BE771548A - Surfaces de connexion pour la soudure de composants a semi-conducteurs - Google Patents

Surfaces de connexion pour la soudure de composants a semi-conducteurs

Info

Publication number
BE771548A
BE771548A BE771548A BE771548A BE771548A BE 771548 A BE771548 A BE 771548A BE 771548 A BE771548 A BE 771548A BE 771548 A BE771548 A BE 771548A BE 771548 A BE771548 A BE 771548A
Authority
BE
Belgium
Prior art keywords
semiconductor components
connection surfaces
welding semiconductor
welding
connection
Prior art date
Application number
BE771548A
Other languages
English (en)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of BE771548A publication Critical patent/BE771548A/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/1301—Shape
    • H01L2224/13012—Shape in top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01021—Scandium [Sc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/042—Remote solder depot on the PCB, the solder flowing to the connections from this depot
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
BE771548A 1970-09-08 1971-08-19 Surfaces de connexion pour la soudure de composants a semi-conducteurs BE771548A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702044494 DE2044494B2 (de) 1970-09-08 1970-09-08 Anschlussflaechen zum anloeten von halbleiterbausteinen in flip chip technik

Publications (1)

Publication Number Publication Date
BE771548A true BE771548A (fr) 1971-12-31

Family

ID=5781911

Family Applications (1)

Application Number Title Priority Date Filing Date
BE771548A BE771548A (fr) 1970-09-08 1971-08-19 Surfaces de connexion pour la soudure de composants a semi-conducteurs

Country Status (8)

Country Link
US (1) US3770874A (fr)
JP (1) JPS5517488B1 (fr)
BE (1) BE771548A (fr)
DE (1) DE2044494B2 (fr)
FR (1) FR2107213A5 (fr)
GB (1) GB1324733A (fr)
LU (1) LU63868A1 (fr)
NL (1) NL7112323A (fr)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4164778A (en) * 1976-07-20 1979-08-14 Matsushita Electric Industrial Co., Ltd. Printed circuit board
US4110838A (en) * 1976-07-30 1978-08-29 Texas Instruments Incorporated Magnetic bubble memory package
US4132341A (en) * 1977-01-31 1979-01-02 Zenith Radio Corporation Hybrid circuit connector assembly
JPS54121970A (en) * 1978-03-14 1979-09-21 Citizen Watch Co Ltd Package construction of semiiconductor device
US4466184A (en) * 1981-04-21 1984-08-21 General Dynamics, Pomona Division Method of making pressure point contact system
US4447857A (en) * 1981-12-09 1984-05-08 International Business Machines Corporation Substrate with multiple type connections
EP0110382A3 (fr) * 1982-12-01 1987-01-07 Asahi Glass Company Ltd. Dispositif d'affichage et procédé pour sa réalisation et décalcomanie pour former un terminal de tableau d'affichage
GB2137807B (en) * 1983-04-05 1987-08-12 Plessey Co Plc A semiconductor component and method of manufacture
US4926548A (en) * 1984-10-17 1990-05-22 Amp Incorporated Select solder slot termination method
US4783722A (en) * 1985-07-16 1988-11-08 Nippon Telegraph And Telephone Corporation Interboard connection terminal and method of manufacturing the same
US4645285A (en) * 1985-08-26 1987-02-24 Amp Incorporated Sealed insulation displacement connector
JPH0714105B2 (ja) * 1986-05-19 1995-02-15 日本電装株式会社 混成集積回路基板及びその製造方法
US4837928A (en) * 1986-10-17 1989-06-13 Cominco Ltd. Method of producing a jumper chip for semiconductor devices
US4851966A (en) * 1986-11-10 1989-07-25 Motorola, Inc. Method and apparatus of printed circuit board assembly with optimal placement of components
US5015206A (en) * 1990-04-05 1991-05-14 Die Tech, Inc. Solder terminal
US5425647A (en) * 1992-04-29 1995-06-20 Alliedsignal Inc. Split conductive pad for mounting components to a circuit board
DE4225138A1 (de) * 1992-07-30 1994-02-03 Daimler Benz Ag Multichipmodul und Verfahren zu dessen Herstellung
KR940023325A (ko) * 1993-03-11 1994-10-22 토모마쯔 켕고 땜납층을 프리코팅해서 사용되는 회로기판 및 땜납층이 프리코팅된 회로기판
US5613181A (en) * 1994-12-21 1997-03-18 International Business Machines Corporation Co-sintered surface metallization for pin-join, wire-bond and chip attach
US6388203B1 (en) 1995-04-04 2002-05-14 Unitive International Limited Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby
AU5316996A (en) 1995-04-05 1996-10-23 Mcnc A solder bump structure for a microelectronic substrate
EP0804817A1 (fr) * 1995-11-20 1997-11-05 Koninklijke Philips Electronics N.V. Fil metallique electriquement conducteur
US5793116A (en) * 1996-05-29 1998-08-11 Mcnc Microelectronic packaging using arched solder columns
EP0899787A3 (fr) * 1997-07-25 2001-05-16 Mcnc Réservoirs de soudure formés-contrôlés pour augmenter le volume de bosses de soudure et dtructures ainsi formées
US5990472A (en) * 1997-09-29 1999-11-23 Mcnc Microelectronic radiation detectors for detecting and emitting radiation signals
JP3681542B2 (ja) * 1998-07-01 2005-08-10 富士通株式会社 プリント回路基板および多段バンプ用中継基板
US6259608B1 (en) * 1999-04-05 2001-07-10 Delphi Technologies, Inc. Conductor pattern for surface mount devices and method therefor
JP3759344B2 (ja) * 1999-08-02 2006-03-22 アルプス電気株式会社 磁気ヘッド及び磁気ヘッドの製造方法
KR20010017187A (ko) * 1999-08-09 2001-03-05 윤종용 인쇄 회로 기판 및 이 인쇄 회로 기판의 스크린 프린팅을 위한마스크
EP1332654B1 (fr) 2000-11-10 2005-01-12 Unitive Electronics, Inc. Methodes de positionnement de composants au moyen d'elements d'entrainement a liquides et structures correspondantes
US6863209B2 (en) 2000-12-15 2005-03-08 Unitivie International Limited Low temperature methods of bonding components
DE10111389A1 (de) 2001-03-09 2002-09-12 Heidenhain Gmbh Dr Johannes Verbund aus flächigen Leiterelementen
JP2002290021A (ja) * 2001-03-23 2002-10-04 Toshiba Corp 回路基板、回路基板モジュール、及び電子機器
US6960828B2 (en) 2002-06-25 2005-11-01 Unitive International Limited Electronic structures including conductive shunt layers
US7531898B2 (en) 2002-06-25 2009-05-12 Unitive International Limited Non-Circular via holes for bumping pads and related structures
US7547623B2 (en) 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps
AU2003301632A1 (en) 2002-10-22 2004-05-13 Unitive International Limited Stacked electronic structures including offset substrates
TWI225899B (en) 2003-02-18 2005-01-01 Unitive Semiconductor Taiwan C Etching solution and method for manufacturing conductive bump using the etching solution to selectively remove barrier layer
US7049216B2 (en) 2003-10-14 2006-05-23 Unitive International Limited Methods of providing solder structures for out plane connections
US7358174B2 (en) 2004-04-13 2008-04-15 Amkor Technology, Inc. Methods of forming solder bumps on exposed metal pads
US7932615B2 (en) 2006-02-08 2011-04-26 Amkor Technology, Inc. Electronic devices including solder bumps on compliant dielectric layers
US7674701B2 (en) 2006-02-08 2010-03-09 Amkor Technology, Inc. Methods of forming metal layers using multi-layer lift-off patterns
CN101296559A (zh) * 2007-04-29 2008-10-29 佛山普立华科技有限公司 焊盘、具有该焊盘的电路板及电子装置
FR2924302B1 (fr) * 2007-11-23 2010-10-22 St Microelectronics Grenoble Procede de fabrication de plots de connexion electrique d'une plaque
JP5307471B2 (ja) * 2008-08-11 2013-10-02 ルネサスエレクトロニクス株式会社 基板の製造方法、基板、基板を備えた装置、判別方法、半導体装置の製造方法
CN102142411B (zh) * 2010-02-01 2012-12-12 华为终端有限公司 一种印刷电路组装板芯片封装部件以及焊接部件
KR101185859B1 (ko) * 2010-10-19 2012-09-25 에스케이하이닉스 주식회사 반도체 패키지용 범프, 상기 범프를 갖는 반도체 패키지 및 적층 반도체 패키지
KR101774938B1 (ko) 2011-08-31 2017-09-06 삼성전자 주식회사 지지대를 갖는 반도체 패키지 및 그 형성 방법
US8952529B2 (en) * 2011-11-22 2015-02-10 Stats Chippac, Ltd. Semiconductor device with conductive layer over substrate with vents to channel bump material and reduce interconnect voids
US9466925B2 (en) 2013-01-18 2016-10-11 Molex, Llc Paddle card assembly for high speed applications
US9049787B2 (en) * 2013-01-18 2015-06-02 Molex Incorporated Paddle card with improved performance
DE102014110473A1 (de) * 2014-07-24 2016-01-28 Osram Opto Semiconductors Gmbh Träger für ein elektrisches Bauelement
US9373915B1 (en) 2015-03-04 2016-06-21 Molex, Llc Ground shield for circuit board terminations
US9466590B1 (en) * 2015-11-13 2016-10-11 International Business Machines Corporation Optimized solder pads for microelectronic components
US9543736B1 (en) * 2015-11-20 2017-01-10 International Business Machines Corporation Optimized solder pads for solder induced alignment of opto-electronic chips
KR102315634B1 (ko) * 2016-01-13 2021-10-22 삼원액트 주식회사 회로 기판
US10756037B2 (en) * 2018-05-15 2020-08-25 Taiwan Semiconductor Manufacturing Co., Ltd. Package structure and fabricating method thereof
JP2021190193A (ja) * 2020-05-26 2021-12-13 富士通株式会社 バスバーの接続構造

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3059152A (en) * 1959-02-05 1962-10-16 Globe Union Inc Plug-in electronic circuit units and mounting panels
DE1185662B (de) * 1961-12-01 1965-01-21 Siemens Ag Loetoesenleiste
NL303035A (fr) * 1963-02-06 1900-01-01
US3303393A (en) * 1963-12-27 1967-02-07 Ibm Terminals for microminiaturized devices and methods of connecting same to circuit panels
DE1627762B2 (de) * 1966-09-17 1972-11-23 Nippon Electric Co. Ltd., Tokio Verfahren zur Herstellung einer Halbleitervorrichtung

Also Published As

Publication number Publication date
GB1324733A (en) 1973-07-25
DE2044494A1 (fr) 1972-01-13
JPS5517488B1 (fr) 1980-05-12
NL7112323A (fr) 1972-03-10
US3770874A (en) 1973-11-06
FR2107213A5 (fr) 1972-05-05
DE2044494B2 (de) 1972-01-13
LU63868A1 (fr) 1972-01-13

Similar Documents

Publication Publication Date Title
BE771548A (fr) Surfaces de connexion pour la soudure de composants a semi-conducteurs
BE761668A (fr) Structure de contact perfectionnee pour semi-conducteurs
BE763200A (fr) Raccord pour tubes
BE770943A (fr) Circuits oscillateurs combinateurs de puissances pour hyperfrequences
BE764282R (fr) Pare-brise pour
OA03918A (fr) Raccord pour canalisations.
BE753375A (fr) Structure de circuit integre pour transistors a emetteur commun
BE748847A (fr) Couvre-joint pour joint de dilatation
BE755816A (fr) Valve pour double circuit de freinage
BE765835A (fr) Joint pour tuyaux
BE764427A (fr) Structure de connexion pour dispositif semi-conducteur
BE796411A (fr) Montage pour posemetre
BE774653R (fr) Pare-brise pour
BE799044A (fr) Dispositifs de connexion pour pieces metalliques,
DE2004750B2 (de) Ultraschallschweisseinrichtung
BE767456A (fr) Circuit de securite pour fluide
BR7102642D0 (pt) Pacote de passar atraves
BE767269A (fr) Connexion de convertisseur
BE753776A (fr) Soudure en forme pour sceller des tubes thermoplastiques
CH538023A (de) Abdichtung für Bewegungsfugen
BE763202A (fr) Raccord pour tubes
BE763071A (fr) Mecanisme permuteur de pieces pour machine-outil
BE801229A (fr) Procede pour l'execution de composants a semi-conducteurs
FR1504680A (fr) Joint en forme de coupelle
BE773497A (fr) Outils pour machine