JPS4951872A - - Google Patents

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Publication number
JPS4951872A
JPS4951872A JP48065979A JP6597973A JPS4951872A JP S4951872 A JPS4951872 A JP S4951872A JP 48065979 A JP48065979 A JP 48065979A JP 6597973 A JP6597973 A JP 6597973A JP S4951872 A JPS4951872 A JP S4951872A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48065979A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4951872A publication Critical patent/JPS4951872A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
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    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP48065979A 1972-06-13 1973-06-13 Pending JPS4951872A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2228703A DE2228703A1 (de) 1972-06-13 1972-06-13 Verfahren zum herstellen einer vorgegebenen lotschichtstaerke bei der fertigung von halbleiterbauelementen

Publications (1)

Publication Number Publication Date
JPS4951872A true JPS4951872A (ja) 1974-05-20

Family

ID=5847611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48065979A Pending JPS4951872A (ja) 1972-06-13 1973-06-13

Country Status (7)

Country Link
US (1) US3900153A (ja)
JP (1) JPS4951872A (ja)
BE (1) BE800673A (ja)
DE (1) DE2228703A1 (ja)
FR (1) FR2188307B1 (ja)
GB (1) GB1440196A (ja)
IT (1) IT989087B (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5318959U (ja) * 1976-07-28 1978-02-17
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JPS5318959U (ja) * 1976-07-28 1978-02-17
JPS53124647U (ja) * 1977-03-14 1978-10-04
JPS575879Y2 (ja) * 1977-03-14 1982-02-03
JPH02207539A (ja) * 1989-02-07 1990-08-17 Sanken Electric Co Ltd 半導体装置
JP2000507160A (ja) * 1996-03-22 2000-06-13 エミテツク ゲゼルシヤフト フユア エミツシオンステクノロギー ミツト ベシユレンクテル ハフツング ろう付け隙間内にスペーサを備えたろう付け金属ハニカム体とそのろう付け方法とそれに利用するろう

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Publication number Publication date
FR2188307A1 (ja) 1974-01-18
BE800673A (fr) 1973-10-01
GB1440196A (en) 1976-06-23
DE2228703B2 (ja) 1974-11-28
IT989087B (it) 1975-05-20
US3900153A (en) 1975-08-19
FR2188307B1 (ja) 1978-02-10
DE2228703A1 (de) 1974-01-10

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