ATE48103T1 - Weichlotzusammensetzung. - Google Patents

Weichlotzusammensetzung.

Info

Publication number
ATE48103T1
ATE48103T1 AT85303347T AT85303347T ATE48103T1 AT E48103 T1 ATE48103 T1 AT E48103T1 AT 85303347 T AT85303347 T AT 85303347T AT 85303347 T AT85303347 T AT 85303347T AT E48103 T1 ATE48103 T1 AT E48103T1
Authority
AT
Austria
Prior art keywords
solder
molten
solder paste
solder composition
paste
Prior art date
Application number
AT85303347T
Other languages
English (en)
Inventor
Gabe Cherian
Original Assignee
Raychem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raychem Corp filed Critical Raychem Corp
Application granted granted Critical
Publication of ATE48103T1 publication Critical patent/ATE48103T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3485—Application of solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0215—Metallic fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AT85303347T 1984-05-14 1985-05-13 Weichlotzusammensetzung. ATE48103T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US61007884A 1984-05-14 1984-05-14
EP85303347A EP0164906B1 (de) 1984-05-14 1985-05-13 Weichlotzusammensetzung

Publications (1)

Publication Number Publication Date
ATE48103T1 true ATE48103T1 (de) 1989-12-15

Family

ID=24443547

Family Applications (1)

Application Number Title Priority Date Filing Date
AT85303347T ATE48103T1 (de) 1984-05-14 1985-05-13 Weichlotzusammensetzung.

Country Status (5)

Country Link
EP (1) EP0164906B1 (de)
JP (1) JPS60255299A (de)
AT (1) ATE48103T1 (de)
CA (1) CA1271397A (de)
DE (1) DE3574351D1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE68904214T2 (de) * 1988-03-04 1993-05-19 Toshiba Kawasaki Kk Hartloetpaste zum verbinden von metalle und keramische materialien.
FR2706139B1 (fr) * 1993-06-08 1995-07-21 Thomson Csf Matériau pour brasure.
US5382300A (en) * 1994-03-22 1995-01-17 At&T Corp. Solder paste mixture
US5803340A (en) * 1995-09-29 1998-09-08 Delco Electronics Corporation Composite solder paste for flip chip bumping
US5928404A (en) * 1997-03-28 1999-07-27 Ford Motor Company Electrical solder and method of manufacturing
KR100376253B1 (ko) * 1997-06-04 2003-03-15 이비덴 가부시키가이샤 인쇄 배선판용 솔더 부재
FR2799337B1 (fr) * 1999-10-05 2002-01-11 St Microelectronics Sa Procede de realisation de connexions electriques sur la surface d'un boitier semi-conducteur a gouttes de connexion electrique
DE19947914A1 (de) * 1999-10-06 2001-04-12 Abb Research Ltd Verfahren zum Weichlöten von Komponenten und weichgelötete Anordnung
EP1321214A1 (de) * 2001-12-21 2003-06-25 Siemens Aktiengesellschaft Werkstück mit einer nach aussen durch eine Lötfolie verschlossenen Ausnehmung und Verfahren zum Verschliessen einer Ausnehmung mit einer Lötfolie
DE10204960A1 (de) * 2002-02-06 2003-08-14 Endress & Hauser Gmbh & Co Kg Lot- und Lotverbindung
DE102007053277A1 (de) * 2007-11-08 2009-05-14 Robert Bosch Gmbh Verfahren zur Erhöhung der Viskosität einer Schmelze aus einer Metall-Legierung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2228703A1 (de) * 1972-06-13 1974-01-10 Licentia Gmbh Verfahren zum herstellen einer vorgegebenen lotschichtstaerke bei der fertigung von halbleiterbauelementen
US3915729A (en) * 1974-04-09 1975-10-28 Du Pont High temperature solder pastes
GB1590695A (en) * 1977-08-08 1981-06-10 Fusion Inc Method of brazing
GB2103980B (en) * 1981-08-18 1986-01-22 Standard Telephones Cables Ltd Soldering components to a substrate
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device

Also Published As

Publication number Publication date
DE3574351D1 (en) 1989-12-28
CA1271397A (en) 1990-07-10
EP0164906A1 (de) 1985-12-18
EP0164906B1 (de) 1989-11-23
JPS60255299A (ja) 1985-12-16

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties