11-21 キヤノン株式会社 ２次元光センサ、それを用いた放射線検出装置及び放射線診断システム
US6326649B1 (en) * 1999-01-13 2001-12-04 Agere Systems, Inc. Pin photodiode having a wide bandwidth
US6384461B1 (en) * 1999-10-15 2002-05-07 Xerox Corporation Dual dielectric structure for suppressing lateral leakage current in high fill factor arrays
US6300648B1 (en) * 1999-12-28 2001-10-09 Xerox Corporation Continuous amorphous silicon layer sensors using sealed metal back contact

Also Published As

Publication number Publication date
DE60127047T2 (de) 2007-12-13
EP1179852A3 (de) 2003-08-20
EP1179852B1 (de) 2007-03-07
JP4600964B2 (ja) 2010-12-22
JP2002118790A (ja) 2002-04-19
BR0103203A (pt) 2002-03-26
BRPI0103203B1 (pt) 2016-12-06
SG90258A1 (en) 2002-07-23
US6724010B1 (en) 2004-04-20
EP1179852A2 (de) 2002-02-13

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