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1972-09-13 |
1975-04-08 |
John B Snell |
Epoxy compositions
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1975-11-03 |
1978-10-03 |
General Electric Company |
Novel polyetheramide-imide epoxy resin blends
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1978-04-10 |
1979-02-27 |
Cincinnati Milacron Inc. |
Epoxy resin compositions containing an amine-cyanic acid ester combination curing agent
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JPS5610529A
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1979-07-09 |
1981-02-03 |
Mitsubishi Gas Chem Co Inc |
Curable resin composition
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JPS5611924A
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1979-07-12 |
1981-02-05 |
Mitsubishi Gas Chem Co Inc |
Curable resin composition
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JPS5626911A
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1979-08-08 |
1981-03-16 |
Mitsubishi Gas Chem Co Inc |
Curable resin composition
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JPS5626950A
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1979-08-08 |
1981-03-16 |
Mitsubishi Gas Chem Co Inc |
Curable resin composition
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JPS5626951A
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1979-08-08 |
1981-03-16 |
Mitsubishi Gas Chem Co Inc |
Curable resin composition
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JPS5690823A
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1979-12-24 |
1981-07-23 |
Mitsubishi Gas Chem Co Inc |
Curable resin composition
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JPS5690824A
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1979-12-24 |
1981-07-23 |
Mitsubishi Gas Chem Co Inc |
Curable resin composition
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JPS5698221A
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1980-01-07 |
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Mitsubishi Gas Chem Co Inc |
Curable resin composition
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JPS56125449A
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1980-01-29 |
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Curable resin composition
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JPS56110760A
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1980-02-06 |
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Curable resin composition
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Photosetting resin composition
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Mitsubishi Gas Chemical Co., Inc., Tokyo |
Härtbare Harzmasse
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Mitsubishi Gas Chemical Co., Inc., Tokio/Tokyo |
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1983-08-02 |
Mitsubishi Gas Chemical Company, Inc. |
Curable resin composition
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三菱瓦斯化学株式会社 |
プラスチツク物品
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Mitsubishi Gas Chemical Company, Inc. |
Process for producing a curable resin from cyanate ester compound and unsaturated 1,2-epoxy compound
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Mitsubishi Gas Chem Co Inc |
硬化性樹脂の製造法
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Novel polyaromatic cyanates
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Thermoset composition comprising aromatic cyanate ester, allyl ethers of bisphenol and bismaleimide
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1987-04-27 |
1992-12-08 |
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Thermosetting resin composition
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1989-07-07 |
1991-09-03 |
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Toughened, high temperature resin matrix system
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1991-04-15 |
1995-01-31 |
Mitsubishi Gas Chemical Company, Inc. |
Thermal resistance resin dust for friction material
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Multifunctional cyanate ester and epoxy blends
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Materials for semiconductor device assemblies
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Cyanate ester composition and cured product thereof
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2001-12-05 |
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Prepreg und zusammensetzung von epoxidharz(en), sma-copolymer(e) und bismaleimid-triazin-harz(e)
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Mitsubishi Gas Chemical Company, Inc. |
Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate
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Mitsubishi Gas Chemical Co Inc |
シアン酸エステル化合物、およびその硬化物
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2018-11-28 |
Mitsubishi Gas Chemical Company, Inc. |
Resin composite electrolytic copper foil, copper-clad laminate, and printed wiring board
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Guangdong Shengyi Sci. Tech Co., Ltd |
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Mitsubishi Gas Chemical Company, Inc. |
Resin composition, prepreg, and laminate
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