BE800673A - Procede de formation d'une epaisseur de couche de soudure predeterminee lors de la fabrication d'elements de montage semi-conducteurs - Google Patents

Procede de formation d'une epaisseur de couche de soudure predeterminee lors de la fabrication d'elements de montage semi-conducteurs

Info

Publication number
BE800673A
BE800673A BE132058A BE132058A BE800673A BE 800673 A BE800673 A BE 800673A BE 132058 A BE132058 A BE 132058A BE 132058 A BE132058 A BE 132058A BE 800673 A BE800673 A BE 800673A
Authority
BE
Belgium
Prior art keywords
manufacturing
forming
layer thickness
mounting elements
semiconductor mounting
Prior art date
Application number
BE132058A
Other languages
English (en)
French (fr)
Original Assignee
Licentia Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Gmbh filed Critical Licentia Gmbh
Publication of BE800673A publication Critical patent/BE800673A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
BE132058A 1972-06-13 1973-06-08 Procede de formation d'une epaisseur de couche de soudure predeterminee lors de la fabrication d'elements de montage semi-conducteurs BE800673A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2228703A DE2228703A1 (de) 1972-06-13 1972-06-13 Verfahren zum herstellen einer vorgegebenen lotschichtstaerke bei der fertigung von halbleiterbauelementen

Publications (1)

Publication Number Publication Date
BE800673A true BE800673A (fr) 1973-10-01

Family

ID=5847611

Family Applications (1)

Application Number Title Priority Date Filing Date
BE132058A BE800673A (fr) 1972-06-13 1973-06-08 Procede de formation d'une epaisseur de couche de soudure predeterminee lors de la fabrication d'elements de montage semi-conducteurs

Country Status (7)

Country Link
US (1) US3900153A (ko)
JP (1) JPS4951872A (ko)
BE (1) BE800673A (ko)
DE (1) DE2228703A1 (ko)
FR (1) FR2188307B1 (ko)
GB (1) GB1440196A (ko)
IT (1) IT989087B (ko)

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Publication number Publication date
DE2228703B2 (ko) 1974-11-28
DE2228703A1 (de) 1974-01-10
FR2188307A1 (ko) 1974-01-18
US3900153A (en) 1975-08-19
FR2188307B1 (ko) 1978-02-10
GB1440196A (en) 1976-06-23
IT989087B (it) 1975-05-20
JPS4951872A (ko) 1974-05-20

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